摘要:
One aspect relates method of forming an electrical bushing for an implantable medical device, including generating at least one base body green compact for at least one base body from an insulating composition of materials. At least one cermet-containing conducting element green compact is formed for at least one conducting element. At least one conducting element green compact is introduced into the base body green compact. The insulation element green compact is connected to the at least one base body green compact in order to obtain at least one base body having at least one conducting element. A connecting layer is applied onto the at least one conducting element.
摘要:
On aspect is a housing for an implantable medical device, including a first portion of metal and having integrated features and a second portion also of metal. The first and second portions are sealed together thereby forming the housing with an internal space that is within first and second portions and that fully contains the features such that they are hermetically sealed relative to an external space outside the housing.
摘要:
A method of manufacturing a lead connector for an implantable medical device including connecting proximal ends of a plurality of conductive wires to an inner surface of a corresponding ring contact, placing a distal frame over distal ends of each of conducive wire of the plurality of conductive wires, the distal ends passing through corresponding shafts in the distal frame from a rear face of the distal frame and extending beyond a front face of the distal frame, arranging the distal frame along with the conductive wires and corresponding ring contacts within a mold cavity, filling the mold cavity with a mold material, the mold material abutting the rear face of the distal frame, and removing a resulting lead connector from the mold cavity.
摘要:
An electrical bushing for use in a housing of an implantable medical device is proposed. The electrical bushing includes at least one electrically insulating base body and at least one electrical conducting element. The conducting element establishes, through the base body, at least one electrically conductive connection between an internal space of the housing and an external space. The conducting element is hermetically sealed with respect to the base body, at least in part. The at least one conducting element includes at least one cermet. The cermet of the conducting element and the base body include one or more of the same ceramic compound.
摘要:
On aspect is a housing for an implantable medical device, including a first portion of metal and having integrated features and a second portion also of metal. The first and second portions are sealed together thereby forming the housing with an internal space that is within first and second portions and that fully contains the features such that they are hermetically sealed relative to an external space outside the housing.
摘要:
An electrical bushing for use in a housing of an implantable medical device is proposed. The electrical bushing includes at least one electrically insulating base body and at least one electrical conducting element. The conducting element establishes, through the base body, at least one electrically conductive connection between an internal space of the housing and an external space. The conducting element is hermetically sealed with respect to the base body, at least in part. The at least one conducting element includes at least one cermet. The cermet of the conducting element and the base body include one or more of the same ceramic compound.
摘要:
An electrical bushing for use in a housing of an implantable medical device is proposed. The electrical bushing includes at least one electrically insulating base body and at least one electrical conducting element. The conducting element establishes, through the base body, at least one electrically conductive connection between an internal space of the housing and an external space. The conducting element is hermetically sealed with respect to the base body, at least in part. The at least one conducting element includes at least one cermet. The electrical bushing includes at least one head part. The head part includes at least one plug connector element that enables electrical connection of at least one plug element from the external space to the plug connector element.
摘要:
A device (100), comprising: a housing (110) having an inner surface (160) and an outer surface (170); an electronic unit (130, 140, 180); whereby the housing (110) surrounds the electronic unit (180) at least in part; whereby at least a part of the inner surface (160) of the housing (110) comprises an electrically insulating coating (120) that contains at least 30 wt.-% of a polymer and has a coating surface (150) facing the inner surface (160); whereby the inner surface (160) and the coating surface (150) are interconnected.
摘要:
A method of manufacturing a lead connector for an implantable medical device including connecting proximal ends of a plurality of conductive wires to an inner surface of a corresponding ring contact, placing a distal frame over distal ends of each of conducive wire of the plurality of conductive wires, the distal ends passing through corresponding shafts in the distal frame from a rear face of the distal frame and extending beyond a front face of the distal frame, arranging the distal frame along with the conductive wires and corresponding ring contacts within a mold cavity, filling the mold cavity with a mold material, the mold material abutting the rear face of the distal frame, and removing a resulting lead connector from the mold cavity.
摘要:
One aspect relates method of forming an electrical bushing for an implantable medical device, including generating at least one base body green compact for at least one base body from an insulating composition of materials. At least one cermet-containing conducting element green compact is formed for at least one conducting element. At least one conducting element green compact is introduced into the base body green compact. The insulation element green compact is connected to the at least one base body green compact in order to obtain at least one base body having at least one conducting element. A connecting layer is applied onto the at least one conducting element.