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22 条记录 (耗时 0.018 秒)

    Method of making solderable printed circuits formed without plating
    1.
    发明授权
    Method of making solderable printed circuits formed without plating 失效
    制造无电镀的可焊接印刷电路的方法

    公开(公告)号：US5045141A

    公开(公告)日：1991-09-03

    申请号：US214380

    申请日：1988-07-01

    申请人： George A. Salensky ,  Stephen B. Rimsa

    发明人： George A. Salensky ,  Stephen B. Rimsa

    IPC分类号： C08L71/00 ,  H05K1/09 ,  H05K3/20 ,  H05K3/28 ,  H05K3/34

    CPC分类号： H05K3/3452 ,  C08L71/00 ,  H05K3/207 ,  H05K1/095 ,  H05K2201/0129 ,  H05K2201/0166 ,  H05K2203/0537 ,  H05K2203/0783 ,  H05K3/28 ,  Y10T29/49124

    摘要： Described herein is a composite structure comprising a dielectric substrate surface with an electrically conductive layer or pathway thereon. The pathway comprises a thermoset resin and sufficient electrically conductive metal, in the configuration of an electric circuit element, to provide desired properties and direct solderability. Direct solderability is achieved without plating the electric circuit element. It has a low surface resistivity, preferably less than 10 m ohm per square. Also described are conductive, thixotropic inks for printed circuit devices which include silver powder and silver flake in its composition. A thixotropic adhesive for bonding the electric circuit element to the dielectric substrate surface is also taught. A method for making the composite structure is further disclosed.

    摘要翻译： 本文描述的是一种复合结构，其包括其上具有导电层或通路的电介质基片表面。 该路径包括热电树脂和足够的导电金属，在电路元件的构造中，以提供期望的性能和直接的可焊性。 在不电镀电路元件的情况下实现直接可焊性。 它具有低的表面电阻率，优选地小于10m欧姆/平方。 还描述了用于其组成中包括银粉和银薄片的印刷电路器件的导电的触变油墨。 还教导了用于将电路元件接合到电介质基板表面的触变粘合剂。 进一步公开了制造复合结构的方法。

    Process for using a composition for a solder mask
    7.
    发明授权
    Process for using a composition for a solder mask 失效
    使用焊料掩模用组合物的方法

    公开(公告)号：US4976813A

    公开(公告)日：1990-12-11

    申请号：US343744

    申请日：1989-04-27

    申请人： George A. Salensky ,  Thomas S. Thoman

    发明人： George A. Salensky ,  Thomas S. Thoman

    IPC分类号： B23K1/00 ,  C08G59/00 ,  C08G59/40 ,  C08G59/68 ,  C08L61/20 ,  C08L61/28 ,  C08L63/00 ,  C08L71/00 ,  C08L71/02 ,  C09K3/00 ,  H05K1/09 ,  H05K3/20 ,  H05K3/28

    CPC分类号： H05K3/285 ,  C08L71/00 ,  H05K3/207 ,  H05K1/095 ,  H05K2201/0129 ,  H05K2201/0166 ,  H05K2201/0209 ,  H05K2203/0537 ,  H05K2203/0783 ,  H05K3/28 ,  Y10S428/901

    摘要： This invention relates to a solder mask composition for thermoplastic substrates. The solder mask has critical components which include a polyhydroxyether and melamine formaldehyde. Other components include a solvent, filler and flow control agent. Optional ingredients include a colorant, epoxy resin and acid to promote the reaction of the composition. A surfactant can also be included. The solder mask provides the necessary flexibility and adhesion required for thermoplastic circuit boards. The mask can be applied directly to a circuit board or to a transfer medium for subsequent covering of a substrate. It relates to an article which can be a circuit board. It also relates to a process for making such composites which includes processing the solder mask.

    摘要翻译： 本发明涉及一种用于热塑性基材的焊料掩模组合物。 焊接掩模具有包括聚羟基醚和三聚氰胺甲醛的关键组分。 其他组分包括溶剂，填料和流动控制剂。 任选成分包括着色剂，环氧树脂和酸，以促进组合物的反应。 还可以包括表面活性剂。 焊接面罩为热塑性电路板提供了必要的灵活性和粘附性。 掩模可以直接施加到电路板或转移介质上，以便随后覆盖基板。 它涉及可以是电路板的物品。 它还涉及一种制备这种复合材料的方法，包括处理焊料掩模。