Abstract:
Methods for eliminating the distance between a BULEX and SOI and the resulting devices are disclosed. Embodiments include providing a silicon layer on a BOX layer on a silicon substrate; forming two active areas in the silicon layer, separated by a space; forming first and second polysilicon gates over one active area, a third polysilicon gate over the space, and fourth and fifth polysilicon gates over the other active area, the second and fourth gates abutting edges of the space; forming spacers at opposite sides of each gate; removing the second, third, and fourth gates and the corresponding spacers; removing the silicon layer and BOX layer in the space, forming a trench and exposing the silicon substrate; forming second spacers on sidewalls of the trench; forming raised source/drain regions on each active area; and forming a p-well contact on the silicon substrate between the second spacers.
Abstract:
A method is provided for fabricating cross-coupled line segments on a wafer for use, for instance, in fabricating cross-coupled gates of two or more transistors. The fabricating includes: patterning a first line segment with a first side projection using a first mask; and patterning a second line segment with a second side projection using a second mask. The second line segment is offset from the first line segment, and the patterned second side projection overlies the patterned first side projection, and facilitates defining a cross-stitch segment connecting the first and second line segments. The method further includes selectively cutting the first and second line segments in defining the cross-coupled line segments from the first and second line segments and the cross-stitch segment.
Abstract:
The present disclosure relates to an isolation region between semiconductor devices and methods of fabrication. Embodiments include device having a silicon-on-insulator (SOI) substrate; a dummy gate between two metal gates formed over the SOI substrate, the dummy gate providing a physical diffusion break between the two metal gates; raised source/drain (S/D) regions formed on sides of the metal gates; and interlayer dielectric formed over the dummy gate, raised S/D regions and metal gates and in openings on sides of the dummy gate.
Abstract:
A method is provided, in which a masking reticle including a plurality of pattern blocks is modified, the modifying including: identifying a first pattern block and a second pattern block of the plurality of pattern blocks where at least a first portion of the first pattern block and a second portion of the second pattern block are in parallel relation; and reducing a length of the first portion of the first pattern block when a transverse separation S between corresponding length edges of the first portion of the first pattern block the second portion of the second pattern block falls within a pre-defined forbidden pitch range for the masking reticle. The method may include repeating the identifying and reducing of pairs of pattern blocks on the mask reticle to remove portions of pattern block pairs spaced apart by a transverse separation falling within a forbidden-pitch range.
Abstract:
A method is provided for fabricating cross-coupled line segments for use, for instance, as a hard mask in fabricating cross-coupled gates of two or more transistors. Fabricating the structure includes: providing a sacrificial mandrel on the substrate, the sacrificial mandrel including a transverse gap through the mandrel separating the sacrificial mandrel into a first mandrel portion and a second mandrel portion; providing a sidewall spacer along sidewalls of the sacrificial mandrel, where sidewall spacers along sidewalls of the first mandrel portion and the second mandrel portion merge within the transverse gap and form a crossbar; and removing the sacrificial mandrel and selectively cutting the sidewall spacers to define the cross-coupled line segments from the sidewall spacers and crossbar. The transverse gap may be provided by directly printing the first and second mandrel portions spaced apart, or by cutting the sacrificial mandrel to provide the gap.