Method of forming a cermet-containing bushing for an implantable medical device having a connecting layer
    1.
    发明授权
    Method of forming a cermet-containing bushing for an implantable medical device having a connecting layer 有权
    形成具有连接层的可植入医疗装置的含金属陶瓷套管的方法

    公开(公告)号:US09504840B2

    公开(公告)日:2016-11-29

    申请号:US14593637

    申请日:2015-01-09

    IPC分类号: A61N1/375 B23K1/00

    摘要: One aspect relates method of forming an electrical bushing for an implantable medical device, including generating at least one base body green compact for at least one base body from an insulating composition of materials. At least one cermet-containing conducting element green compact is formed for at least one conducting element. At least one conducting element green compact is introduced into the base body green compact. The insulation element green compact is connected to the at least one base body green compact in order to obtain at least one base body having at least one conducting element. A connecting layer is applied onto the at least one conducting element.

    摘要翻译: 一个方面涉及形成用于可植入医疗装置的电气衬套的方法,包括从绝缘材料组合物产生用于至少一个基体的至少一个基体生坯。 为至少一个导电元件形成至少一个含金属陶瓷的导电元件生坯。 至少一个导电元件绿色压块被引入基体绿色压块中。 绝缘元件生坯被连接到至少一个基体生坯上,以便获得至少一个具有至少一个导电元件的基体。 连接层施加到至少一个导电元件上。

    Lead connector with distal frame and method of manufacture
    3.
    发明授权
    Lead connector with distal frame and method of manufacture 有权
    带远端框架的导线连接器及制造方法

    公开(公告)号:US09209544B2

    公开(公告)日:2015-12-08

    申请号:US13756017

    申请日:2013-01-31

    摘要: A method of manufacturing a lead connector for an implantable medical device including connecting proximal ends of a plurality of conductive wires to an inner surface of a corresponding ring contact, placing a distal frame over distal ends of each of conducive wire of the plurality of conductive wires, the distal ends passing through corresponding shafts in the distal frame from a rear face of the distal frame and extending beyond a front face of the distal frame, arranging the distal frame along with the conductive wires and corresponding ring contacts within a mold cavity, filling the mold cavity with a mold material, the mold material abutting the rear face of the distal frame, and removing a resulting lead connector from the mold cavity.

    摘要翻译: 一种制造用于可植入医疗装置的引线连接器的方法,包括将多根导线的近端连接到相应的环形接触件的内表面,将远端框架放置在多根导线中的每个导电线的远端上 所述远端从所述远端框架的后表面穿过所述远端框架中的对应的轴并且延伸超过所述远端框架的前表面,将所述远端框架与所述导电线和相应的环形触点一起设置在模具腔内,填充 所述模腔具有模具材料,所述模具材料抵靠所述远端框架的后表面,并且从所述模具腔中移除所得到的导线连接器。

    CERAMIC BUSHING FOR AN IMPLANTABLE MEDICAL DEVICE
    4.
    发明申请
    CERAMIC BUSHING FOR AN IMPLANTABLE MEDICAL DEVICE 有权
    一种可植入医疗器械的陶瓷衬套

    公开(公告)号:US20150270025A1

    公开(公告)日:2015-09-24

    申请号:US14729560

    申请日:2015-06-03

    摘要: An electrical bushing for use in a housing of an implantable medical device is proposed. The electrical bushing includes at least one electrically insulating base body and at least one electrical conducting element. The conducting element establishes, through the base body, at least one electrically conductive connection between an internal space of the housing and an external space. The conducting element is hermetically sealed with respect to the base body, at least in part. The at least one conducting element includes at least one cermet. The cermet of the conducting element and the base body include one or more of the same ceramic compound.

    摘要翻译: 提出了用于可植入医疗装置的壳体中的电气套管。 电气套管包括至少一个电绝缘基体和至少一个导电元件。 导电元件通过基体设置在壳体的内部空间与外部空间之间的至少一个导电连接。 导电元件至少部分地相对于基体气密地密封。 至少一个导电元件包括​​至少一个金属陶瓷。 导电元件和基体的金属陶瓷包括一种或多种相同的陶瓷化合物。

    Ceramic bushing for an implantable medical device
    6.
    发明授权
    Ceramic bushing for an implantable medical device 有权
    用于可植入医疗器械的陶瓷衬套

    公开(公告)号:US09552899B2

    公开(公告)日:2017-01-24

    申请号:US14729560

    申请日:2015-06-03

    摘要: An electrical bushing for use in a housing of an implantable medical device is proposed. The electrical bushing includes at least one electrically insulating base body and at least one electrical conducting element. The conducting element establishes, through the base body, at least one electrically conductive connection between an internal space of the housing and an external space. The conducting element is hermetically sealed with respect to the base body, at least in part. The at least one conducting element includes at least one cermet. The cermet of the conducting element and the base body include one or more of the same ceramic compound.

    摘要翻译: 提出了用于可植入医疗装置的壳体中的电气套管。 电气套管包括至少一个电绝缘基体和至少一个导电元件。 导电元件通过基体设置在壳体的内部空间与外部空间之间的至少一个导电连接。 导电元件至少部分地相对于基体气密地密封。 至少一个导电元件包括​​至少一个金属陶瓷。 导电元件和基体的金属陶瓷包括一种或多种相同的陶瓷化合物。

    Head part for an implantable medical device
    7.
    发明授权
    Head part for an implantable medical device 有权
    可植入医疗器械的头部

    公开(公告)号:US09088093B2

    公开(公告)日:2015-07-21

    申请号:US14293596

    申请日:2014-06-02

    摘要: An electrical bushing for use in a housing of an implantable medical device is proposed. The electrical bushing includes at least one electrically insulating base body and at least one electrical conducting element. The conducting element establishes, through the base body, at least one electrically conductive connection between an internal space of the housing and an external space. The conducting element is hermetically sealed with respect to the base body, at least in part. The at least one conducting element includes at least one cermet. The electrical bushing includes at least one head part. The head part includes at least one plug connector element that enables electrical connection of at least one plug element from the external space to the plug connector element.

    摘要翻译: 提出了用于可植入医疗装置的壳体中的电气套管。 电气套管包括至少一个电绝缘基体和至少一个导电元件。 导电元件通过基体设置在壳体的内部空间与外部空间之间的至少一个导电连接。 导电元件至少部分地相对于基体气密地密封。 至少一个导电元件包括​​至少一个金属陶瓷。 电气衬套包括至少一个头部。 头部包括至少一个插头连接器元件,其能够使至少一个插头元件从外部空间电连接到插头连接器元件。

    IMPLANTABLE DEVICE WITH AN INSULATING LAYER AND METHOD
    8.
    发明申请
    IMPLANTABLE DEVICE WITH AN INSULATING LAYER AND METHOD 审中-公开
    具有绝缘层和方法的可植入器件

    公开(公告)号:US20150148876A1

    公开(公告)日:2015-05-28

    申请号:US14352618

    申请日:2012-10-16

    摘要: A device (100), comprising: a housing (110) having an inner surface (160) and an outer surface (170); an electronic unit (130, 140, 180); whereby the housing (110) surrounds the electronic unit (180) at least in part; whereby at least a part of the inner surface (160) of the housing (110) comprises an electrically insulating coating (120) that contains at least 30 wt.-% of a polymer and has a coating surface (150) facing the inner surface (160); whereby the inner surface (160) and the coating surface (150) are interconnected.

    摘要翻译: 一种装置(100),包括:具有内表面(160)和外表面(170)的壳体(110); 电子单元(130,140,​​180); 由此壳体(110)至少部分地围绕电子单元(180); 由此壳体(110)的内表面(160)的至少一部分包括含有至少30重量%的聚合物的电绝缘涂层(120),并且具有面向内表面的涂层表面(150) (160); 由此内表面(160)和涂层表面(150)互连。

    LEAD CONNECTOR WITH DISTAL FRAME AND METHOD OF MANUFACTURE
    9.
    发明申请
    LEAD CONNECTOR WITH DISTAL FRAME AND METHOD OF MANUFACTURE 有权
    具有远端框架的导线连接器及其制造方法

    公开(公告)号:US20140213118A1

    公开(公告)日:2014-07-31

    申请号:US13756017

    申请日:2013-01-31

    IPC分类号: H01R13/04

    摘要: A method of manufacturing a lead connector for an implantable medical device including connecting proximal ends of a plurality of conductive wires to an inner surface of a corresponding ring contact, placing a distal frame over distal ends of each of conducive wire of the plurality of conductive wires, the distal ends passing through corresponding shafts in the distal frame from a rear face of the distal frame and extending beyond a front face of the distal frame, arranging the distal frame along with the conductive wires and corresponding ring contacts within a mold cavity, filling the mold cavity with a mold material, the mold material abutting the rear face of the distal frame, and removing a resulting lead connector from the mold cavity.

    摘要翻译: 一种制造用于可植入医疗装置的引线连接器的方法,包括将多根导线的近端连接到相应的环形接触件的内表面,将远端框架放置在多根导线中的每个导电线的远端上 所述远端从所述远端框架的后表面穿过所述远端框架中的对应的轴并且延伸超过所述远端框架的前表面,将所述远端框架与所述导电线和相应的环形触点一起设置在模具腔内,填充 所述模腔具有模具材料,所述模具材料抵靠所述远端框架的后表面,并且从所述模具腔中移除所得到的导线连接器。

    METHOD OF FORMING A CERMET-CONTAINING BUSHING FOR AN IMPLANTABLE MEDICAL DEVICE HAVING A CONNECTING LAYER
    10.
    发明申请
    METHOD OF FORMING A CERMET-CONTAINING BUSHING FOR AN IMPLANTABLE MEDICAL DEVICE HAVING A CONNECTING LAYER 有权
    为具有连接层的可植入医疗装置形成包含母线的方法

    公开(公告)号:US20150122875A1

    公开(公告)日:2015-05-07

    申请号:US14593637

    申请日:2015-01-09

    IPC分类号: A61N1/375 B23K1/00

    摘要: One aspect relates method of forming an electrical bushing for an implantable medical device, including generating at least one base body green compact for at least one base body from an insulating composition of materials. At least one cermet-containing conducting element green compact is formed for at least one conducting element. At least one conducting element green compact is introduced into the base body green compact. The insulation element green compact is connected to the at least one base body green compact in order to obtain at least one base body having at least one conducting element. A connecting layer is applied onto the at least one conducting element.

    摘要翻译: 一个方面涉及形成用于可植入医疗装置的电气衬套的方法,包括从绝缘材料组合物产生用于至少一个基体的至少一个基体生坯。 为至少一个导电元件形成至少一个含金属陶瓷的导电元件生坯。 至少一个导电元件绿色压块被引入基体绿色压块中。 绝缘元件生坯被连接到至少一个基体生坯上,以便获得至少一个具有至少一个导电元件的基体。 连接层施加到至少一个导电元件上。