公开(公告)号：US20160067728A1

公开(公告)日：2016-03-10

申请号：US14944238

申请日：2015-11-18

Applicant: Genesis Photonics Inc.

Inventor： Tai-Cheng Tsai ,  Gwo-Jiun Sheu ,  Chin-Hua Hung ,  Po-Jen Su

IPC: B05B12/08 ,  B05D1/02

CPC classification number: B05B12/084 ,  B05B12/008 ,  B05B12/12 ,  B05B15/555 ,  B05D1/02

Abstract: A method of forming a layer of glue on a work piece includes: spraying the glue on the work piece; obtaining specification data of the glue by measuring a weight of the glue being sprayed on the work piece; and adjusting the spraying amount of the glue in real time according to the specification data of the glue.

Abstract translation: 在工件上形成胶水层的方法包括：将胶水喷涂在工件上; 通过测量喷涂在工件上的胶水的重量来获得胶水的规格数据; 并根据胶水的规格数据实时调整胶水喷涂量。

公开(公告)号：US09229065B2

公开(公告)日：2016-01-05

申请号：US13836181

申请日：2013-03-15

Applicant: GENESIS PHOTONICS INC

Inventor： Tai-Wei Wu ,  Tai-Cheng Tsai ,  Hsin-Hung Lin ,  Ping-Tsung Tsai ,  Pei-Yi Huang ,  Gwo-Jiun Sheu ,  Shou-Wen Hsu ,  Yun-Li Li

IPC: G01J1/00 ,  G01R31/44 ,  G01R31/26 ,  G01J1/42

CPC classification number: G01R31/44 ,  G01J2001/4252 ,  G01R31/2635

Abstract: A detection apparatus for light-emitting diode chip comprising a substrate with the function of photoelectric conversion and a probing device is disclosed. The substrate is designed to bear at least one light-emitting diode chip. The probing device comprises a power supply and at least two conductive elements. The two ends of the conductive elements are respectively electrically connected to the light-emitting diode chip and the power supply to enable the light-emitting diode chip to emit light beams. Some of the light beams are emitted from the light-emitting diode chip toward the substrate such that the light beams emitted by the light-emitting diode chip are converted into an electric signal by the substrate.

Abstract translation: 公开了一种包括具有光电转换功能的基板和探测装置的发光二极管芯片的检测装置。 基板被设计成承载至少一个发光二极管芯片。 探测装置包括电源和至少两个导电元件。 导电元件的两端分别电连接到发光二极管芯片和电源，以使得发光二极管芯片能够发射光束。 一些光束从发光二极管芯片朝向基板发射，使得由发光二极管芯片发射的光束被基板转换成电信号。

公开(公告)号：US09274164B2

公开(公告)日：2016-03-01

申请号：US13836762

申请日：2013-03-15

Applicant: GENESIS PHOTONICS INC

Inventor： Tai-Wei Wu ,  Tai-Cheng Tsai ,  Gwo-Jiun Sheu ,  Shou-Wen Hsu ,  Yun-Li Li

IPC: G01R1/073 ,  G01R31/26 ,  G01R31/44 ,  G01R1/04 ,  G02B3/00 ,  G01J1/04 ,  G01J1/42 ,  H01L33/00

CPC classification number: G01R31/2635 ,  G01J1/0411 ,  G01J2001/4247 ,  G01R1/04 ,  G01R1/073 ,  G01R31/44 ,  G02B3/00 ,  H01L33/00

Abstract: A detection apparatus for light-emitting diode chips comprises a transparent chuck with the light-concentration capability, a probing device and a light-sensing device. The transparent chuck comprises a light-incident plane and a light-emitting plane. The light-incident plane is used to bear a plurality of light-emitting diode chips under detection. The probing device comprises two probe pins and a power supply. The two ends of each probe pin is electrically connected to one of the light-emitting diode chips and the power supply, respectively, to make the light-emitting diode chip emit a plurality of light beams. The light beams penetrate through the transparent chuck by emitting into the incident plane of the transparent chuck. The light-sensing device is disposed on one side of the light-emitting plane of the transparent chuck to receive the light beams which penetrate through the transparent chuck.

Abstract translation: 用于发光二极管芯片的检测装置包括具有光集中能力的透明卡盘，探测装置和光感测装置。 透明卡盘包括光入射面和发光面。 光入射面用于承受检测下的多个发光二极管芯片。 探测装置包括两个探针和电源。 每个探针的两端分别电连接到发光二极管芯片和电源之一，以使发光二极管芯片发射多个光束。 光束穿过透明卡盘通过发射到透明卡盘的入射平面中。 光感测装置设置在透明卡盘的发光平面的一侧，以容纳透过透明卡盘的光束。

公开(公告)号：US20150325762A1

公开(公告)日：2015-11-12

申请号：US14695003

申请日：2015-04-23

Applicant: Genesis Photonics Inc.

Inventor： Shou-Wen Hsu ,  Yu-Feng Lin ,  Cheng-Bin Liu ,  Tai-Cheng Tsai ,  Chin-Hua Hung

IPC: H01L33/62 ,  H01L29/866 ,  H01L27/15

CPC classification number: H01L23/00 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/167 ,  H01L27/15 ,  H01L29/866 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/1329 ,  H01L2224/13439 ,  H01L2224/16227 ,  H01L2224/81099 ,  H01L2224/81191 ,  H01L2224/81805 ,  H01L2224/81855 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2933/0066 ,  H01L2924/0105 ,  H01L2924/00014 ,  H01L2924/0665

Abstract: A package structure and a manufacturing method thereof are disclosed. The package structure includes: a substrate; at least one light emitting diode disposed on the substrate by eutectic bonding; and at least one Zener diode disposed on the substrate by at least one silver glue. The method of manufacturing the package structure includes: providing a substrate; performing a eutectic bonding process to dispose at least one light emitting diode on the substrate; and performing a silver glue bonding process at room temperature to dispose at least one Zener diode on the substrate.

Abstract translation: 公开了一种封装结构及其制造方法。 封装结构包括：衬底; 至少一个发光二极管通过共晶接合设置在基板上; 以及至少一个齐纳二极管，其通过至少一个银胶布置在所述基板上。 制造封装结构的方法包括：提供衬底; 执行共晶接合工艺以在衬底上设置至少一个发光二极管; 并在室温下进行银胶接合处理，以在衬底上设置至少一个齐纳二极管。

公开(公告)号：US08767198B2

公开(公告)日：2014-07-01

申请号：US13838824

申请日：2013-03-15

Applicant: Genesis Photonics Inc

Inventor： Tai-Cheng Tsai ,  Tai-Wei Wu ,  Gwo-Jiun Sheu ,  Shou-Wen Hsu ,  Yun-Li Li

IPC: G01J1/00 ,  G01J1/42 ,  G01J1/04

CPC classification number: G01J1/42 ,  G01J1/04 ,  G01J1/0407 ,  G01J1/0411 ,  G01J1/0422 ,  G01J1/0425 ,  G01J1/4257 ,  G01J2001/4247 ,  G01R31/2635 ,  G02B19/0066 ,  G02B19/0076

Abstract: A detection apparatus comprising a chuck, a probe device, a light-sensing device and a light-concentrating unit is disclosed. The chuck bears light-emitting diode chips. The probe device includes two probes and a power supply. The end point of the probes respectively electrically connects with one of the light-emitting diode chips and the power supply to make the light-emitting diode chip emits a plurality of light beams. The light-sensing device is disposed on one side of a light-emitting surface of the light-emitting diode chip so as to receive the light beams emitted by the light-emitting diode chip. The light-concentrating unit is disposed between the light-emitting diode chip and the light-sensing device to concentrate the light beams emitted by the light-emitting diode chip.

Abstract translation: 公开了一种包括卡盘，探针装置，感光装置和聚光装置的检测装置。 卡盘带有发光二极管芯片。 探头装置包括两个探针和一个电源。 探针的终点分别与发光二极管芯片和电源中的一个电连接，以使发光二极管芯片发射多个光束。 光感测装置设置在发光二极管芯片的发光面的一侧，以便接收由发光二极管芯片发射的光束。 光集中单元设置在发光二极管芯片和感光装置之间，以集中由发光二极管芯片发射的光束。