METHOD OF PATTERN FORMATION IN SEMICONDUCTOR FABRICATION
    1.
    发明申请
    METHOD OF PATTERN FORMATION IN SEMICONDUCTOR FABRICATION 有权
    半导体制造中图案形成的方法

    公开(公告)号:US20090053899A1

    公开(公告)日:2009-02-26

    申请号:US11841485

    申请日:2007-08-20

    IPC分类号: H01L21/311 G03C5/00

    摘要: Provided is a method of fabricating a semiconductor device. The method includes providing a substrate, forming a photo acid generator (PAG) layer on the substrate, exposing the PAG layer to radiation, and forming a photoresist layer on the exposed PAG layer. The exposed PAG layer generates an acid. The acid decomposes a portion of the formed photoresist layer. In one embodiment, the PAG layer includes organic BARC. The decomposed portion of the photoresist layer may be used as a masking element.

    摘要翻译: 提供一种制造半导体器件的方法。 该方法包括提供衬底,在衬底上形成光酸产生剂(PAG)层,将PAG层暴露于辐射,以及在曝光的PAG层上形成光致抗蚀剂层。 暴露的PAG层产生酸。 酸分解形成的光致抗蚀剂层的一部分。 在一个实施例中,PAG层包括有机BARC。 光致抗蚀剂层的分解部分可以用作掩模元件。

    PATTERN FORMATION IN SEMICONDUCTOR FABRICATION
    2.
    发明申请
    PATTERN FORMATION IN SEMICONDUCTOR FABRICATION 有权
    半导体制造中的图案形成

    公开(公告)号:US20100109054A1

    公开(公告)日:2010-05-06

    申请号:US12650719

    申请日:2009-12-31

    摘要: Provided is a semiconductor device. The device includes a substrate having a photo acid generator (PAG) layer on the substrate. The PAG layer is exposed to radiation. A photoresist layer is formed on the exposed PAG layer. The exposed PAG layer generates an acid. The acid decomposes a portion of the formed photoresist layer. In one embodiment, the PAG layer includes organic BARC. The decomposed portion of the photoresist layer may be used as a masking element.

    摘要翻译: 提供一种半导体器件。 该器件包括在衬底上具有光酸产生器(PAG)层的衬底。 PAG层暴露于辐射。 在曝光的PAG层上形成光致抗蚀剂层。 暴露的PAG层产生酸。 酸分解形成的光致抗蚀剂层的一部分。 在一个实施例中,PAG层包括有机BARC。 光致抗蚀剂层的分解部分可以用作掩模元件。

    Method of pattern formation in semiconductor fabrication
    3.
    发明授权
    Method of pattern formation in semiconductor fabrication 有权
    半导体制造中图案形成的方法

    公开(公告)号:US07648918B2

    公开(公告)日:2010-01-19

    申请号:US11841485

    申请日:2007-08-20

    IPC分类号: H01L21/467

    摘要: Provided is a method of fabricating a semiconductor device. The method includes providing a substrate, forming a photo acid generator (PAG) layer on the substrate, exposing the PAG layer to radiation, and forming a photoresist layer on the exposed PAG layer. The exposed PAG layer generates an acid. The acid decomposes a portion of the formed photoresist layer. In one embodiment, the PAG layer includes organic BARC. The decomposed portion of the photoresist layer may be used as a masking element.

    摘要翻译: 提供一种制造半导体器件的方法。 该方法包括提供衬底,在衬底上形成光酸产生剂(PAG)层,将PAG层暴露于辐射,以及在曝光的PAG层上形成光致抗蚀剂层。 暴露的PAG层产生酸。 酸分解形成的光致抗蚀剂层的一部分。 在一个实施例中,PAG层包括有机BARC。 光致抗蚀剂层的分解部分可以用作掩模元件。

    Pattern formation in semiconductor fabrication
    4.
    发明授权
    Pattern formation in semiconductor fabrication 有权
    半导体制造中的图案形成

    公开(公告)号:US08119533B2

    公开(公告)日:2012-02-21

    申请号:US12650719

    申请日:2009-12-31

    IPC分类号: H01L21/467 H01L23/58

    摘要: Provided is a semiconductor device. The device includes a substrate having a photo acid generator (PAG) layer on the substrate. The PAG layer is exposed to radiation. A photoresist layer is formed on the exposed PAG layer. The exposed PAG layer generates an acid. The acid decomposes a portion of the formed photoresist layer. In one embodiment, the PAG layer includes organic BARC. The decomposed portion of the photoresist layer may be used as a masking element.

    摘要翻译: 提供一种半导体器件。 该器件包括在衬底上具有光酸产生器(PAG)层的衬底。 PAG层暴露于辐射。 在曝光的PAG层上形成光致抗蚀剂层。 暴露的PAG层产生酸。 酸分解形成的光致抗蚀剂层的一部分。 在一个实施例中,PAG层包括有机BARC。 光致抗蚀剂层的分解部分可以用作掩模元件。

    Methodology for implementing enhanced optical lithography for hole patterning in semiconductor fabrication
    8.
    发明授权
    Methodology for implementing enhanced optical lithography for hole patterning in semiconductor fabrication 有权
    实现半导体制造中孔图案化的增强型光刻技术的方法

    公开(公告)号:US08472005B2

    公开(公告)日:2013-06-25

    申请号:US11677693

    申请日:2007-02-22

    IPC分类号: G03B27/54

    CPC分类号: G03F7/70425 G03F7/701

    摘要: System and method for enhancing optical lithography methodology for hole patterning in semiconductor fabrication are described. In one embodiment, a photolithography system comprises an illumination system for conditioning light from a light source, the illumination system producing a three-pore illumination pattern; a reticle comprising at least a portion of a pattern to be imaged onto a substrate, wherein the three-pore illumination pattern produced by the illumination system is projected through the reticle; and a projection lens disposed between the reticle and the substrate.

    摘要翻译: 描述了用于增强半导体制造中的孔图案化的光学光刻方法的系统和方法。 在一个实施例中,光刻系统包括用于调节来自光源的光的照明系统,所述照明系统产生三孔照明图案; 包括至少一部分要成像到基底上的图案的掩模版,其中由照明系统产生的三孔照明图案通过掩模版投射; 以及设置在掩模版和基板之间的投影透镜。

    Methodology For Implementing Enhanced Optical Lithography For Hole Patterning In Semiconductor Fabrication
    9.
    发明申请
    Methodology For Implementing Enhanced Optical Lithography For Hole Patterning In Semiconductor Fabrication 有权
    在半导体制造中实现孔图案的增强光刻法的方法

    公开(公告)号:US20080204688A1

    公开(公告)日:2008-08-28

    申请号:US11677693

    申请日:2007-02-22

    IPC分类号: G03B27/54

    CPC分类号: G03F7/70425 G03F7/701

    摘要: System and method for enhancing optical lithography methodology for hole patterning in semiconductor fabrication are described. In one embodiment, a photolithography system comprises an illumination system for conditioning light from a light source, the illumination system producing a three-pore illumination pattern; a reticle comprising at least a portion of a pattern to be imaged onto a substrate, wherein the three-pore illumination pattern produced by the illumination system is projected through the reticle; and a projection lens disposed between the reticle and the substrate.

    摘要翻译: 描述了用于增强半导体制造中的孔图案化的光学光刻方法的系统和方法。 在一个实施例中,光刻系统包括用于调节来自光源的光的照明系统,所述照明系统产生三孔照明图案; 包括至少一部分要成像到基底上的图案的掩模版,其中由照明系统产生的三孔照明图案通过掩模版投射; 以及设置在掩模版和基板之间的投影透镜。

    Method for etching an ultra thin film
    10.
    发明授权
    Method for etching an ultra thin film 有权
    蚀刻超薄膜的方法

    公开(公告)号:US08623231B2

    公开(公告)日:2014-01-07

    申请号:US12137186

    申请日:2008-06-11

    摘要: A method for etching an ultra thin film is provided which includes providing a substrate having the ultra thin film formed thereon, patterning a photosensitive layer formed over the ultra thin film, etching the ultra thin film using the patterned photosensitive layer, and removing the patterned photosensitive layer. The etching process includes utilizing an etch material with a diffusion resistant carrier such that the etch material is prevented from diffusing to a region underneath the photosensitive layer and removing portions of the ultra thin film underneath the photosensitive layer.

    摘要翻译: 提供了一种用于蚀刻超薄膜的方法,其包括提供其上形成有超薄膜的基板,对形成在超薄膜上的感光层进行图案化,使用图案化感光层蚀刻超薄膜,以及去除图案化感光层 层。 蚀刻工艺包括利用具有抗扩散性载体的蚀刻材料,使得防止蚀刻材料扩散到感光层下方的区域并去除感光层下面的超薄膜的部分。