摘要:
A bundled flexible flat circuit cable includes a flexible substrate that forms at least one cluster section having an end forming at least one first connection section and an opposite end forming at least one second connection section. Both the first and second connection sections or one of the first and second connection sections form a stack structure. The flexible substrate can be of a structure of single-sided or double-sided substrate and may additionally include an electromagnetic shielding layer. A bundling structure is provided to bundle the cluster section at a predetermined location to form a bundled structure. The bundling structure can be made of a shielding material, an insulation material, or a combination of shielding material and insulation material.
摘要:
A bundled flexible flat circuit cable includes a flexible substrate that forms at least one cluster section having an end forming at least one first connection section and an opposite end forming at least one second connection section. Both the first and second connection sections or one of the first and second connection sections form a stack structure. The flexible substrate can be of a structure of single-sided or double-sided substrate and may additionally include an electromagnetic shielding layer. A bundling structure is provided to bundle the cluster section at a predetermined location to form a bundled structure. The bundling structure can be made of a shielding material, an insulation material, or a combination of shielding material and insulation material.
摘要:
A multilayer stacked circuit arrangement with localized separation section, has a first flat cable and first signal transmission lines arranged on the first flat cable. A second flat cable is stacked on and bonded to the first flat cable. The second flat cable further has signal transmission lines arranged on it. A bonding substance layer is formed between a first non-separation section of the first flat cable and a second non-separation section of the second flat cable for properly stacking the first and second flat cables where the separation sections are spaced apart from each other. A conductive via extends between the first non-separation section and the second non-separation section. At least some of the second signal transmission lines of the second flat cable are connected through the conductive via to the first signal transmission lines of the first flat cable.
摘要:
A composite circuit board with fracturable structure includes a first flat cable and first signal transmission lines formed on the first flat cable. A second flat cable is stacked on and bonded to the first circuit flat cable. The second flat cable includes second signal transmission lines and forms an overlapping segment and a selective breakable segment between which a fracturable structure is formed. The selective breakable segment covers the connection segment of the first flat cable or may be broken off for separation of the flat cables. Some of the second signal transmission lines of the second flat cable are connected through a hole in the first circuit flat cable to the first signal transmission lines of the first flat cable or connected through the hole to the conductive terminals of the connection segment of the first flat cable.
摘要:
Disclosed is a detachment and displacement protection structure for insertion of flexible circuit flat cable. An inserter positioning section is formed on a flexible circuit flat cable and coupled with an inserter, which includes a metal member and a plastic member. In assembling, the plastic member is first positioned on a first surface of the inserter positioning section of the flexible circuit flat cable, and then the metal member is fit over the plastic member. A detachment and displacement protection structure is provided on the inserter positioning section to constrain the inserter from displacing and detaching in a flat cable extension direction due to being acted upon by an external force when the inserter is positioned on the inserter positioning section.
摘要:
A structure of via hole of electrical circuit board includes an adhesive layer and a conductor layer that are formed after wiring is formed on a carrier board. At least one through hole extends in a vertical direction through the carrier board, the wiring, the adhesive layer, and the conductor layer and forms a hole wall surface. The conductor layer shows a height difference with respect to an exposed zone of the circuit trace in the vertical direction. A conductive cover section covers the conductor layer and the hole wall surface of the through hole. The carrier board is a single-sided board, a double-sided board, a multi-layered board, or a combination thereof, and the single-sided board, the double-sided board, and multi-layered board can be flexible boards, rigid boards, or composite boards combining flexible and rigid boards.
摘要:
Disclosed is a double-side-conducting flexible-circuit flat cable with cluster section, which includes a flexible circuit substrate, a first electrical conduction path, a second electrical conduction path, a plurality of first and second conductive contact zones. The flexible circuit substrate has a first surface and a second surface and includes, in an extension direction, a first connection section, a cluster section, and at least one second connection section. The cluster section is composed of a plurality of clustered flat cable components formed by slitting in the extension direction. The first and second electrical conduction paths are respectively formed on the first and second surfaces of the flexible circuit substrate and each extends along one of the clustered flat cable components of the cluster section. The plurality of first and second conductive contact zones are respectively arranged on the first and second surfaces of the flexible circuit substrate at the first connection section. Each of the first and second conductive contact zones extends along one of the electrical conduction paths of the cluster section toward the second connection section.
摘要:
A bundled flexible flat circuit cable includes a flexible substrate that forms at least one cluster section having an end forming at least one first connection section and an opposite end forming at least one second connection section. Both the first and second connection sections or one of the first and second connection sections form a stack structure. The flexible substrate can be of a structure of single-sided or double-sided substrate and may additionally include an electromagnetic shielding layer. A bundling structure is provided to bundle the cluster section at a predetermined location to form a bundled structure. The bundling structure can be made of a shielding material, an insulation material, or a combination of shielding material and insulation material.
摘要:
A bundled flexible flat circuit cable includes a flexible substrate that forms at least one cluster section having an end forming at least one first connection section and an opposite end forming at least one second connection section. Both the first and second connection sections or one of the first and second connection sections form a stack structure. The flexible substrate can be of a structure of single-sided or double-sided substrate and may additionally include an electromagnetic shielding layer. A bundling structure is provided to bundle the cluster section at a predetermined location to form a bundled structure. The bundling structure can be made of a shielding material, an insulation material, or a combination of shielding material and insulation material.
摘要:
Disclosed is a structure for precision control of electrical impedance of signal transmission circuit board. A substrate forms thereon a plurality of first signal transmission lines, and a first covering insulation layer is formed on a first surface of the substrate to cover a surface of each first signal transmission lines and each spacing section formed between adjacent first signal transmission lines. Each first signal transmission lines can transmit a differential mode signal or a common mode signal. At least one first flattening insulation layer is formed between a surface of the first covering insulation layer and a first conductive shielding layer so that the first flattening insulation layer fills up the height difference between the surface of each first signal transmission line and the spacing section associated with each first signal transmission line to thereby ensure a consistent distance between the signal transmission lines and the conductive shielding layer for realizing precision control of electrical impedance of the signal transmission circuit board.