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公开(公告)号：US08178790B2
公开(公告)日：2012-05-15
申请号：US12336697
申请日：2008-12-17
申请人： Toshiki Furutani , Atsushi Sakai , Kiyohisa Hasegawa , Hiroshi Segawa , Shuichi Kawano , Hajime Sakamoto
发明人： Toshiki Furutani , Atsushi Sakai , Kiyohisa Hasegawa , Hiroshi Segawa , Shuichi Kawano , Hajime Sakamoto
IPC分类号： H05K1/11
CPC分类号： H01L23/49822 , H01L23/49816 , H01L23/49827 , H01L2224/16 , H01L2224/16235 , H01L2924/01004 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15192 , H01L2924/19107
摘要： An interposer and a method of manufacturing the same are provided. The interposer includes a substrate and a conductor portion formed inside the substrate. At least one insulating layer is formed on the substrate and on the conductor portion. A signal wiring portion is formed inside the insulating layer or on the insulating layer. A first pad is configured to receive an electronic part, and is formed on an outermost insulating layer of the at least one insulating layer. A connection conductor is formed in the at least one insulating layer so as to electrically connect the conductor portion to the first pad.
摘要翻译： 提供了插入件及其制造方法。 内插件包括基板和形成在基板内部的导体部分。 在基板上和导体部分上形成至少一个绝缘层。 在绝缘层内或绝缘层上形成信号布线部分。 第一焊盘被配置为接收电子部件，并且形成在所述至少一个绝缘层的最外绝缘层上。 连接导体形成在所述至少一个绝缘层中，以便将导体部分电连接到第一焊盘。
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公开(公告)号：US20090231827A1
公开(公告)日：2009-09-17
申请号：US12336697
申请日：2008-12-17
申请人： Toshiki Furutani , Atsushi Sakai , Kiyohisa Hasegawa , Hiroshi Segawa , Shuichi Kawano , Hajime Sakamoto
发明人： Toshiki Furutani , Atsushi Sakai , Kiyohisa Hasegawa , Hiroshi Segawa , Shuichi Kawano , Hajime Sakamoto
CPC分类号： H01L23/49822 , H01L23/49816 , H01L23/49827 , H01L2224/16 , H01L2224/16235 , H01L2924/01004 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15192 , H01L2924/19107
摘要： An interposer and a method of manufacturing the same are provided. The interposer includes a substrate and a conductor portion formed inside the substrate. At least one insulating layer is formed on the substrate and on the conductor portion. A signal wiring portion is formed inside the insulating layer or on the insulating layer. A first pad is configured to receive an electronic part, and is formed on an outermost insulating layer of the at least one insulating layer. A connection conductor is formed in the at least one insulating layer so as to electrically connect the conductor portion to the first pad.
摘要翻译： 提供了插入件及其制造方法。 内插件包括基板和形成在基板内部的导体部分。 在基板上和导体部分上形成至少一个绝缘层。 在绝缘层内或绝缘层上形成信号布线部分。 第一焊盘被配置为接收电子部件，并且形成在所述至少一个绝缘层的最外绝缘层上。 连接导体形成在所述至少一个绝缘层中，以便将导体部分电连接到第一焊盘。
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公开(公告)号：US20090173522A1
公开(公告)日：2009-07-09
申请号：US12345349
申请日：2008-12-29
CPC分类号： H01L23/5386 , H01L21/4857 , H01L21/486 , H01L23/5383 , H01L23/5384 , H01L2224/16 , H01L2924/01004 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/15192 , H01L2924/3011 , Y10T29/49155
摘要： An interposer having a support substrate, a first insulation layer made of an inorganic material and formed over the support substrate, and a second insulation layer formed over the first insulation layer. The first insulation layer has a first land, a second land and a first wiring electrically connecting the first land and the second land. The second insulation layer has a first pad positioned to load a first electronic component, a second pad positioned to load a second electronic component, a second wiring electrically connected to the second pad, a first via conductor electrically connecting the first land and the first pad, and a second via conductor electrically connecting the second land and the second wiring. The first wiring and second wiring electrically connect the first pad and the second pad, and the second wiring has a lower wiring resistance per unit length than the first wiring.
摘要翻译： 具有支撑衬底的中介层，由无机材料制成并形成在支撑衬底上的第一绝缘层，以及形成在第一绝缘层上的第二绝缘层。 第一绝缘层具有第一焊盘，第二焊盘和电连接第一焊盘和第二焊盘的第一布线。 所述第二绝缘层具有第一焊盘，所述第一焊盘定位成装载第一电子部件，第二焊盘定位成装载第二电子部件，电连接到所述第二焊盘的第二焊盘，将所述第一焊盘和所述第一焊盘电连接的第一通孔导体 以及电连接第二焊盘和第二布线的第二通孔导体。 第一布线和第二布线将第一焊盘和第二焊盘电连接，并且第二布线具有比第一布线更低的每单位长度的布线电阻。
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公开(公告)号：US08058563B2
公开(公告)日：2011-11-15
申请号：US12345295
申请日：2008-12-29
IPC分类号： H05K1/03
CPC分类号： H01L21/4857 , H01L21/486 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49866 , H01L23/5383 , H01L24/48 , H01L2224/16145 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/15192 , H01L2924/15311 , H01L2924/16152 , H01L2924/19041 , H01L2924/19107 , H01L2924/3011 , Y10T29/49155 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An interposer includes an inorganic insulating layer, a first wiring formed in or on a surface of the inorganic insulating layer, an organic insulating layer formed over the inorganic insulating layer and on the first wiring, a second wiring formed on the organic insulating layer, and a conductor portion connecting the first wiring and the second wiring.
摘要翻译： 中间层包括无机绝缘层，形成在无机绝缘层的表面中或其表面上的第一布线，形成在无机绝缘层上和第一布线上的有机绝缘层，形成在有机绝缘层上的第二布线，以及 连接第一布线和第二布线的导体部分。
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公开(公告)号：US08188378B2
公开(公告)日：2012-05-29
申请号：US12345349
申请日：2008-12-29
IPC分类号： H05K1/11
CPC分类号： H01L23/5386 , H01L21/4857 , H01L21/486 , H01L23/5383 , H01L23/5384 , H01L2224/16 , H01L2924/01004 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/15192 , H01L2924/3011 , Y10T29/49155
摘要： An interposer having a support substrate, a first insulation layer made of an inorganic material and formed over the support substrate, and a second insulation layer formed over the first insulation layer. The first insulation layer has a first land, a second land and a first wiring electrically connecting the first land and the second land. The second insulation layer has a first pad positioned to load a first electronic component, a second pad positioned to load a second electronic component, a second wiring electrically connected to the second pad, a first via conductor electrically connecting the first land and the first pad, and a second via conductor electrically connecting the second land and the second wiring. The first wiring and second wiring electrically connect the first pad and the second pad, and the second wiring has a lower wiring resistance per unit length than the first wiring.
摘要翻译： 具有支撑衬底的中介层，由无机材料制成并形成在支撑衬底上的第一绝缘层，以及形成在第一绝缘层上的第二绝缘层。 第一绝缘层具有第一焊盘，第二焊盘和电连接第一焊盘和第二焊盘的第一布线。 所述第二绝缘层具有第一焊盘，所述第一焊盘定位成装载第一电子部件，第二焊盘定位成装载第二电子部件，电连接到所述第二焊盘的第二焊盘，将所述第一焊盘和所述第一焊盘电连接的第一通孔导体 以及电连接第二焊盘和第二布线的第二通孔导体。 第一布线和第二布线将第一焊盘和第二焊盘电连接，并且第二布线具有比第一布线更低的每单位长度的布线电阻。
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公开(公告)号：US20110265323A1
公开(公告)日：2011-11-03
申请号：US13183742
申请日：2011-07-15
IPC分类号： H05K3/10
CPC分类号： H01L21/4857 , H01L21/486 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49866 , H01L23/5383 , H01L24/48 , H01L2224/16145 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/15192 , H01L2924/15311 , H01L2924/16152 , H01L2924/19041 , H01L2924/19107 , H01L2924/3011 , Y10T29/49155 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacturing an interposer including forming an inorganic insulating layer over a support substrate, forming a first wiring in or on a surface of the inorganic insulating layer, forming an organic insulating layer over the inorganic insulating layer and the first wiring, forming a second wiring on the organic insulating layer, and forming a conductor portion connecting the second wiring and the first wiring.
摘要翻译： 一种制造插入件的方法，包括在支撑基板上形成无机绝缘层，在无机绝缘层的表面中或表面上形成第一布线，在无机绝缘层和第一布线上形成有机绝缘层，形成第二布线 在有机绝缘层上布线，以及形成连接第二布线和第一布线的导体部分。
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公开(公告)号：US20090175023A1
公开(公告)日：2009-07-09
申请号：US12345295
申请日：2008-12-29
CPC分类号： H01L21/4857 , H01L21/486 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49866 , H01L23/5383 , H01L24/48 , H01L2224/16145 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/15192 , H01L2924/15311 , H01L2924/16152 , H01L2924/19041 , H01L2924/19107 , H01L2924/3011 , Y10T29/49155 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An interposer includes an inorganic insulating layer, a first wiring formed in or on a surface of the inorganic insulating layer, an organic insulating layer formed over the inorganic insulating layer and on the first wiring, a second wiring formed on the organic insulating layer, and a conductor portion connecting the first wiring and the second wiring.
摘要翻译： 中间层包括无机绝缘层，形成在无机绝缘层的表面中或其表面上的第一布线，形成在无机绝缘层上和第一布线上的有机绝缘层，形成在有机绝缘层上的第二布线，以及 连接第一布线和第二布线的导体部分。
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公开(公告)号：US20110265324A1
公开(公告)日：2011-11-03
申请号：US13183782
申请日：2011-07-15
申请人： Hajime Sakamoto , Shuichi Kawano , Daiki Komatsu , Hiroshi Segawa
发明人： Hajime Sakamoto , Shuichi Kawano , Daiki Komatsu , Hiroshi Segawa
IPC分类号： H05K3/10
CPC分类号： H01L21/4857 , H01L21/486 , H01L23/5383 , H01L23/5384 , H01L23/5386 , H01L24/16 , H01L2224/13099 , H01L2224/16237 , H01L2224/73204 , H01L2924/01002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/10253 , H01L2924/12042 , H01L2924/15174 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
摘要： A method for manufacturing an interposer including forming a first insulating layer comprising an inorganic material on a supporting substrate, forming a first wire in the first insulating layer, forming a second insulating layer on a first side of the first insulating layer, forming a second wire with a longer wire length and a greater thickness than the first wire on the second insulating layer, and removing the supporting substrate.
摘要翻译： 一种内插件的制造方法，包括在支撑基板上形成包括无机材料的第一绝缘层，在所述第一绝缘层中形成第一布线，在所述第一绝缘层的第一侧上形成第二绝缘层，形成第二布线 具有比第二绝缘层上的第一线更长的线长度和更大的厚度，并且移除支撑衬底。
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公开(公告)号：US08173907B2
公开(公告)日：2012-05-08
申请号：US12345426
申请日：2008-12-29
申请人： Hajime Sakamoto , Shuichi Kawano , Daiki Komatsu , Hiroshi Segawa
发明人： Hajime Sakamoto , Shuichi Kawano , Daiki Komatsu , Hiroshi Segawa
IPC分类号： H05K3/10
CPC分类号： H01L21/4857 , H01L21/486 , H01L23/5383 , H01L23/5384 , H01L23/5386 , H01L24/16 , H01L2224/13099 , H01L2224/16237 , H01L2224/73204 , H01L2924/01002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/10253 , H01L2924/12042 , H01L2924/15174 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
摘要： An interposer includes a first insulating layer made of an inorganic material and having a first land, a second land and a first wiring electrically connecting the first land and the second land, and a second insulating layer formed over a first surface of the first insulating layer and having a second wiring, a second pad for loading a second electronic component over the second insulating layer and a first via conductor electrically connecting the second land and the second wire. The first wiring and the second wiring electrically connect the first land and the second pad. The first land and second land are positioned such that a first electronic component is mounted over a second surface of the first insulating layer on the opposite side of the first surface. The second wiring has a longer wiring length and a greater thickness than the first wiring.
摘要翻译： 插入器包括由无机材料制成的第一绝缘层，具有第一焊盘，第二焊盘和电连接第一焊盘和第二焊盘的第一布线，以及形成在第一绝缘层的第一表面上的第二绝缘层 并具有第二布线，用于将第二电子部件装载在第二绝缘层上的第二焊盘和电连接第二焊盘和第二焊丝的第一通孔导体。 第一布线和第二布线将第一焊盘和第二焊盘电连接。 第一平台和第二平台被定位成使得第一电子部件安装在第一绝缘层的与第一表面相反的一侧的第二表面上。 第二布线具有比第一布线更长的布线长度和更大的厚度。
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公开(公告)号：US08997344B2
公开(公告)日：2015-04-07
申请号：US13183782
申请日：2011-07-15
申请人： Hajime Sakamoto , Shuichi Kawano , Daiki Komatsu , Hiroshi Segawa
发明人： Hajime Sakamoto , Shuichi Kawano , Daiki Komatsu , Hiroshi Segawa
IPC分类号： H01K3/10 , H01L21/48 , H01L23/538 , H01L23/00
CPC分类号： H01L21/4857 , H01L21/486 , H01L23/5383 , H01L23/5384 , H01L23/5386 , H01L24/16 , H01L2224/13099 , H01L2224/16237 , H01L2224/73204 , H01L2924/01002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/10253 , H01L2924/12042 , H01L2924/15174 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
摘要： A method for manufacturing an interposer including forming a first insulating layer comprising an inorganic material on a supporting substrate, forming a first wire in the first insulating layer, forming a second insulating layer on a first side of the first insulating layer, forming a second wire with a longer wire length and a greater thickness than the first wire on the second insulating layer, and removing the supporting substrate.
摘要翻译： 一种内插件的制造方法，包括在支撑基板上形成包括无机材料的第一绝缘层，在所述第一绝缘层中形成第一布线，在所述第一绝缘层的第一侧上形成第二绝缘层，形成第二布线 具有比第二绝缘层上的第一线更长的线长度和更大的厚度，并且移除支撑衬底。
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