Semiconductor structure having test device
    2.
    发明授权
    Semiconductor structure having test device 有权
    具有测试装置的半导体结构

    公开(公告)号:US09500703B2

    公开(公告)日:2016-11-22

    申请号:US14462643

    申请日:2014-08-19

    CPC classification number: G01R31/2884 G01R31/2601 G01R31/2644 H01L22/34

    Abstract: There is set forth herein a semiconductor structure including a plurality of test devices, the plurality of test devices including a first test device and a second test device. A semiconductor structure can also include a waveform generating circuit, the waveform generating circuit configured for application of a first stress signal waveform having a first duty cycle to the first test device, and a second stress signal waveform having a second duty cycle to the second test device. A semiconductor structure can include a selection circuit associated with each of the first test device and the second test device for switching between a stress cycle and a sensing cycle.

    Abstract translation: 这里提出了包括多个测试装置的半导体结构,所述多个测试装置包括第一测试装置和第二测试装置。 半导体结构还可以包括波形发生电路,波形发生电路被配置为将第一应力信号波形具有第一占空比施加到第一测试装置,第二应力信号波形具有第二占空比到第二测试 设备。 半导体结构可以包括与第一测试装置和第二测试装置中的每一个相关联的选择电路,用于在应力循环和感测周期之间切换。

    METHODS, APPARATUS AND SYSTEM FOR TDDB TESTING
    3.
    发明申请
    METHODS, APPARATUS AND SYSTEM FOR TDDB TESTING 有权
    TDDB测试方法,装置和系统

    公开(公告)号:US20160061880A1

    公开(公告)日:2016-03-03

    申请号:US14473937

    申请日:2014-08-29

    Inventor: Suresh Uppal

    Abstract: At least one method and system disclosed herein involves performing a time-dependent dielectric breakdown (TDDB) on a plurality of devices. A first device and a second device are provided for testing. A test signal is provided for performing a time-dependent dielectric breakdown (TDDB) test on the first and second devices. A selection signal for selecting said first and second devices for performing said TDDB test. The first and second devices are arranged in series with a first resistor such that based upon said selecting, the test signal is applied substantially simultaneously to the first and second devices through the first resistor. A determination is made as to whether a breakdown and/or a failure of at least one of the first and second devices has occurred based upon a change in voltage across the first resistor.

    Abstract translation: 本文公开的至少一种方法和系统涉及在多个设备上执行时间依赖介质击穿(TDDB)。 提供第一装置和第二装置用于测试。 提供测试信号用于在第一和第二器件上进行时间依赖介质击穿(TDDB)测试。 用于选择用于执行所述TDDB测试的所述第一和第二设备的选择信号。 第一和第二装置与第一电阻器串联布置,使得基于所述选择,测试信号基本上同时施加到第一和第二器件通过第一电阻器。 基于第一电阻器两端的电压变化,确定是否发生了第一和第二器件中的至少一个的故障和/或故障。

    METHODS OF POST-PROCESS DISPENSATION OF PLASMA INDUCED DAMAGE PROTECTION COMPONENT
    8.
    发明申请
    METHODS OF POST-PROCESS DISPENSATION OF PLASMA INDUCED DAMAGE PROTECTION COMPONENT 审中-公开
    等离子体诱导损伤保护组分的后处理方法

    公开(公告)号:US20160111867A1

    公开(公告)日:2016-04-21

    申请号:US14517605

    申请日:2014-10-17

    Abstract: At least one method, apparatus and system disclosed herein involves providing an integrated circuit device comprising a protection circuit. And integrated circuit device is formed. A protection component is formed in parallel to the integrated circuit device. The protection component is configured for protecting the integrated circuit device from a portion of a charge. A circuit break device in series to the protection component, wherein the protection component and the circuit break device are in parallel to the integrated circuit device. The circuit break device is configured to break an electrical path of the protection component for electrically terminating the protection component based upon a current signal.

    Abstract translation: 本文公开的至少一种方法,装置和系统涉及提供包括保护电路的集成电路装置。 并形成集成电路器件。 保护部件与集成电路器件并联形成。 保护部件被配置为保护集成电路器件免受电荷的一部分的影响。 一种与保护部件串联的断路装置,其中保护部件和断路装置与集成电路装置并联。 断路装置被配置为基于电流信号中断保护部件的电气路径以电气端接保护部件。

    METHODS, APPARATUS AND SYSTEM FOR SCREENING PROCESS SPLITS FOR TECHNOLOGY DEVELOPMENT
    9.
    发明申请
    METHODS, APPARATUS AND SYSTEM FOR SCREENING PROCESS SPLITS FOR TECHNOLOGY DEVELOPMENT 有权
    用于筛选技术开发过程分析的方法,装置和系统

    公开(公告)号:US20150346271A1

    公开(公告)日:2015-12-03

    申请号:US14288278

    申请日:2014-05-27

    Abstract: At least one method and system disclosed herein involves performing a time-dependent dielectric breakdown (TDDB) test and a bias temperature instability (BTI) test on a device. A device having at least one transistor and at least one dielectric layer is provided. A test signal is provided for performing a TDDB test and a BTI test on the device. The TDDB test and the BTI test are performed substantially simultaneously on the device based upon the test signal. The data relating to a breakdown of the dielectric layer and at least one characteristic of the transistor based upon the TDDB test and the BTI test is acquired, stored, and/or transmitted.

    Abstract translation: 本文公开的至少一种方法和系统涉及在器件上执行时间依赖介电击穿(TDDB)测试和偏置温度不稳定性(BTI)测试。 提供具有至少一个晶体管和至少一个电介质层的器件。 提供测试信号用于在设备上执行TDDB测试和BTI测试。 基于测试信号,在设备上基本上同时执行TDDB测试和BTI测试。 获取,存储和/或发送与介电层的击穿和基于TDDB测试和BTI测试的晶体管的至少一个特性相关的数据。

    Methods, apparatus and system for TDDB testing

    公开(公告)号:US10012687B2

    公开(公告)日:2018-07-03

    申请号:US14473937

    申请日:2014-08-29

    Inventor: Suresh Uppal

    Abstract: At least one method and system disclosed herein involves performing a time-dependent dielectric breakdown (TDDB) on a plurality of devices. A first device and a second device are provided for testing. A test signal is provided for performing a time-dependent dielectric breakdown (TDDB) test on the first and second devices. A selection signal for selecting said first and second devices for performing said TDDB test. The first and second devices are arranged in series with a first resistor such that based upon said selecting, the test signal is applied substantially simultaneously to the first and second devices through the first resistor. A determination is made as to whether a breakdown and/or a failure of at least one of the first and second devices has occurred based upon a change in voltage across the first resistor.

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