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    Optoelectronic component
    4.
    发明授权
    Optoelectronic component 有权
    光电元件

    公开(公告)号：US07838357B2

    公开(公告)日：2010-11-23

    申请号：US10494160

    申请日：2002-10-28

    申请人： Georg Bogner ,  Herbert Brunner ,  Gertrud Kräuter ,  Gunter Waitl

    发明人： Georg Bogner ,  Herbert Brunner ,  Gertrud Kräuter ,  Gunter Waitl

    IPC分类号： H01L218/8238

    CPC分类号： H01L33/486 ,  H01L33/483 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： Optoelectronic component, having a housing body (2), an optoelectronic semiconductor chip (3) arranged in a recess (6) of the housing body, and having electrical terminals (1A, 1B), the semiconductor chip being electrically conductively connected to the electrical terminals of the leadframe. The housing body (2) is formed from an encapsulation material, with a filler which has a high degree of reflection in a wavelength range from the UV range.

    摘要翻译： 具有壳体（2），布置在壳体主体的凹部（6）中的光电子半导体芯片（3），并具有电端子（1A，1B）的光电子部件，该半导体芯片导电地连接到电气 引线框的端子。 壳体（2）由封装材料形成，其具有在从UV范围的波长范围内具有高反射度的填料。

    Diode housing
    7.
    发明授权
    Diode housing 有权
    二极管外壳

    公开(公告)号：US07696590B2

    公开(公告)日：2010-04-13

    申请号：US12055863

    申请日：2008-03-26

    申请人： Gunter Waitl ,  Herbert Brunner

    发明人： Gunter Waitl ,  Herbert Brunner

    IPC分类号： H01L31/02 ,  H01L21/50

    CPC分类号： H01L33/486 ,  H01L24/45 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting diodes. The housing includes a conductor strip that is punched into two electrically isolated portions. The housing further includes a cavity extending inwards from the top of the housing. The conductor portions include respective areas that are exposed at the bottom of the cavity. The semiconductor chip is bonded to one of the exposed areas and a wire bonds the chip to the second exposed area. The conductor portions also terminate in exposed electrodes, which allow for electrical connection of the chip with external devices. A window is formed in the cavity and the walls of the housing that form the cavity may be made of a reflective material. The electrodes remain unexposed to the window but for any residual areas about the chip and bonding wire within the first and second exposed areas. By minimizing the area of the conductor exposed to the window, delamination brought about by the different thermal expansions of the window and conductor are minimized and/or eliminated. Likewise, with a reflective housing covering the base of the cavity that accommodates the window, internal radiation reflection is increased over that which was achieved with an exposed conductor.

    摘要翻译： 设置容纳半导体芯片的壳体。 外壳和芯片可用于发送和/或接收辐射。 外壳的热门应用可能在发光二极管中。 壳体包括被冲压成两个电隔离部分的导体条。 壳体还包括从壳体的顶部向内延伸的腔体。 导体部分包括暴露在空腔底部的相应区域。 半导体芯片被接合到一个暴露区域，并且引线将芯片连接到第二暴露区域。 导体部分也终止在暴露的电极中，这允许芯片与外部装置的电连接。 在空腔中形成窗口，并且形成空腔的壳体的壁可以由反射材料制成。 电极保持未暴露于窗口，但是对于芯片周围的任何残留区域以及在第一和第二暴露区域内的接合线。 通过使暴露于窗户的导体的面积最小化，窗口和导体的不同热膨胀引起的分层被最小化和/或消除。 类似地，通过覆盖容纳窗口的空腔的基部的反射壳体，内部辐射反射增加超过用暴露的导体实现的内部辐射反射。

    Methods for the Production of Luminescent Diode Chips and Luminescent Diode Chip
    8.
    发明申请
    Methods for the Production of Luminescent Diode Chips and Luminescent Diode Chip 审中-公开
    发光二极管芯片和发光二极管芯片的制造方法

    公开(公告)号：US20080203410A1

    公开(公告)日：2008-08-28

    申请号：US11576057

    申请日：2005-08-04

    申请人： Herbert Brunner ,  Dieter Eissler ,  Berthold Hahn ,  Volker Harle ,  Harald Jager ,  Gertrud Krauter ,  Gunter Waitl

    发明人： Herbert Brunner ,  Dieter Eissler ,  Berthold Hahn ,  Volker Harle ,  Harald Jager ,  Gertrud Krauter ,  Gunter Waitl

    IPC分类号： H01L33/00

    CPC分类号： H01L33/508 ,  H01L2933/0041

    摘要： The invention relates to a method of making LED chips provided with a luminescence conversion material containing at least one phosphor. In the method, a layer composite is prepared that includes an LED layer sequence for a multiplicity of LED chips and comprises on a main surface at least one electrical contact surface for each LED chip, for electrically connecting said chip. A layer of adhesion promoter is applied to the main surface and selectively removed from at least portions of the contact surfaces. At least one phosphor is then applied to the main surface. Alternatively, a luminescence conversion material is applied to the main surface and selectively removed from at least portions of the contact surfaces. The invention also relates to an LED chip provided with a luminescence conversion material.

    摘要翻译： 本发明涉及制造具有含有至少一种荧光体的发光转换材料的LED芯片的方法。 在该方法中，制备层复合物，其包括用于多个LED芯片的LED层序列，并且在主表面上包括用于每个LED芯片的至少一个电接触表面，用于电连接所述芯片。 将一层粘合促进剂施加到主表面并且从至少部分接触表面选择性地除去。 然后将至少一种荧光体施加到主表面。 或者，将发光转换材料施加到主表面并且从至少部分接触表面选择性地去除。 本发明还涉及具有发光转换材料的LED芯片。