TEMPERATURE SENSOR ISOLATION IN SMART-HOME DEVICES

    公开(公告)号:US20220065704A1

    公开(公告)日:2022-03-03

    申请号:US17006472

    申请日:2020-08-28

    申请人: Google LLC

    IPC分类号: G01K1/16 G05D23/19 G01K13/02

    摘要: A smart-home device may include a housing, a printed circuit board (PCB) inside the housing, an environmental sensor mounted to the PCB inside the housing, and a gasket that encloses the environmental sensor inside the housing to isolate the environmental sensor from an atmosphere inside of the housing while allowing an atmosphere outside of the housing to enter the gasket such that the environmental sensor can measure an aspect of the atmosphere outside of the housing.

    Mount attachment for an electronic device

    公开(公告)号:US10697583B2

    公开(公告)日:2020-06-30

    申请号:US15710765

    申请日:2017-09-20

    申请人: GOOGLE LLC

    摘要: An attachment mechanism for mounting an electronic device to a surface including a mounting plate configured to attach to the surface, the mounting plate having at least one projection, and a base configured to releasably couple to the mounting plate. The base may include a first biasing member, and a first arm pivotably coupled to the base and biased toward a first direction by the first biasing member, the first arm configured to interlock with the at least one projection when the base is coupled to the mounting plate. The base may further include a release mechanism coupled to the first arm such that actuation of the release mechanism when the base is coupled to the mounting plate in a secured engagement causes movement of the first arm in a second direction to disengage the first arm from the at least one projection to enable detachment of the base from the mounting plate.