公开(公告)号：US10732202B2

公开(公告)日：2020-08-04

申请号：US15083787

申请日：2016-03-29

Applicant: GLOBALFOUNDRIES INC.

Inventor： Craig M. Bocash ,  David L. Gardell ,  Peter W. Neff

IPC: G01R1/067 ,  G01R3/00 ,  G01R1/073

Abstract: A repairable rigid test probe system includes an annular gimbal supported by an annular gimbal bearing of a probe card assembly, a test substrate seated and aligned within the annular gimbal, a rigid die including thick periphery and a thin center containing an array of through holes that is aligned above the test substrate, and an array of rigid probes inserted into each of the array of through holes, where each rigid probe includes: a tail end that contacts a connection on a facing surface of the test substrate, a collar limiting a distance of insertion, and a tip that contacts a corresponding contact on a facing surface of a device under test.

公开(公告)号：US20170219626A1

公开(公告)日：2017-08-03

申请号：US15014479

申请日：2016-02-03

Applicant: GLOBALFOUNDRIES INC.

Inventor： David L. Gardell ,  David M. Audette ,  Peter W. Neff

IPC: G01R1/073 ,  G01R31/28 ,  G01R35/00

CPC classification number: G01R1/07364 ,  G01R1/0735 ,  G01R31/24 ,  G01R31/2635 ,  G01R31/44 ,  G01R33/0017 ,  G01R35/005

Abstract: Aspects of the present disclosure provide a gimbal assembly test system including: a protective cover affixed to a test surface of a wafer probe card mounted within a gimbal bearing, wherein the protective cover includes an exterior surface oriented outward from the test surface of the wafer probe card; and a recess extending into the exterior surface of the protective cover and shaped to matingly engage a load cell tip therein.

公开(公告)号：US10514393B2

公开(公告)日：2019-12-24

申请号：US15933443

申请日：2018-03-23

Applicant: GLOBALFOUNDRIES INC.

Inventor： David L. Gardell ,  David M. Audette ,  Peter W. Neff

IPC: G01R31/00 ,  G01R1/073 ,  G01R33/00 ,  G01R35/00 ,  G01R31/24 ,  G01R31/44 ,  G01R31/26 ,  H05B37/03

Abstract: Aspects of the present disclosure provide a gimbal assembly test system including: a protective cover affixed to a test surface of a wafer probe card mounted within a gimbal bearing, wherein the protective cover includes an exterior surface oriented outward from the test surface of the wafer probe card; and a recess extending into the exterior surface of the protective cover and shaped to matingly engage a load cell tip therein.

公开(公告)号：US10041976B2

公开(公告)日：2018-08-07

申请号：US15014479

申请日：2016-02-03

Applicant: GLOBALFOUNDRIES INC.

Inventor： David L. Gardell ,  David M. Audette ,  Peter W. Neff

IPC: G01R1/073 ,  G01R33/00 ,  G01R35/00 ,  G01R31/24 ,  G01R31/44 ,  G01R31/26

Abstract: Aspects of the present disclosure provide a gimbal assembly test system including: a protective cover affixed to a test surface of a wafer probe card mounted within a gimbal bearing, wherein the protective cover includes an exterior surface oriented outward from the test surface of the wafer probe card; and a recess extending into the exterior surface of the protective cover and shaped to matingly engage a load cell tip therein.

公开(公告)号：US10429414B2

公开(公告)日：2019-10-01

申请号：US15013106

申请日：2016-02-02

Applicant: GLOBALFOUNDRIES INC.

Inventor： Marvin G. L. Montaque ,  Stephen P. Ayotte ,  David L. Gardell

IPC: G01R1/073 ,  G01R3/00

Abstract: A system and method for disassembling a multiple contact probe head including a plurality of contact probes positioned by a first die at a first end of the plurality of probes and a second die at a second end of the plurality of probes, are provided. The system may include a manifold configured to sealingly receive an opposing side of the first die from the second die; and a vacuum source operatively coupled to the manifold to apply a vacuum to an interior of the manifold applying a force to the plurality of contact probes in position in the first die across. Where the probes include a paramagnetic material, a magnetic source may be employed to hold the probes during disassembly.

公开(公告)号：US20180217184A1

公开(公告)日：2018-08-02

申请号：US15933443

申请日：2018-03-23

Applicant: GLOBALFOUNDRIES INC.

Inventor： David L. Gardell ,  David M. Audette ,  Peter W. Neff

IPC: G01R1/073 ,  G01R31/24 ,  G01R33/00 ,  G01R35/00 ,  G01R31/26 ,  G01R31/44

Abstract: Aspects of the present disclosure provide a gimbal assembly test system including: a protective cover affixed to a test surface of a wafer probe card mounted within a gimbal bearing, wherein the protective cover includes an exterior surface oriented outward from the test surface of the wafer probe card; and a recess extending into the exterior surface of the protective cover and shaped to matingly engage a load cell tip therein.

公开(公告)号：US20170219631A1

公开(公告)日：2017-08-03

申请号：US15013106

申请日：2016-02-02

Applicant: GLOBALFOUNDRIES INC.

Inventor： Marvin G. L. Montaque ,  Stephen P. Ayotte ,  David L. Gardell

IPC: G01R3/00 ,  G01R1/073

CPC classification number: G01R3/00 ,  G01R1/073 ,  G01R1/07357

Abstract: A system and method for disassembling a multiple contact probe head including a plurality of contact probes positioned by a first die at a first end of the plurality of probes and a second die at a second end of the plurality of probes, are provided. The system may include a manifold configured to sealingly receive an opposing side of the first die from the second die; and a vacuum source operatively coupled to the manifold to apply a vacuum to an interior of the manifold applying a force to the plurality of contact probes in position in the first die across. Where the probes include a paramagnetic material, a magnetic source may be employed to hold the probes during disassembly.