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公开(公告)号：US20170367205A1
公开(公告)日：2017-12-21
申请号：US15541930
申请日：2016-01-20
发明人： Masayuki Yokota , Masaharu Yamamoto
CPC分类号： H05K5/066 , B23K1/0008 , B23K35/3006 , B23K35/3086 , B23K2101/12 , B32B15/015 , B32B15/018 , C22C38/18 , C22C38/40 , C22C38/52 , H01L23/02 , H01L23/06 , H03H9/02 , H03H9/02984 , H03H9/1064 , H03H9/64 , H05K5/03
摘要： This hermetic sealing lid member (1) is made of a clad material (10) including a base material layer (11) made of an Fe alloy that contains 4 mass % or more of Cr and a silver brazing layer (13) bonded onto a surface of the base material layer on a side closer to an electronic component housing member through an intermediate layer (12).
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公开(公告)号：US20170054131A1
公开(公告)日：2017-02-23
申请号：US15219826
申请日：2016-07-26
发明人： Masayuki Yokota , Yoshimitsu Oda
IPC分类号： H01M2/30 , H01M2/26 , B21D39/03 , H01M10/0525
CPC分类号： H01M2/305 , B21D39/031 , H01M10/0525 , H01M2220/20 , Y02E60/122 , Y02P70/54 , Y02T10/7011
摘要： A battery terminal is made of a clad material in which a first metal layer made of an Al-based alloy, a second metal layer made of a Cu-based alloy, and a third metal layer made of a Ni-based alloy are bonded to each other in a state where the first metal layer, the second metal layer, and the third metal layer are stacked in this order. The battery terminal includes a shaft portion and a flange portion that radially expands from the shaft portion, and has the third metal layer at least in an end of the shaft portion on a first side in a shaft direction in which the shaft portion extends.
摘要翻译： 电池端子由包覆材料制成，其中由Al基合金制成的第一金属层，由Cu基合金制成的第二金属层和由Ni基合金制成的第三金属层与 彼此以第一金属层，第二金属层和第三金属层的顺序依次堆叠的状态。 电池端子包括轴部和从轴部径向膨胀的凸缘部，并且在轴部延伸的轴方向的第一侧至少在轴部的端部具有第三金属层。
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公开(公告)号：US11178786B2
公开(公告)日：2021-11-16
申请号：US16433910
申请日：2019-06-06
申请人： HITACHI METALS, LTD.
发明人： Masayuki Yokota , Masaharu Yamamoto
IPC分类号： B23K20/00 , H05K5/06 , B23K20/04 , B23K1/00 , B23K1/20 , H01L21/48 , H01L23/06 , H01L41/053 , H01L41/23 , H03H9/10 , H05K5/03 , B23K101/40 , B32B15/01 , B23K35/30
摘要： The method manufactures a hermetic sealing lid member used for an electronic component housing package including an electronic component arrangement member on which an electronic component is arranged. The method includes forming a clad material in which a silver brazing layer that contains Ag and Cu and a first Fe layer arranged on the silver brazing layer and made of Fe or an Fe alloy are bonded to each other by roll-bonding a silver brazing plate that contains Ag and Cu and a first Fe plate made of Fe or an Fe alloy to each other and performing first heat treatment for diffusion annealing; softening the clad material by performing second heat treatment; and forming the hermetic sealing lid member in a box shape including a recess portion by bending the softened clad material.
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公开(公告)号：US10696589B2
公开(公告)日：2020-06-30
申请号：US15602569
申请日：2017-05-23
申请人： HITACHI METALS, LTD.
发明人： Masayuki Yokota , Ryoji Inoue , Yoshiharu Tsuboi , Masaharu Yamamoto , Masaru Fujiyoshi , Naruaki Tomita , Kouji Kawahara
IPC分类号： C22C38/08 , C22C38/40 , C22C38/52 , C22C38/10 , C03C27/08 , B32B15/04 , B32B17/06 , C03C27/04 , C22C30/00 , C22C19/05 , E06B3/673
摘要： This glass bonding material (21) is made of a cladding material (1) in which at least a first layer (11) made of an Al-based alloy and configured to be bonded to glass and a second layer (12) made of an Fe—Ni based alloy having a thermal expansion coefficient from 30° C. to 400° C. of 11.5×10−6 (K−1) or less are bonded.
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公开(公告)号：US20170283318A1
公开(公告)日：2017-10-05
申请号：US15602569
申请日：2017-05-23
申请人： HITACHI METALS, LTD.
发明人： Masayuki Yokota , Ryoji Inoue , Yoshiharu Tsuboi , Masaharu Yamamoto , Masaru Fujiyoshi , Naruaki Tomita , Kouji Kawahara
摘要： This glass bonding material (21) is made of a cladding material (1) in which at least a first layer (11) made of an Al-based alloy and configured to be bonded to glass and a second layer (12) made of an Fe—Ni based alloy having a thermal expansion coefficient from 30° C. to 400° C. of 11.5×10−6 (K−1) or less are bonded.
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6.发明申请COVER MATERIAL FOR HERMETIC SEALING AND PACKAGE FOR CONTAINING ELECTRONIC COMPONENT 审中-公开用于包装电子元件的包封材料和包装材料公开(公告)号：US20150232244A1
公开(公告)日：2015-08-20
申请号：US14428054
申请日：2013-11-08
发明人： Masayuki Yokota , Masaharu Yamamoto
CPC分类号： B65D65/02 , B32B15/01 , B65D25/10 , B65D65/38 , B65D85/70 , B81B7/0077 , H01L23/053 , H01L23/562 , H01L2924/0002 , H03H9/02149 , H03H9/1021 , Y10T428/12896 , Y10T428/1291 , Y10T428/12931 , Y10T428/12944 , H01L2924/00
摘要： This cover material for hermetic sealing is a cover material for hermetic sealing employed for a package for containing an electronic component. The cover material 1 for hermetic sealing is constituted of a clad material including a base material layer made of an Ni—Cr—Fe alloy containing Ni, Cr and Fe or an Ni—Cr—Co—Fe alloy containing Ni, Cr, Co and Fe, and a surface layer bonded to one surface of the base material layer on a side of an electronic component containing member and made of Ni or an Ni alloy.
摘要翻译： 用于气密密封的覆盖材料是用于容纳电子部件的包装的气密密封用覆盖材料。 用于气密密封的覆盖材料1由包含由含有Ni，Cr和Fe的Ni-Cr-Fe合金制成的基材层或包含Ni，Cr，Co的Ni-Cr-Co-Fe合金的基材层的包层材料构成， Fe，以及在电子元件容纳部件的一侧由Ni或Ni合金构成的基材层的一个表面附着的表层。
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公开(公告)号：US20170330811A1
公开(公告)日：2017-11-16
申请号：US15527779
申请日：2015-11-17
申请人： HITACHI METALS, LTD.
发明人： Masayuki Yokota , Masaharu Yamamoto
摘要： This method for manufacturing a hermetic sealing lid member (1, 201, 301) includes forming a Ni plated metal plate (70, 170) by forming a Ni plated layer (11, 12, 41) on a surface of a metal plate (40) having a corrosion resistance and forming the hermetic sealing lid member by punching the Ni plated metal plate.
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公开(公告)号：US10595424B2
公开(公告)日：2020-03-17
申请号：US15536285
申请日：2015-12-24
申请人： HITACHI METALS, LTD.
发明人： Masayuki Yokota , Masaharu Yamamoto
IPC分类号： B32B15/01 , H05K5/06 , B23K20/04 , B23K1/00 , B23K1/20 , H01L21/48 , H01L23/06 , H01L41/053 , H01L41/23 , H03H9/10 , H05K5/03 , B23K101/40 , B23K35/30
摘要： This hermetic sealing lid member (10) is made of a clad material (20) including a silver brazing layer (21) that contains Ag and Cu and a first Fe layer (22) bonded onto the silver brazing layer and made of Fe or an Fe alloy. The hermetic sealing lid member is formed in a box shape including a recess portion (13) by bending the clad material.
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公开(公告)号：US20190289738A1
公开(公告)日：2019-09-19
申请号：US16433910
申请日：2019-06-06
申请人： HITACHI METALS, LTD.
发明人： Masayuki Yokota , Masaharu Yamamoto
IPC分类号： H05K5/06 , H01L41/23 , H01L41/053 , B23K1/00 , B23K1/20 , H03H9/10 , H05K5/03 , H01L21/48 , H01L23/06 , B23K20/04
摘要： The method manufactures a hermetic sealing lid member used for an electronic component housing package including an electronic component arrangement member on which an electronic component is arranged. The method includes forming a clad material in which a silver brazing layer that contains Ag and Cu and a first Fe layer arranged on the silver brazing layer and made of Fe or an Fe alloy are bonded to each other by roll-bonding a silver brazing plate that contains Ag and Cu and a first Fe plate made of Fe or an Fe alloy to each other and performing first heat treatment for diffusion annealing; softening the clad material by performing second heat treatment; and forming the hermetic sealing lid member in a box shape including a recess portion by bending the softened clad material.
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公开(公告)号：US10026947B2
公开(公告)日：2018-07-17
申请号：US15219826
申请日：2016-07-26
申请人： HITACHI METALS, LTD.
发明人： Masayuki Yokota , Yoshimitsu Oda
IPC分类号： H01M2/30 , H01M2/26 , H01M10/0525 , B21D39/03
摘要： A battery terminal is made of a clad material in which a first metal layer made of an Al-based alloy, a second metal layer made of a Cu-based alloy, and a third metal layer made of a Ni-based alloy are bonded to each other in a state where the first metal layer, the second metal layer, and the third metal layer are stacked in this order. The battery terminal includes a shaft portion and a flange portion that radially expands from the shaft portion, and has the third metal layer at least in an end of the shaft portion on a first side in a shaft direction in which the shaft portion extends.
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