Thermal management in large area flexible OLED assembly
    2.
    发明授权
    Thermal management in large area flexible OLED assembly 有权
    大面积柔性OLED组件的热管理

    公开(公告)号:US08829556B2

    公开(公告)日:2014-09-09

    申请号:US13223935

    申请日:2011-09-01

    IPC分类号: H01L29/22 H01L51/52

    摘要: A large area, flexible, OLED assembly has improved thermal management by providing a metal cathode of increased thickness of at least 500 nm. A thermal heat sink trace may be used as alternative or in conjunction with the increased thickness cathode where the trace leads from a central region of the OLED toward a perimeter region, or by other backsheet thermal management designs. External heat sinking, for example to a plate, fixture, etc. may be additionally used or in conjunction with the increased thickness cathode and/or backsheet design to provide further thermal management.

    摘要翻译: 大面积,灵活的OLED组件通过提供至少500nm的增加厚度的金属阴极来改进热管理。 可以使用热散热器迹线作为替代或结合增加厚度的阴极,其中迹线从OLED的中心区域朝向周边区域引导,或者通过其它底片热管理设计。 可以另外使用外部散热,例如板,夹具等,或者与增加厚度的阴极和/或底片设计相结合以提供进一步的热管理。

    THERMAL MANAGEMENT IN LARGE AREA FLEXIBLE OLED ASSEMBLY
    3.
    发明申请
    THERMAL MANAGEMENT IN LARGE AREA FLEXIBLE OLED ASSEMBLY 有权
    大面积灵活OLED组件的热管理

    公开(公告)号:US20130056783A1

    公开(公告)日:2013-03-07

    申请号:US13223935

    申请日:2011-09-01

    IPC分类号: H01L33/64

    摘要: A large area, flexible, OLED assembly has improved thermal management by providing a metal cathode of increased thickness of at least 500 nm. A thermal heat sink trace may be used as alternative or in conjunction with the increased thickness cathode where the trace leads from a central region of the OLED toward a perimeter region, or by other backsheet thermal management designs. External heat sinking, for example to a plate, fixture, etc. may be additionally used or in conjunction with the increased thickness cathode and/or backsheet design to provide further thermal management.

    摘要翻译: 大面积,灵活的OLED组件通过提供至少500nm的增加厚度的金属阴极来改进热管理。 可以使用热散热器迹线作为替代或结合增加厚度的阴极,其中迹线从OLED的中心区域朝向周边区域引导,或者通过其它底片热管理设计。 可以另外使用外部散热,例如板,夹具等,或者与增加厚度的阴极和/或底片设计相结合以提供进一步的热管理。

    COMPACT BEAM FORMER FOR INDUCTION HID LAMP
    9.
    发明申请
    COMPACT BEAM FORMER FOR INDUCTION HID LAMP 失效
    用于感应灯泡的紧凑光束

    公开(公告)号:US20100110694A1

    公开(公告)日:2010-05-06

    申请号:US12609960

    申请日:2009-10-30

    IPC分类号: F21V7/08 F21V3/00 F21V7/00

    摘要: A light distribution assembly includes an electrodeless HID light source providing emitted light along substantially first and second hemispherical zones. A first optical element redirects a portion of light from the first hemispherical zone into a first desired direction in the second hemispherical zone. A second optical element redirects at least a portion of light within the second hemispherical zone. Other optical elements may be added to tailor the light distribution. Various combinations of these components may be used to create the desired illumination pattern.

    摘要翻译: 配光组件包括无电极HID光源,其提供基本上第一和第二半球形区域的发射光。 第一光学元件将来自第一半球形区域的光的一部分重定向到第二半球形区域中的第一所需方向。 第二光学元件重新定向第二半球形区域内的至少一部分光。 可以添加其他光学元件以调整光分布。 可以使用这些组件的各种组合来产生所需的照明图案。