CMOS semiconductor device and method of fabricating the same
    4.
    发明申请
    CMOS semiconductor device and method of fabricating the same 有权
    CMOS半导体器件及其制造方法

    公开(公告)号:US20080203488A1

    公开(公告)日:2008-08-28

    申请号:US12007433

    申请日:2008-01-10

    IPC分类号: H01L29/00 H01L21/8238

    摘要: Example embodiments provide a complementary metal-oxide semiconductor (CMOS) semiconductor device and a method of fabricating the CMOS semiconductor device. The CMOS semiconductor device may include gates in the nMOS and pMOS areas, polycrystalline silicon (poly-Si) capping layers, metal nitride layers underneath the poly-Si capping layers, and a gate insulating layer underneath the gate. The metal nitride layers of the nMOS and pMOS areas may be formed of the same type of material and may have different work functions. Since a metal gate is formed of identical types of metal nitride layers, a process may be simplified, yield may be increased, and a higher-performance CMOS semiconductor device may be obtained.

    摘要翻译: 示例性实施例提供互补金属氧化物半导体(CMOS)半导体器件和制造CMOS半导体器件的方法。 CMOS半导体器件可以包括nMOS和pMOS区域中的栅极,多晶硅(多晶硅)覆盖层,多晶硅覆盖层下面的金属氮化物层以及栅极下方的栅极绝缘层。 nMOS和pMOS区域的金属氮化物层可以由相同类型的材料形成,并且可以具有不同的功函数。 由于金属栅极由相同类型的金属氮化物层形成,所以可以简化工艺,可以提高产率,并且可以获得更高性能的CMOS半导体器件。

    CMOS semiconductor device and method of fabricating the same
    5.
    发明授权
    CMOS semiconductor device and method of fabricating the same 有权
    CMOS半导体器件及其制造方法

    公开(公告)号:US07919820B2

    公开(公告)日:2011-04-05

    申请号:US12007433

    申请日:2008-01-10

    IPC分类号: H01L29/00

    摘要: Example embodiments provide a complementary metal-oxide semiconductor (CMOS) semiconductor device and a method of fabricating the CMOS semiconductor device. The CMOS semiconductor device may include gates in the nMOS and pMOS areas, polycrystalline silicon (poly-Si) capping layers, metal nitride layers underneath the poly-Si capping layers, and a gate insulating layer underneath the gate. The metal nitride layers of the nMOS and pMOS areas may be formed of the same type of material and may have different work functions. Since a metal gate is formed of identical types of metal nitride layers, a process may be simplified, yield may be increased, and a higher-performance CMOS semiconductor device may be obtained.

    摘要翻译: 示例性实施例提供互补金属氧化物半导体(CMOS)半导体器件和制造CMOS半导体器件的方法。 CMOS半导体器件可以包括nMOS和pMOS区域中的栅极,多晶硅(多晶硅)覆盖层,多晶硅覆盖层下面的金属氮化物层以及栅极下方的栅极绝缘层。 nMOS和pMOS区域的金属氮化物层可以由相同类型的材料形成,并且可以具有不同的功函数。 由于金属栅极由相同类型的金属氮化物层形成,所以可以简化工艺,可以提高产率,并且可以获得更高性能的CMOS半导体器件。