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    Optoelectronic component
    2.
    发明授权
    Optoelectronic component 有权
    光电元件

    公开(公告)号：US07271425B2

    公开(公告)日：2007-09-18

    申请号：US10535794

    申请日：2003-11-27

    申请人： Karlheinz Arndt ,  Georg Bogner ,  Günter Waitl ,  Matthias Winter

    发明人： Karlheinz Arndt ,  Georg Bogner ,  Günter Waitl ,  Matthias Winter

    IPC分类号： H01L29/22

    CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00

    摘要： The invention relates to an optoelectronic component containing an optoelectronic chip (1) and containing a chip carrier (2) that has a central region (3) on which the chip is fixed and that comprises terminals (41, 42, 43, 44) extending outwardly from the central region of the chip carrier (2) to the outside, wherein the chip and portions of the chip carrier are enveloped by a body (5) and wherein the projection of the body and that of each of the longitudinal axes of the terminals onto the contact plane between the chip and the chip carrier are substantially point-symmetrical with respect to the central point of the chip. The invention further relates to an arrangement comprising said component. The advantage of the symmetrical configuration of the component is that the risk of thermomechanically induced failures of the component is reduced.

    摘要翻译： 本发明涉及一种含有光电子芯片（1）并包含芯片载体（2）的光电子部件，芯片载体（2）具有芯片固定在其上的中心区域（3），并且包括端子（41,42,43,44） 向外从芯片载体（2）的中心区域延伸至外部，其中芯片和芯片载体的部分被主体（5）包围，并且其中主体的突起和纵向轴线的突出部分 在芯片和芯片载体之间的接触平面上的端子相对于芯片的中心点基本上是点对称的。 本发明还涉及包括所述部件的装置。 组件的对称构型的优点在于降低了组织的热力学诱导故障的风险。

    Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for such a component
    3.
    发明申请
    Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for such a component 有权
    发射和/或接收电磁辐射的半导体部件和用于这种部件的壳体基座

    公开(公告)号：US20060022215A1

    公开(公告)日：2006-02-02

    申请号：US11179028

    申请日：2005-07-18

    申请人： Karlheinz Arndt ,  Georg Bogner ,  Bert Braune ,  Gunter Waitl

    发明人： Karlheinz Arndt ,  Georg Bogner ,  Bert Braune ,  Gunter Waitl

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Disclosed is a radiation emitting and/or receiving semiconductor component comprising at least one radiation emitting and/or receiving semiconductor chip (1), which is disposed in a recess (2) of a housing base body (3) and is there encapsulated with an encapsulant (4) that is readily transparent to electromagnetic radiation emitted and/or received by the semiconductor chip (1). The recess (2) comprises a chip well (21) in which the semiconductor chip (1) is secured, and a trench (22) that runs at least partway around the chip well (21) inside the recess (2), such that between the chip well (21) and the trench (22) the housing base body (3) comprises a wall (23) whose apex, viewed from a bottom face of the chip well (21), lies below the level of the surface of the housing base body (3) from which the recess (2) leads into the housing base body (3), and the encapsulant (4) extends outward from the chip well (21) over the wall into the trench (22). A corresponding housing base body is also disclosed.

    摘要翻译： 公开了一种辐射发射和/或接收半导体部件，其包括至少一个辐射发射和/或接收半导体芯片（1），其布置在壳体基体（3）的凹部（2）中，并且被封装有 对由半导体芯片（1）发射和/或接收的电磁辐射容易透明的密封剂（4）。 凹部（2）包括其中固定有半导体芯片（1）的芯片阱（21）和在凹部（2）内部至少沿芯片阱（21）延伸的沟槽（22），使得 在芯片井（21）和沟槽（22）之间，壳体基体（3）包括壁（23），其从芯片井（21）的底面观察其顶点位于下表面的水平面 所述壳体基体（3）从所述凹部（2）引导到所述壳体基体（3）中，并且所述密封剂（4）从所述芯片孔（21）向外延伸到所述壁上进入所述沟槽（22）。 还公开了相应的壳体基体。

    Conductor Frame For an Electronic Component and Method For the Production Thereof
    5.
    发明申请
    Conductor Frame For an Electronic Component and Method For the Production Thereof 有权
    电子元件导体框架及其制造方法

    公开(公告)号：US20080251900A1

    公开(公告)日：2008-10-16

    申请号：US11576054

    申请日：2005-08-08

    申请人： Karlheinz Arndt ,  Huey Ling Rena Lim ,  Georg Bogner ,  Stefan Gruber ,  Markus Schneider

    发明人： Karlheinz Arndt ,  Huey Ling Rena Lim ,  Georg Bogner ,  Stefan Gruber ,  Markus Schneider

    IPC分类号： H05K13/00 ,  H01L23/495

    CPC分类号： H01L23/49541 ,  H01L23/495 ,  H01L23/49562 ,  H01L2924/0002 ,  Y10T29/49174 ,  H01L2924/00

    摘要： Disclosed is a leadframe for at least one electronic component, comprising at least two electrical lead elements, each of which comprises at least one electrical lead tab and at least one retention tab. Provided between the at least one retention tab and the lead element is a score defining a parallel offset between the retention tab and the adjacent region of lead element. An additional parallel offset is defined between the lead element and the electrical lead tab, such that the retention tab and the electrical lead tab are located in a common plane. The score enables the retention tab to be removed easily without the need for a disadvantageous punched gap between the lead element and the retention tab.

    摘要翻译： 公开了一种用于至少一个电子部件的引线框架，包括至少两个电引线元件，每个电引线元件包括至少一个电引线接线片和至少一个保持接线片。 提供在所述至少一个保持突片和所述引线元件之间的刻痕是限定所述保持突片和所述引线元件的相邻区域之间的平行偏移的刻痕。 在引线元件和电引线接线片之间限定了额外的平行偏移，使得保持接线片和电引线接头位于共同的平面内。 该分数使得能够容易地移除保持片，而不需要在引线元件和保持片之间存在不利的冲压间隙。

    Conductor frame for an electronic component and method for the production thereof
    8.
    发明授权
    Conductor frame for an electronic component and method for the production thereof 有权
    电子部件用导体框架及其制造方法

    公开(公告)号：US07550827B2

    公开(公告)日：2009-06-23

    申请号：US11576054

    申请日：2005-08-08

    申请人： Karlheinz Arndt ,  Huey Ling Rena Lim ,  Georg Bogner ,  Stefan Gruber ,  Markus Schneider

    发明人： Karlheinz Arndt ,  Huey Ling Rena Lim ,  Georg Bogner ,  Stefan Gruber ,  Markus Schneider

    IPC分类号： H01L23/495 ,  H01L33/00

    CPC分类号： H01L23/49541 ,  H01L23/495 ,  H01L23/49562 ,  H01L2924/0002 ,  Y10T29/49174 ,  H01L2924/00

    摘要： Disclosed is a leadframe lot at least one electronic component, composing at least two electrical lead elements, each of which comprises at least one electrical lead tab and at least one retention tab. Provided between the at least one retention tab and the lead element is a score defining parallel offset between the retention tab and the adjacent region of the lead element. An additional parallel offset is defined between the lead element and the electrical lead tab, such that the retention tab and the electrical lead tab are located in a common plane. The score enables the retention tab to be removed easily without the need for a disadvantageous punched gap between the lead element and the retention tab.

    摘要翻译： 公开了一种用于至少一个电子部件的引线框架，包括至少两个电引线元件，每个电引线元件包括至少一个电引线接线片和至少一个保持接线片。 在所述至少一个保持突片和所述引线元件之间设置有限定所述保持突片和所述引线元件的相邻区域之间的平行偏移的刻痕。 在引线元件和电引线接线片之间限定了额外的平行偏移，使得保持接线片和电引线接头位于共同的平面内。 该分数使得能够容易地移除保持片，而不需要在引线元件和保持片之间存在不利的冲压间隙。

    Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for such a component
    10.
    发明授权
    Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for such a component 有权
    发射和/或接收电磁辐射的半导体部件和用于这种部件的壳体基座

    公开(公告)号：US07427806B2

    公开(公告)日：2008-09-23

    申请号：US11179028

    申请日：2005-07-18

    申请人： Karlheinz Arndt ,  Georg Bogner ,  Bert Braune ,  Günter Waitl

    发明人： Karlheinz Arndt ,  Georg Bogner ,  Bert Braune ,  Günter Waitl

    IPC分类号： H01L23/20

    CPC分类号： H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Disclosed is a radiation emitting and/or receiving semiconductor component comprising at least one radiation emitting and/or receiving semiconductor chip (1), which is disposed in a recess (2) of a housing base body (3) and is there encapsulated with an encapsulant (4) that is readily transparent to electromagnetic radiation emitted and/or received by the semiconductor chip (1). The recess (2) comprises a chip well (21) in which the semiconductor chip (1) is secured, and a trench (22) that runs at least partway around the chip well (21) inside the recess (2), such that between the chip well (21) and the trench (22) the housing base body (3) comprises a wall (23) whose apex, viewed from a bottom face of the chip well (21), lies below the level of the surface of the housing base body (3) from which the recess (2) leads into the housing base body (3), and the encapsulant (4) extends outward from the chip well (21) over the wall into the trench (22). A corresponding housing base body is also disclosed.

    摘要翻译： 公开了一种辐射发射和/或接收半导体部件，其包括至少一个辐射发射和/或接收半导体芯片（1），其布置在壳体基体（3）的凹部（2）中，并且被封装有 对由半导体芯片（1）发射和/或接收的电磁辐射容易透明的密封剂（4）。 凹部（2）包括其中固定有半导体芯片（1）的芯片阱（21）和在凹部（2）内部至少沿芯片阱（21）延伸的沟槽（22），使得 在芯片井（21）和沟槽（22）之间，壳体基体（3）包括壁（23），其从芯片井（21）的底面观察其顶点位于下表面的水平面 所述壳体基体（3）从所述凹部（2）引导到所述壳体基体（3）中，并且所述密封剂（4）从所述芯片孔（21）向外延伸到所述壁上进入所述沟槽（22）。 还公开了相应的壳体基体。