公开(公告)号：US5102828A

公开(公告)日：1992-04-07

申请号：US340696

申请日：1989-04-20

Applicant: Giuseppe Marchisi

Inventor： Giuseppe Marchisi

IPC: G06K19/077 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498

CPC classification number: H01L23/49855 ,  G06K19/07743 ,  H01L23/3107 ,  H01L23/49534 ,  H01L2924/0002 ,  Y10T29/49121 ,  Y10T29/49135

Abstract: Two superimposed series of electric contacts in the shape of metal-sheet strips, electrically connected to a metallic place which supports a semiconductor chip, are electrically separated but mechanically connected by an interposed layer of adhesive material at high insulation. The whole is completely inserted in a covering of insulating material, which forms a flat support, from which, at opposite faces, only limited adjacent contact portions of said electric contacts emerge.The place and at least one of the two series of contacts make part of a single starting metallic frame, on which the other series of contacts is superimposed. This latter in its turn can make part of the same metallic frame and to be superimposed by refolding or can be prepared separately and then applied on the first series.

公开(公告)号：US4649460A

公开(公告)日：1987-03-10

申请号：US701221

申请日：1985-02-13

Applicant: Giuseppe Marchisi ,  Carlo C. De Martiis

Inventor： Giuseppe Marchisi ,  Carlo C. De Martiis

IPC: H01L23/04 ,  H01L21/02 ,  H01L21/683 ,  H01L23/02 ,  H01L23/047 ,  H01L23/367 ,  H01L23/40 ,  H01L23/50

CPC classification number: H01L23/047 ,  H01L23/3675 ,  H01L23/4006 ,  H01L2023/405 ,  H01L2023/4087 ,  H01L2924/0002 ,  Y10T29/49121

Abstract: An insulating package premolded on a metallic frame with electrical contacts contains in an inner space a semiconductor chip which rests on a thermic dissipator and is connected to the electrical contacts. The inner space of the package is closed on top by a cover provided with a lateral extension with a bent end, which operates not only as a cover, but also as a means for fastening and thrusting the package toward a support surface.

Abstract translation: 在具有电触头的金属框架上预先包覆的绝缘封装在内部空间中包含一个半导体芯片，该半导体芯片放置在热消散器上并连接到电触头。 包装的内部空间在顶部由盖子封闭，盖子具有弯曲端部的横向延伸部分，其不仅作为盖子操作，而且还用作将包装件紧固并推向支撑表面的装置。

公开(公告)号：US5763296A

公开(公告)日：1998-06-09

申请号：US289773

申请日：1994-08-12

Applicant: Paolo Casati ,  Marziano Corno ,  Giuseppe Marchisi

Inventor： Paolo Casati ,  Marziano Corno ,  Giuseppe Marchisi

IPC: H01L21/60 ,  H01L23/28 ,  H01L23/29 ,  H01L23/433 ,  H01L23/495 ,  H01L23/50 ,  H01L21/56 ,  H01L21/58

CPC classification number: H01L24/49 ,  H01L23/4334 ,  H01L23/49541 ,  H01L23/49579 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/85207 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/181

Abstract: A process for making an electronic device structure which comprises a metal plate, a semiconductor material chip attached to the plate, terminal leads, interconnection wires between the leads and metallized regions of the chip, and a plastic body which encapsulates the whole with the exception of a surface of the plate and part of the leads. This structure has means of electrical connection between at least one metallized region and the metal plate which comprise at least one metal beam resting onto the plate and being attached thereto by studs integral with the plate, and at least one wire welded between a metallized region of the chip and the metal beam between the studs. At least a portion of the beam and its connection wire are encapsulated within the plastics body.

Abstract translation: 一种用于制造电子器件结构的方法，包括金属板，附着在板上的半导体材料芯片，端子引线，芯片的引线和金属化区域之间的互连线，以及封装整体的塑料体，除了 板的表面和引线的一部分。 该结构具有在至少一个金属化区域和金属板之间的电连接的装置，该金属板包括至少一个搁置在板上的金属梁，并通过与板成一体的螺柱与其连接，以及至少一根焊接在金属化区域 芯片和金属梁之间的螺柱。 梁和其连接线的至少一部分被封装在塑料体内。

公开(公告)号：US5629574A

公开(公告)日：1997-05-13

申请号：US86170

申请日：1993-06-30

Applicant: Carlo Cognetti ,  Giuseppe Marchisi

Inventor： Carlo Cognetti ,  Giuseppe Marchisi

IPC: H02K5/22 ,  H02K11/04 ,  H02K23/66 ,  H02K11/00 ,  H01L23/28 ,  H02K1/04 ,  H02K15/00

CPC classification number: H02K5/225 ,  H02K11/33 ,  H02K23/66 ,  H01L2924/0002 ,  H02K2211/03

Abstract: A control interface device for an electric motor, particularly an electric motor for operating servomechanisms on a vehicle, which includes a conductor frame, an active integrated component mounted on the conductor frame, and a plurality of electric connectors. A single insulating, one-piece enclosing body contains the conductor frame with the active integrated component and the electric connectors included to the conductor frame. Thus, all of the elements required for powering and controlling the motor are gathered inside a single enclosing body which is convenient to handle and connect.

Abstract translation: 一种用于电动机的控制接口装置，特别是用于在车辆上操作伺服机构的电动机，其包括导体框架，安装在导体框架上的有源集成部件和多个电连接器。 单个绝缘的一体封闭体包含具有有源集成部件的导体框架和包括在导体框架中的电连接器。 因此，电动机控制所需的所有元件都集中在一个容易处理和连接的封闭体内。

公开(公告)号：US4467522A

公开(公告)日：1984-08-28

申请号：US367602

申请日：1982-04-12

Applicant: Giuseppe Marchisi

Inventor： Giuseppe Marchisi

IPC: H01L23/36 ,  H01L21/56 ,  H01L23/28 ,  H01L23/495 ,  H05K3/32

CPC classification number: H01L23/49568 ,  H01L21/56 ,  H01L2224/48091 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12033 ,  H01L2924/14 ,  Y10T29/49121 ,  Y10T29/49144 ,  Y10T29/49146

Abstract: A metal mass serving as a heat disperser is placed in a die in which a number of plastic containers are to be die-cast at each outlet hole of the extractors in the die. The thrust surfaces of the extractors have a central depression and the dispersers have a projection matching the depression.

Abstract translation: 将用作热分散器的金属块放置在模具中，在模具中，在模具中的多个塑料容器将在模具中的提取器的每个出口处压铸。 提取器的推力表面具有中心凹陷，并且分散器具有与凹陷相匹配的突起。

公开(公告)号：USRE37707E1

公开(公告)日：2002-05-21

申请号：US08674661

申请日：1996-07-02

Applicant: Pieramedeo Bozzini ,  Giuseppe Marchisi

Inventor： Pieramedeo Bozzini ,  Giuseppe Marchisi

IPC: H01L29495

CPC classification number: H01L23/49541 ,  H01L23/49503 ,  H01L23/49568 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An improved leadframe for packages of integrated power devices which, by virtue of its configuration, allows to press the dissipator on the bottom of the shell during the molding of the plastic case, without the dissipator having exposed portions of its inner face (which is in contact with the chip). In order to achieve this, the leadframe according to the invention comprises a monolithic body which defines a perimetric frame, the leads and the dissipator. The dissipator extends in a depressed plane with respect to the frame and is connected to the frame and to the leads in at least three step-like points which are mutually spaced and non-aligned. During the molding of the plastic case, a pressure is exerted on the frame and is transmitted to the dissipator by the three step-like points, so that the dissipator is effectively pressed flat against the bottom of the mold without using pushers which pass through the plastic case.

Abstract translation: 一种用于集成功率器件封装的改进的引线框架，其通过其构造允许在塑料外壳的模制期间将壳体的底部上的耗散器按压，而没有散热器具有其内表面的暴露部分 与芯片接触）。 为了实现这一点，根据本发明的引线框架包括限定周边框架，引线和耗散器的整体体。 散热器相对于框架在凹陷平面中延伸，并且在相互间隔和不对准的至少三个阶梯状点处连接到框架和引线。 在塑料外壳的模制过程中，压力施加在框架上，并通过三个阶梯状点传递到散热器，从而使散热器有效地压靠在模具的底部，而不需要使用通过 塑料外壳。

公开(公告)号：US5521439A

公开(公告)日：1996-05-28

申请号：US222282

申请日：1994-04-05

Applicant: Paolo Casati ,  Giuseppe Marchisi

Inventor： Paolo Casati ,  Giuseppe Marchisi

IPC: H01L23/40 ,  H01L23/433 ,  H01L23/34

CPC classification number: H01L23/4334 ,  H01L23/4093 ,  H01L2924/0002

Abstract: A combination of an electronic semiconductor device comprising a metal plate and a plastics body which encapsulates the metal plate leaving at least a major surface thereof exposed, a heat sink, and means of fastening the heat sink to the device. To enable securement of the heat sink on the device without any external fastening arrangement having to be used, and without unduly straining the solder spot of the device pins to a printed circuit, the device is provided with undercut regions on opposite sides adjacent to the exposed surface of the plate for releasable engagement by the fastening means.

Abstract translation: 包括金属板和塑料体的电子半导体器件的组合，所述塑料体封装金属板至少留下其主表面，散热器以及将散热器紧固到器件的装置。 为了能够将散热器固定在设备上，而不需要使用任何外部紧固装置，并且不会将器件引脚的焊点过度拉紧到印刷电路上，器件在暴露的相邻侧面上设置有切削区域 板的表面，用于通过紧固装置可释放地接合。

公开(公告)号：US5338971A

公开(公告)日：1994-08-16

申请号：US982314

申请日：1992-11-27

Applicant: Paolo Casati ,  Marziano Corno ,  Giuseppe Marchisi

Inventor： Paolo Casati ,  Marziano Corno ,  Giuseppe Marchisi

IPC: H01L21/60 ,  H01L23/28 ,  H01L23/29 ,  H01L23/433 ,  H01L23/495 ,  H01L23/50 ,  H01L23/48 ,  H01L23/02 ,  H01L23/44 ,  H01L23/52

CPC classification number: H01L24/49 ,  H01L23/4334 ,  H01L23/49541 ,  H01L23/49579 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/85207 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/181

Abstract: An electronic device structure which comprises a metal plate, a semiconductor material chip attached to the plate, terminal leads, interconnection wires between the leads and metallized regions of the chip, and a plastic body which encapsulates the whole with the exception of a surface of the plate and part of the leads. This structure has highly reliable means of electrical connection between at least one metallized region and the metal plate which comprise at least one metal beam resting onto the plate and being attached thereto by studs integral with the plate, and at least one wire welded between a metallized region of the chip and the metal beam between the studs. At least a portion of the beam and its connection wire are encapsulated within the plastics body.

Abstract translation: 一种电子器件结构，其包括金属板，附着到所述板的半导体材料芯片，端子引线，所述芯片的引线和金属化区域之间的互连线，以及除了所述芯片的表面之外的封装整体的塑料体 板和部分引线。 该结构具有至少一个金属化区域和金属板之间的电连接的高度可靠的装置，该金属板包括至少一个搁置在板上的金属梁，并且通过与该板一体的螺栓与其连接，以及至少一根焊接在金属化 芯片的区域和螺柱之间的金属梁。 梁和其连接线的至少一部分被封装在塑料体内。

公开(公告)号：US5113240A

公开(公告)日：1992-05-12

申请号：US656386

申请日：1991-02-19

Applicant: Pieramedeo Bozzini ,  Giuseppe Marchisi

Inventor： Pieramedeo Bozzini ,  Giuseppe Marchisi

IPC: H01L23/28 ,  H01L23/495 ,  H01L23/50

CPC classification number: H01L23/49541 ,  H01L23/49503 ,  H01L23/49568 ,  H01L2924/0002

Abstract: An improved leadframe for packages of integrated power devices which, by virtue of its configuration, allows to press the dissipator on the bottom of the shell during the molding of the plastic case, without the dissipator having exposed portions of its inner face (which is in contact with the chip). In order to achieve this, the leadframe according to the invention comprises a monolithic body which defines a perimetric frame, the leads and the dissipator. The dissipator extends in a depressed plane with respect to the frame and is connected to the frame and to the leads in at least three step-like points which are mutually spaced and non-aligned. During the molding of the plastic case, a pressure is exerted on the frame and is transmitted to the dissipator by the three step-like points, so that the dissipator is effectively pressed flat against the bottom of the mold without using pushers which pass through the plastic case.

公开(公告)号：US5244838A

公开(公告)日：1993-09-14

申请号：US784303

申请日：1991-10-31

Applicant: Paolo Casati ,  Carlo C. De Martiis ,  Giuseppe Marchisi

Inventor： Paolo Casati ,  Carlo C. De Martiis ,  Giuseppe Marchisi

IPC: H01L21/56 ,  H01L23/433

CPC classification number: H01L23/4334 ,  H01L21/565 ,  H01L2924/0002 ,  Y10S425/228 ,  Y10T29/49121

Abstract: A die-stamped frame is fastened to a heat sink metal baseplate by wedging flexible tabs into receiving indentations of the baseplate while keeping the frame substantially in contact with the surface of the baseplate. The wire welding operations may then take place on the end of the fingers of the patterned metal frame while the same are solidly resting on the surface of the baseplate thus facilitating the welding. The backing-off of the metal frame from the surface of the heat sink baseplate takes place upon the closing of the mold used for encapsulating in resin the device. The injection of the resin and its solidification "freezes" the pins in the backed-off position imposed by the mold upon closing, thus ensuring the electrical isolation between the pins and the integral heat sink baseplate.