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    Attenuated phase shift mask blank and photomask
    6.
    发明申请
    Attenuated phase shift mask blank and photomask 审中-公开
    衰减相移掩模空白和光掩模

    公开(公告)号：US20070076833A1

    公开(公告)日：2007-04-05

    申请号：US10570612

    申请日：2004-09-06

    申请人： Hans Becker ,  Ute Buttgereit ,  Guenter Hess ,  Oliver Zberger ,  Frank Schmidt ,  Frank Sobel ,  Markus Renno

    发明人： Hans Becker ,  Ute Buttgereit ,  Guenter Hess ,  Oliver Zberger ,  Frank Schmidt ,  Frank Sobel ,  Markus Renno

    IPC分类号： H04L23/00

    CPC分类号： G03F1/30 ,  C23C14/10 ,  C23C14/14 ,  C23C14/46 ,  G03F1/32 ,  G03F1/54 ,  G03F1/68

    摘要： The present invention relates to embedded attenuated phase shift mask blanks for use in lithography for an exposure wavelength of 300 nm or less, and a method of fabricating such mask blanks by ion beam deposition. In particular, the mask blanks comprise a substrate and a thin film system wherein the thin film system comprises a transmission control sublayer comprising one or more metals or metal compounds selected from the group consisting of Mg, Y, La, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Fe, Co, Ni, Zn, Ge, Sn, Pb, oxides, nitrides, borides and carbides thereof, and combinations of metals and compounds thereof; and a phase shift control sublayer comprising borides, carbides, oxides and/or nitrides of Ge, Si and/or Al or combinations thereof.

    摘要翻译： 本发明涉及用于300nm或更小的曝光波长的光刻的嵌入式衰减相移掩模毛坯，以及通过离子束沉积制造这种掩模毛坯的方法。 特别地，掩模坯料包括基底和薄膜系统，其中薄膜系统包括透射控制子层，其包含一种或多种选自Mg，Y，La，Ti，Zr，Hf的金属或金属化合物， V，Nb，Ta，Cr，Mo，W，Mn，Fe，Co，Ni，Zn，Ge，Sn，Pb，氧化物，氮化物，硼化物和碳化物，以及金属及其化合物的组合; 以及包括Ge，Si和/或Al的硼化物，碳化物，氧化物和/或氮化物或其组合的相移控制子层。

    Method of producing a mask blank for photolithographic applications, and mask blank
    7.
    发明申请
    Method of producing a mask blank for photolithographic applications, and mask blank 审中-公开
    制备用于光刻应用的掩模坯料的方法和掩模坯料

    公开(公告)号：US20060115744A1

    公开(公告)日：2006-06-01

    申请号：US11198387

    申请日：2005-08-08

    申请人： Lutz Aschke ,  Frank Sobel ,  Guenter Hess ,  Hans Becker ,  Markus Renno ,  Frank Schmidt ,  Oliver Goetzberger

    发明人： Lutz Aschke ,  Frank Sobel ,  Guenter Hess ,  Hans Becker ,  Markus Renno ,  Frank Schmidt ,  Oliver Goetzberger

    IPC分类号： G03F1/00 ,  B05D1/04 ,  B32B9/00 ,  B32B17/10 ,  B32B17/06

    CPC分类号： G03F1/24 ,  B82Y10/00 ,  B82Y40/00 ,  G03F1/38 ,  G03F1/40 ,  Y10T428/31616

    摘要： The invention relates to a method of producing a mask blank (1) for photolithographic applications, particularly in EUV lithography, comprising the steps of: providing a substrate (2) which has a front side (4) and a rear side (3); depositing an electrically conductive layer (5) on the rear side of the substrate; depositing a coating on the front side of the substrate, wherein the coating comprises at least a first layer (6) and a second layer (9); and structuring the coating (6, 9) for photolithographic applications; wherein a respective handling area (22; 22a-22c) is formed on the front side (4) at least at one predefined location, said handling area not being structured for photolithographic applications and being designed for the handling of the mask blank (1) by means of a mechanical clamp or handling device, and wherein the first layer (6) is exposed in the respective handling area (22; 22a-22c) so that, when the mask blank (1) is handled from the front side, the mechanical clamp or handling device bears against the first layer (6). The invention furthermore relates to a corresponding mask blank.

    摘要翻译： 本发明涉及一种制备用于光刻应用的掩模板（1）的方法，特别是在EUV光刻中，包括以下步骤：提供具有前侧（4）和后侧（3）的基板（2） 在所述衬底的后侧上沉积导电层（5）; 在所述基底的正面上沉积涂层，其中所述涂层至少包括第一层（6）和第二层（9）; 并构造用于光刻应用的涂层（6,9）; 其中至少在一个预定位置处在前侧（4）上形成相应的操作区域（22; 22a-22c），所述操作区域不被构造用于光刻应用并且被设计用于处理掩模坯料（ 1）通过机械夹具或处理装置，并且其中第一层（6）暴露在相应的处理区域（22; 22a-22c）中，使得当掩模坯料（1）从 前侧，机械夹具或处理装置抵靠第一层（6）。 本发明还涉及相应的掩模坯料。

    Method for manufacturing of a mask blank for EUV photolithography and mask blank
    8.
    发明申请
    Method for manufacturing of a mask blank for EUV photolithography and mask blank 审中-公开
    用于EUV光刻和掩模毛坯的掩模坯料的制造方法

    公开(公告)号：US20060008749A1

    公开(公告)日：2006-01-12

    申请号：US10885898

    申请日：2004-07-08

    申请人： Frank Sobel ,  Lutz Aschke ,  Guenter Hess ,  Hans Becker ,  Markus Renno ,  Frank Schmidt ,  Oliver Goetzberger

    发明人： Frank Sobel ,  Lutz Aschke ,  Guenter Hess ,  Hans Becker ,  Markus Renno ,  Frank Schmidt ,  Oliver Goetzberger

    IPC分类号： B32B17/06 ,  B32B9/00 ,  G03C5/00 ,  B32B15/00 ,  G03F1/00

    CPC分类号： G03F1/24 ,  B82Y10/00 ,  B82Y40/00 ,  C23C14/0052 ,  C23C14/0641 ,  C23C14/0676 ,  C23C14/46 ,  G03F1/38

    摘要： The invention relates to a method for manufacturing of a mask blank for extreme ultraviolet (EUV) photolithography, comprising the steps of: providing a substrate having a front surface and a back surface; depositing a film comprising tantalum nitride (TaN) on said front surface of said substrate for absorbing EUV light used during a photolithographic process; and depositing a conductive coating on said back surface of said substrate. Preferably, ion beam sputtering is used for depositing the film comprising tantalum nitride (TaN) and/or the conductive coating on the back surface of the substrate. Preferably, Xenon is used as a sputter gas for ion beam sputtering. Another aspect of the present invention relates to a mask blank for extreme ultraviolet (EUV) photolithography.

    摘要翻译： 本发明涉及一种用于制造用于极紫外（EUV）光刻的掩模坯料的方法，包括以下步骤：提供具有前表面和后表面的基板; 在所述衬底的前表面上沉积包含氮化钽（TaN）的膜，以吸收在光刻过程中使用的EUV光; 以及在所述衬底的所述背表面上沉积导电涂层。 优选地，离子束溅射用于在衬底的背面上沉积包含氮化钽（TaN）和/或导电涂层的膜。 优选地，氙被用作用于离子束溅射的溅射气体。 本发明的另一方面涉及一种用于极紫外（EUV）光刻的掩模板。

    Mask blank for use in EUV lithography and method for its production
    9.
    发明授权
    Mask blank for use in EUV lithography and method for its production 有权
    用于EUV光刻的掩模空白及其生产方法

    公开(公告)号：US07517617B2

    公开(公告)日：2009-04-14

    申请号：US10825618

    申请日：2004-04-16

    申请人： Lutz Aschke ,  Markus Renno ,  Mario Schiffler ,  Frank Sobel ,  Hans Becker

    发明人： Lutz Aschke ,  Markus Renno ,  Mario Schiffler ,  Frank Sobel ,  Hans Becker

    IPC分类号： G03F1/00

    CPC分类号： B82Y10/00 ,  B82Y40/00 ,  G03F1/24 ,  G03F1/38 ,  G03F7/70708

    摘要： This invention relates to a mask blank for use in EUV lithography and a method for its production.The mask blank comprises a substrate with a front side and a rear side whereby a coating is applied to the front side for use as a mask in EUV lithography and the rear side of the substrate comprises an electrically conductive coating. The electrically conductive coating is particularly abrasion resistant and strongly adhesive according to DIN 58196-5 (German Industry Standard), DIN 58196-4 and DIN 58196-6 and characterised by a minimum electrical conductivity. The electrically conductive coating is applied by means of ion-beam-assisted sputtering.Since the electrically conductive coating on the rear side is so abrasion resistant and strongly adhesive, the mask blank may be gripped, held and handled by means of an electrostatic holding device (chuck) without any troublesome abrasion occurring.

    摘要翻译： 本发明涉及一种用于EUV光刻的掩模板及其制造方法。 掩模坯料包括具有前侧和后侧的基板，由此在EUV光刻中将涂层施加到前侧用作掩模，并且基板的后侧包括导电涂层。 根据DIN 58196-5（德国工业标准），DIN 58196-4和DIN 58196-6，导电涂层特别耐磨，牢固，并具有最小的电导率。 通过离子束辅助溅射法施加导电涂层。 由于后侧的导电涂层具有如此耐磨性和强粘合性，所以可以通过静电保持装置（卡盘）夹持，保持和处理掩模坯料，而不会发生任何麻烦的磨损。