摘要:
In electron beam apparatus having a souce of electrons and a target area toward which the electrons are directed, electron beam forming means are provided along the path from the source to the target. These forming means include a first beam shaping member having a first spot shaping aperture therein, a second beam shaping member having a second spot shaping aperture therein, and means focusing the image of the first aperture in the plane of the second aperture to thereby form a composite spot shape defined by the image of the first aperture and the second aperture. Further means are provided for focusing the image of the composite spot in the target area.Preferably, the apertures are square shaped. Thus, by varying the position of the superimposed image of the first aperture with respect to the second aperture, a wide variety of rectangular shaped composite spots with different dimensions is obtainable. This permits the exposure of rectilinear patterns, e.g., in photoresists of integrated circuit fabrication, by the electron beam with a minimum of exposure steps and substantially no exposure overlap. The result is greatly increased speed in the total exposure of such rectilinear areas to the electron beam as well as a minimum of the "blooming effects" produced by exposure overlap.
摘要:
A beam of charged particles has its alignment and brightness alternately controlled in accordance with the current of the beam. The measurements of the current and any corrections for alignment or brightness are made when the beam is not applied to a target.
摘要:
A multi-beam e-beam system employs a set of independently controllable (for blanking and deflection) subsystems placed in a solenoid field, each system having a demagnifying lens comprising at least one passive pole piece, so that the final image demagnifies imperfections in the upstream electron beam. Upper and lower sections of the system employ the focusing effect of the solenoid field to form an image at a shaping aperture and a demagnified image of the beam at the shaping aperture on the workpiece. Small focus corrections due to magnetic lens field non-uniformity and/or target height variations, are accomplished with an electrostatic unipotental lens built into the pole pieces and target voltage variations.
摘要:
A system of testing the continuity of electrical conductors extending through an insulating layer without contact. A flood gun irradiates one side of the body to charge the exposed conductors to a given potential. A steerable electron beam scans the front side to generate secondary electron emission from those conductors. The secondary emission is enhanced from conductors with conductivity between front side and back side as a result of the surface potential established by the rear flood beam. The secondary emission varies depending on the state of continuity in the three dimensional network of conductors and produces signals at the detector which allow clear discrimination between uninterrupted and interrupted conductors. The system is applicable for unfired ceramics where contact destroys the specimen.
摘要:
An electron beam system and method for testing three dimensional networks of conductors embedded in an insulating material specimen without physical contact to detect open and short circuit conditions. Top to top surface wiring is tested by irradiating the specimen with an electron beam at a first beam potential to charge the specimen while negatively biasing a grid placed above the specimen surface, and then irradiating selected portions of the specimen with an electron beam at a second beam potential to read the charge on selected conductors while applying a zero or a positive bias to the grid. In one embodiment the charge beam is a focused scanning beam and the first beam potential is preferably greater than the second beam potential.
摘要:
An electron beam system for non contact testing of three dimensional networks of conductors embedded in dielectric material, specifically detection of open and short circuit conditions. Top to bottom and top to top surface wiring is tested electrically without making physical electrical contact. The system comprises two flood beams and a focus probe beam wih one flood beam located at either side of the specimen. Proper choice of acceleration potentials, beam currents and dwell times of the beams allow alteration of the secondary electron emission from the specimen in such a way that electrical properties of the conductor networks can be measured directly. The difference in secondary electron emission resulting from different surface potentials is detected as a strong signal which allows clear discrimination between uninterrupted and interrupted as well as shorted pairs of conductors. This testing system can be applied to the high speed testing of advanced VLSI packaging substrates as well as to the greensheets, sublaminates, and laminates from which they are fabricated.
摘要:
An electron beam projection system having a projection lens arranged so that upon pre-deflection of the electron beam the electron optical axis of the lens shifts to be coincident with the deflected beam. The projection system includes means for producing an electron beam, means for deflecting the beam, a magnetic projection lens having rotational symmetry for focusing the deflected beam and a pair of magnetic compensation yokes positioned within the bore of the projection lens means. The pair of correction yokes has coil dimensions such that, in combination, they produce a magnetic compensation field proportional to the first derivative of the axial magnetic field strength distribution curve of the projection lens. Upon application of current to the pair of compensation yokes the electron optical axis of the projection lens shifts to the position of the deflected beam so that the electron beam remains coincident with the shifted electron optical axis and lands perpendicular to a target.
摘要:
A method of optimizing locations of correction elements of a charged particle beam system determines respective corrector element currents to achieve optimum correction as a function of individual corrector location. Substantially complete dynamic correction of FSD and SFD can be obtained consistent with efficiency of operation and minimization of deflection distortion. In particular, FSD and SFD corrections can be sufficiently separated for substantially complete correction of SFD and FSD simultaneously with two stigmators. Both of these types of correction can be provided in complex charged particle beam systems employing curvilinear axis (CVA) particle trajectories and or large area reduction projection optics (LARPO) which cause complex hybrid aberrations in order to achieve high throughput consistent with extremely high resolution supporting one-tenth micron minimum feature size lithography regimes and smaller.
摘要:
A two staqge, electron beam projection system includes a target, a source of an electron beam and means for projecting an electron beam towards the target with its upper surface defining a target plane. A magnetic projection lens has a principal plane and a back focal plane located between said means for projecting and the target. The means for projecting provides an electron beam directed towards the target. First stage means provides deflection of the beam from area to area within a field. Second stage means provides for deflection of the beam for providing deflection of the beam within an area within a field. The beam crossing the back focal plane produces a telecentric condition of the beam in the image plane with the beam substantially normal to the target plane from the principal plane to the target plane. The magnetic projection lens includes a magnetic structure providing for magnetic compensation positioned within the bore of the projection lens, which produces a compensating magnetic field substantially proportional to the first derivative of the axial magnetic projection field. The axial magnetic projection field provides substantially a zero first derivative of the axial magnetic projection field in the vicinity of the target. The projection system projects on the target plane from the projection system as deflected by the upper and lower stages, at all times maintaining the telecentric condition of the electron beam at the target plane throughout the entire range of deflection of the beam, assuring minimum errors due to target height variations.
摘要:
This system employs writing of lithographic patterns with a shaped electron beam exposure system which minimizes the time wasted by workpiece positional requirements. The writing field contains an array of sub-fields written in a raster sequence. The large width of the writing field provided by the VAIL system reduces the number of mechanical scans required to write the pattern on the workpiece which further reduces the time required for workpiece positioning. When patterns are being superimposed over previously written patterns, registration is employed. This system includes a registration field confined to local areas on the workpiece, which is larger than the writing field, without requiring change in focus and without requiring the mechanical system comprising the X-Y work table to change speed during the registration and reregistration of the various fields on a semiconductor wafer or mask. The registration field can be larger than the writing field is possible because the quality requirements demanded from the shaped electron beam are less for detecting the locations of such registration marks at the various locations on the wafer.