公开(公告)号：US06731353B1

公开(公告)日：2004-05-04

申请号：US10144166

申请日：2002-05-10

申请人： Thomas L. Credelle ,  Omar Alvarado ,  Gordon S. W. Craig ,  Mark A. Hadley ,  Kenneth D. Schatz

发明人： Thomas L. Credelle ,  Omar Alvarado ,  Gordon S. W. Craig ,  Mark A. Hadley ,  Kenneth D. Schatz

IPC分类号： G02F1136

CPC分类号： H01L24/95 ,  H01L21/67144 ,  H01L21/6838 ,  H01L23/13 ,  H01L25/0655 ,  H01L29/0657 ,  H01L2224/95085 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165

摘要： An apparatus and methods of using the same for transferring functional blocks to a substrate. In one exemplary embodiment, a plurality of functional blocks is deposited in a relocating tool having a first plurality of receptor sites. A transfer tool having a plurality of nozzles in aligning with the first plurality of receptor sites removes the plurality of functional blocks from the relocating tool. The transfer tool then deposits the plurality of functional blocks into a second plurality of receptor sites in a substrate. The receptor sites comprise adhesives for securing the functional blocks. Vibration and water are used to facilitate proper delivery of the functional blocks to the receptor sites.

摘要翻译： 使用该功能块将功能块转移到基板的装置和方法。 在一个示例性实施例中，多个功能块被沉积在具有第一多个受体位点的重定位工具中。 具有与第一多个受体部位对准的多个喷嘴的转移工具从重新定位工具中移除多个功能块。 然后，转移工具将多个功能块沉积到衬底中的第二多个受体位点。 受体部位包括用于固定功能块的粘合剂。 使用振动和水来促进将功能块正确递送到受体位点。

公开(公告)号：US07244326B2

公开(公告)日：2007-07-17

申请号：US10846753

申请日：2004-05-13

申请人： Gordon S. W. Craig ,  Kenneth D. Schatz ,  Mark A. Hadley ,  Paul S. Drzaic

发明人： Gordon S. W. Craig ,  Kenneth D. Schatz ,  Mark A. Hadley ,  Paul S. Drzaic

IPC分类号： B32B37/00

CPC分类号： G06K19/07718 ,  G06K19/07745 ,  H01L21/673 ,  H01L21/6835 ,  H01L23/49855 ,  H01L23/544 ,  H01L24/19 ,  H01L24/76 ,  H01L24/81 ,  H01L24/95 ,  H01L2221/68313 ,  H01L2221/68354 ,  H01L2223/54473 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/7665 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2224/95085 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K3/303 ,  H05K2201/10636 ,  H05K2203/0173 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T156/17 ,  Y10T156/171 ,  Y10T156/1744 ,  Y10T156/1798 ,  H01L2924/00

摘要： A method for assembling a device. The method comprises placing a functional element in a first opening formed in a template substrate and transferring the functional element to a device substrate having a second opening formed therein wherein the functional element is held within the second opening and against an adhesive film coupled to the device substrate.

摘要翻译： 一种组装装置的方法。 该方法包括将功能元件放置在形成于模板衬底中的第一开口中，并将功能元件转移到具有形成在其中的第二开口的器件衬底，其中功能元件保持在第二开口内并抵靠与该器件相连的粘合膜 基质。

公开(公告)号：US07931063B2

公开(公告)日：2011-04-26

申请号：US11820603

申请日：2007-06-19

申请人： Gordon S. W. Craig ,  Kenneth D. Schatz ,  Mark A. Hadley ,  Paul S. Drzaic

发明人： Gordon S. W. Craig ,  Kenneth D. Schatz ,  Mark A. Hadley ,  Paul S. Drzaic

IPC分类号： B32B37/00

CPC分类号： G06K19/07718 ,  G06K19/07745 ,  H01L21/673 ,  H01L21/6835 ,  H01L23/49855 ,  H01L23/544 ,  H01L24/19 ,  H01L24/76 ,  H01L24/81 ,  H01L24/95 ,  H01L2221/68313 ,  H01L2221/68354 ,  H01L2223/54473 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/7665 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2224/95085 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K3/303 ,  H05K2201/10636 ,  H05K2203/0173 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T156/17 ,  Y10T156/171 ,  Y10T156/1744 ,  Y10T156/1798 ,  H01L2924/00

摘要： A method for assembling a device. The method comprises placing a functional element in a first opening formed in a template substrate and transferring the functional element to a device substrate having a second opening formed therein wherein the functional element is held within the second opening and against an adhesive film coupled to the device substrate.

摘要翻译： 一种组装装置的方法。 该方法包括将功能元件放置在形成于模板衬底中的第一开口中，并将功能元件转移到具有形成在其中的第二开口的器件衬底，其中功能元件保持在第二开口内并抵靠与该器件相连的粘合膜 基质。

公开(公告)号：US07531218B2

公开(公告)日：2009-05-12

申请号：US11639858

申请日：2006-12-15

申请人： John Stephen Smith ,  Mark A. Hadley ,  Gordon S. W. Craig ,  Frank Lowe

发明人： John Stephen Smith ,  Mark A. Hadley ,  Gordon S. W. Craig ,  Frank Lowe

IPC分类号： B05D3/12

CPC分类号： H01L24/32 ,  B82Y30/00 ,  H01L21/31122 ,  H01L21/32136 ,  H01L21/84 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L27/1214 ,  H01L28/55 ,  H01L2224/24225 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/95085 ,  H01L2224/95092 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2224/95144 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/15788 ,  Y10S977/882 ,  Y10S977/883 ,  H01L2224/82 ,  H01L2924/00

摘要： Methods and apparatuses for assembling a structure onto a substrate. A method according to one aspect of the invention includes dispensing a slurry onto a substrate wherein the slurry includes a first plurality of elements, each of which is designed to mate with a receptor region on said substrate and each of which comprises a functional element, and wherein the slurry also includes a second plurality of elements which are not designed to mate with receptor regions on the substrate. Typically, these second plurality of elements help movement of the first plurality of elements.

摘要翻译： 将结构组装到基板上的方法和装置。 根据本发明的一个方面的方法包括将浆料分配到基底上，其中所述浆料包括第一多个元件，每个元件设计成与所述基底上的受体区域配合，并且每个元件包括功能元件，以及 其中所述浆料还包括不被设计成与所述基底上的受体区域配合的第二多个元件。 通常，这些第二多个元件有助于第一多个元件的移动。

公开(公告)号：US07172789B2

公开(公告)日：2007-02-06

申请号：US10634350

申请日：2003-08-04

申请人： John Stephen Smith ,  Mark A. Hadley ,  Gordon S. W. Craig ,  Frank Lowe

发明人： John Stephen Smith ,  Mark A. Hadley ,  Gordon S. W. Craig ,  Frank Lowe

IPC分类号： B05D5/06

CPC分类号： H01L24/32 ,  B82Y30/00 ,  H01L21/31122 ,  H01L21/32136 ,  H01L21/84 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L27/1214 ,  H01L28/55 ,  H01L2224/24225 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/95085 ,  H01L2224/95092 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2224/95144 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/15788 ,  Y10S977/882 ,  Y10S977/883 ,  H01L2224/82 ,  H01L2924/00

摘要： Methods and apparatuses for assembling a structure onto a substrate. A method according to one aspect of the invention includes dispensing a slurry onto a substrate wherein the slurry includes a first plurality of elements, each of which is designed to mate with a receptor region on said substrate and each of which comprises a functional element. The method further includes dispensing in a flow having a first direction a slurry onto a substrate, wherein the slurry includes a fluid.

摘要翻译： 将结构组装到基板上的方法和装置。 根据本发明的一个方面的方法包括将浆料分配到基底上，其中所述浆料包括第一多个元件，每个元件设计成与所述基底上的受体区域配合，并且每个元件包括功能元件。 该方法还包括将具有第一方向的流浆分配到基底上，其中浆料包括流体。

公开(公告)号：US06468638B2

公开(公告)日：2002-10-22

申请号：US09268755

申请日：1999-03-16

申请人： Jeffrey Jay Jacobsen ,  Glenn Wilhelm Gengel ,  Mark A. Hadley ,  Gordon S. W. Craig ,  John Stephen Smith

发明人： Jeffrey Jay Jacobsen ,  Glenn Wilhelm Gengel ,  Mark A. Hadley ,  Gordon S. W. Craig ,  John Stephen Smith

IPC分类号： H05L100

CPC分类号： H01L24/95 ,  H01L23/5387 ,  H01L23/5389 ,  H01L24/18 ,  H01L24/50 ,  H01L24/82 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/18 ,  H01L2224/76155 ,  H01L2224/7665 ,  H01L2224/82102 ,  H01L2224/95085 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/30105 ,  Y10S428/901 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/31681 ,  H01L2224/82 ,  H01L2924/00

摘要： Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to depositing a plurality of blocks onto a substrate and is coupled to a flexible layer having interconnect deposited thereon. Another embodiment of the invention relates to forming a display along a length of a flexible layer wherein a slurry containing a plurality of elements with circuit elements thereon washes over the flexible layer and slides into recessed regions or holes found in the flexible layer. Interconnect is then deposited thereon. In another embodiment, interconnect is placed on the flexible layer followed by a slurry containing a plurality of elements.

摘要翻译： 要求保护用于形成显示器的装置和方法。 本发明的一个实施例涉及将多个块沉积到衬底上并且耦合到其上沉积有互连的柔性层。 本发明的另一个实施方案涉及沿着柔性层的长度形成显示器，其中包含多个元件的浆料在其上洗涤在柔性层上并且滑入在柔性层中发现的凹陷区域或孔中。 然后在其上沉积互连。 在另一个实施例中，互连被放置在柔性层上，随后是含有多个元件的浆料。

公开(公告)号：US07353598B2

公开(公告)日：2008-04-08

申请号：US11268837

申请日：2005-11-07

申请人： Gordon S. W. Craig ,  Ali A. Tootoonchi ,  Randolph W. Eisenhardt ,  Scott Herrmann ,  Mark A. Hadley ,  Paul S. Drzaic

发明人： Gordon S. W. Craig ,  Ali A. Tootoonchi ,  Randolph W. Eisenhardt ,  Scott Herrmann ,  Mark A. Hadley ,  Paul S. Drzaic

IPC分类号： H05K3/32

CPC分类号： G06K19/07752 ,  G06K19/07749 ,  H01L23/49855 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L24/97 ,  H01L25/50 ,  H01L29/0657 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/20 ,  H01L2224/24101 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/95085 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10155 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  H01L2224/82

摘要： Methods and apparatuses for an electronic assembly. A material is selectively printed on a web substrate at one or more selected areas. The web substrate includes a plurality of functional components having integrated circuits. A local printing system equipped with a print head that dispenses the selected material is used to print. The print head is coupled to a guidance system capable of registering an alignment feature on the web substrate.

摘要翻译： 电子组件的方法和装置。 在一个或多个选定区域上将材料选择性地印刷在网状基材上。 网状基板包括具有集成电路的多个功能部件。 使用配备有分配所选材料的打印头的本地打印系统进行打印。 打印头连接到能够在纸幅基材上记录对准特征的引导系统。

公开(公告)号：US07214569B2

公开(公告)日：2007-05-08

申请号：US10769572

申请日：2004-01-30

申请人： Susan Swindlehurst ,  Mark A. Hadley ,  Paul S. Drzaic ,  Gordon S. W. Craig ,  Glenn Gengel ,  Scott Hermann ,  Aly Tootoochi ,  Randolph W. Eisenhardt

发明人： Susan Swindlehurst ,  Mark A. Hadley ,  Paul S. Drzaic ,  Gordon S. W. Craig ,  Glenn Gengel ,  Scott Hermann ,  Aly Tootoochi ,  Randolph W. Eisenhardt

IPC分类号： H01L21/00 ,  H01L21/44

CPC分类号： G06K19/07752 ,  G06K19/077 ,  H01L23/49855 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/19 ,  H01L24/24 ,  H01L24/29 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/90 ,  H01L24/95 ,  H01L24/97 ,  H01L29/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13019 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/13499 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24011 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/24225 ,  H01L2224/24227 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/76155 ,  H01L2224/81201 ,  H01L2224/81205 ,  H01L2224/81207 ,  H01L2224/81224 ,  H01L2224/81801 ,  H01L2224/81898 ,  H01L2224/81903 ,  H01L2224/82102 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83865 ,  H01L2224/83868 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/95085 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/10158 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/3011 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2924/00012 ,  H01L2224/05599

摘要： An apparatus incorporating small-feature size and large-feature-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated circuit coupling to a first conductor disposed on the substrate. The first conductor is made of a thermosetting or a thermoplastic material including conductive fillers. A large-scale component having a second conductor is electrically coupled to the first conductor to electrically couple the large-scale component to the integrated circuit. The large-scale component includes a second substrate.

摘要翻译： 包含小特征尺寸和大特征尺寸组件的装置。 该装置包括带状物，其带有包含集成电路的基板。 集成电路耦合到设置在基板上的第一导体。 第一导体由包括导电填料的热固性或热塑性材料制成。 具有第二导体的大规模部件电耦合到第一导体，以将大尺寸部件电耦合到集成电路。 大规模部件包括第二基板。

公开(公告)号：US07070851B2

公开(公告)日：2006-07-04

申请号：US10176795

申请日：2002-06-21

申请人： Jeffrey Jay Jacobsen ,  Glenn Wilhelm Gengel ,  Mark A. Hadley ,  Gordon S. W. Craig ,  John Stephen Smith

发明人： Jeffrey Jay Jacobsen ,  Glenn Wilhelm Gengel ,  Mark A. Hadley ,  Gordon S. W. Craig ,  John Stephen Smith

IPC分类号： B32B3/00 ,  H05K7/02

CPC分类号： H01L24/95 ,  H01L23/5387 ,  H01L23/5389 ,  H01L24/18 ,  H01L24/50 ,  H01L24/82 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/18 ,  H01L2224/76155 ,  H01L2224/7665 ,  H01L2224/82102 ,  H01L2224/95085 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/30105 ,  Y10S428/901 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/31681 ,  H01L2224/82 ,  H01L2924/00

摘要： Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to depositing a plurality of blocks onto a substrate and is coupled to a flexible layer having interconnect deposited thereon. Another embodiment of the invention relates to forming a display along a length of a flexible layer wherein a slurry containing a plurality of elements with circuit elements thereon washes over the flexible layer and slides into recessed regions or holes found in the flexible layer. Interconnect is then deposited thereon. In another embodiment, interconnect is placed on the flexible layer followed by a slurry containing a plurality of elements.

公开(公告)号：US07967204B2

公开(公告)日：2011-06-28

申请号：US12248020

申请日：2008-10-08

申请人： Mark A. Hadley ,  Curt L. Carrender ,  John Stephen Smith ,  Gordon S. W. Craig

发明人： Mark A. Hadley ,  Curt L. Carrender ,  John Stephen Smith ,  Gordon S. W. Craig

IPC分类号： G06K7/08

CPC分类号： G06K19/07718 ,  G06K19/07749 ,  G06K19/07752 ,  G06K19/07756 ,  H01L23/66 ,  H01L24/19 ,  H01L24/24 ,  H01L24/83 ,  H01L24/95 ,  H01L24/97 ,  H01L25/50 ,  H01L29/0657 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/83136 ,  H01L2224/95085 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y10T29/53178 ,  H01L2224/82 ,  H01L2224/83851 ,  H01L2924/00

摘要： A Radio Frequency Identification (RFID) device. The RFID device comprises an antenna assembly and a resonator assembly. The antenna assembly comprises a first substrate and an antenna element. The resonator assembly comprises a second substrate having an integrated circuit connected to a resonator loop. The first substrate and the second substrate are attached to one another. The integrated circuit electrically couples to the antenna element without a direct mechanical contact.

摘要翻译： 射频识别（RFID）设备。 RFID设备包括天线组件和谐振器组件。 天线组件包括第一基板和天线元件。 谐振器组件包括具有连接到谐振器回路的集成电路的第二衬底。 第一基板和第二基板彼此附接。 集成电路电耦合到天线元件而不直接机械接触。