公开(公告)号：US09454886B2

公开(公告)日：2016-09-27

申请号：US14037550

申请日：2013-09-26

Applicant: GLOBALFOUNDRIES INC.

Inventor： Michael S. Gordon ,  Kenneth P. Rodbell

IPC: G08B17/00 ,  G08B17/12 ,  G01T7/00 ,  G08B17/11

CPC classification number: G08B17/12 ,  G01T7/00 ,  G08B17/11

Abstract: Radioactive integrated circuit (IC) devices with radioactive material embedded in the substrate of the IC itself, and including logic for “fingerprinting” (that is, determining characteristics that identify the source of the radioactive source material). Radioactive IC devices with embedded detector hardware that determine aspects of radioactivity such as total dose and/or ambient radiation. Radioactive IC devices that can determine an elapsed time based on radioactive decay rates. Radioactive smoke detector using man-made, relatively short half-life radioactive source material.

Abstract translation: 具有放射性材料的放射性集成电路（IC）装置，其嵌入在IC本身的基板中，并且包括用于“指纹”的逻辑（即，确定识别放射源材料源的特性）。 具有嵌入式检测器硬件的放射性IC器件，其确定放射性的方面，例如总剂量和/或环境辐射。 可以根据放射性衰减率确定经过时间的放射性IC器件。 放射性烟雾探测器采用人造，半衰期较短的放射源材料。

公开(公告)号：US09299665B2

公开(公告)日：2016-03-29

申请号：US14519235

申请日：2014-10-21

Applicant: GLOBALFOUNDRIES INC.

Inventor： Paul S. Andry ,  Cyril Cabral, Jr. ,  Kenneth P. Rodbell ,  Robert L. Wisnieff

IPC: H01L23/556 ,  H01L23/00 ,  H01L21/304 ,  H01L21/48

CPC classification number: H01L23/556 ,  H01L21/304 ,  H01L21/481 ,  H01L24/11 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/16113 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29111 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/2064 ,  H01L2924/3025 ,  H01L2224/13111 ,  H01L2924/00014

Abstract: A structure fabrication method. An integrated circuit that includes N chip electric pads is bonded to a top side of an interposing shield that includes N electric conductors. N is at least 2. The interposing shield includes a shield material that includes a first semiconductor material. A bottom side of the interposing shield is polished, which exposes the N electric conductors to a surrounding ambient. The bonding includes bonding the integrated circuit to the top side of the interposing shield such that the N chip electric pads are in electrical contact and direct physical contact with corresponding electrical pads of the N electric conductors. The shield material covers the N electric conductors in a manner that the N electric conductors are not exposed to the surrounding ambient. The polishing removes a sufficient amount of the shield material to expose the N electric conductors to the surrounding ambient.

Abstract translation: 一种结构制造方法。 包括N个芯片电焊盘的集成电路被结合到包括N个电导体的插入屏蔽的顶侧。 N为至少2.插入屏蔽包括包括第一半导体材料的屏蔽材料。 中间屏蔽的底面被抛光，将N根电导体暴露在周围环境中。 接合包括将集成电路接合到中间屏蔽的顶侧，使得N个芯片电极焊盘与N个电导体的相应电焊盘电接触并直接物理接触。 屏蔽材料以N个电导体不暴露于周围环境的方式覆盖N个电导体。 抛光去除了足够量的屏蔽材料，以将N个电导体暴露于周围环境。

公开(公告)号：US09720101B2

公开(公告)日：2017-08-01

申请号：US14242283

申请日：2014-04-01

Applicant: GLOBALFOUNDRIES INC.

Inventor： Michael S. Gordon ,  Kenneth P. Rodbell ,  Emmanuel Yashchin

IPC: G01T1/178

CPC classification number: G01T1/178 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A system, method and computer program product for determining whether a material meets an alpha particle emissivity specification that includes measuring a background alpha particle emissivity for the counter and measuring a combined alpha particle emissivity from the counter containing a sample of the material. The combined alpha particle emissivity includes the background alpha particle emissivity in combination with a sample alpha particle emissivity. The decision statistic is computed based on the observed data and compared to a threshold value. When the decision statistic is less than the threshold value, the material meets the alpha particle emissivity specification. The testing times are computed based on pre-specified criteria so as to meet the needs of both Producer and Consumer.