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1.发明授权Flexible wiring for the transformation of a substrate with edge contacts into a ball grid array 有权用于将具有边缘触点的基板转换成球栅阵列的柔性布线公开(公告)号：US06504104B2
公开(公告)日：2003-01-07
申请号：US09845378
申请日：2001-04-30
IPC分类号： H05K100
CPC分类号： H01L23/4985 , H01L23/49816 , H01L24/50 , H01L2924/12042 , H01L2924/14 , H05K1/147 , H05K3/3436 , H05K3/363 , H05K2201/049 , H05K2201/056 , H05K2201/10734 , Y02P70/613 , Y10T29/4913 , Y10T29/49144 , H01L2924/00
摘要： The transformation of An IC substrate with edge contacts into a ball grid array is accomplished using a flexible circuit that has terminals arranged planarly on the underside for receiving meltable solder humps and whose conductors leading outwardly from the terminals have exposed ends. The upper side of the flexible circuit is connected with the lower side of the substrate, whereupon the edge regions of the flexible circuit are bent up and around the substrate and the ends of the conductors are electrically contacted to the edge contacts of the substrate.
摘要翻译： 将具有边缘触点的IC衬底转换成球栅阵列是使用柔性电路来实现的，所述柔性电路具有平面地布置在底面上用于接收可熔化焊料凸起的端子，并且其从端子向外引出的导体具有暴露端。 柔性电路的上侧与基板的下侧连接，于是柔性电路的边缘区域向上弯曲并围绕基板，并且导体的端部与基板的边缘触点电接触。
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2.发明授权Method for transforming a substrate with edge contacts into a ball grid array 有权将具有边缘触点的基板转换成球栅阵列的方法公开(公告)号：US06256877B1
公开(公告)日：2001-07-10
申请号：US09209406
申请日：1998-12-10
IPC分类号： H05K330
CPC分类号： H01L23/4985 , H01L23/49816 , H01L24/50 , H01L2924/12042 , H01L2924/14 , H05K1/147 , H05K3/3436 , H05K3/363 , H05K2201/049 , H05K2201/056 , H05K2201/10734 , Y02P70/613 , Y10T29/4913 , Y10T29/49144 , H01L2924/00
摘要： The transformation of An IC substrate with edge contacts into a ball grid array is accomplished using a flexible circuit that has terminals arranged planarly on the underside for receiving meltable solder humps and whose conductors leading outwardly from the terminals have exposed ends. The upper side of the flexible circuit is connected with the lower side of the substrate, whereupon the edge regions of the flexible circuit are bent up and around the substrate and the ends of the conductors are electrically contacted to the edge contacts of the substrate.
摘要翻译： 将具有边缘触点的IC衬底转换成球栅阵列是使用柔性电路来实现的，所述柔性电路具有平面地布置在底面上用于接收可熔化焊料凸起的端子，并且其从端子向外引出的导体具有暴露端。 柔性电路的上侧与基板的下侧连接，于是柔性电路的边缘区域向上弯曲并围绕基板，并且导体的端部与基板的边缘触点电接触。
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3.发明授权Stack arrangement for two semiconductor memory chips and printed board for accepting a plurality of such stack arrangements 有权用于两个半导体存储器芯片的堆叠布置和用于接受多个这样的堆叠布置的印刷板
公开(公告)号：US6157541A
公开(公告)日：2000-12-05
申请号：US216978
申请日：1998-12-21
申请人： Hans-Juergen Hacke
发明人： Hans-Juergen Hacke
IPC分类号： G11C5/00 , H01L23/538 , H01L25/065 , H05K1/18 , H05K1/14
CPC分类号： H05K1/189 , H01L23/5387 , H01L25/0657 , H01L2225/06517 , H01L2225/06527 , H01L2225/06555 , H01L2225/06579 , H01L2924/0002
摘要： Two semiconductor memory chips are placed onto a flexible wiring and are shaped by simple folding of the flexible wiring about a central elastic line, into a space-efficient stack arrangement whose outer contacts are formed only at one marginal side. To form memory cards, a plurality of such stack arrangements can be placed onto a simply constructed printed board.
摘要翻译： 将两个半导体存储器芯片放置在柔性布线上，并且通过将柔性布线围绕中心弹性线简单地折叠成为空间有效的堆叠布置而成形，其外部触点仅在一个边缘侧形成。 为了形成存储卡，可以将多个这样的堆叠装置放置在简单构造的印刷电路板上。
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4.发明授权Process for the production of printed circuits with solder rejecting sub-zones 失效用于生产具有焊料拒收子区域的印刷电路的工艺
公开(公告)号：US4268349A
公开(公告)日：1981-05-19
申请号：US723582
申请日：1976-09-15
CPC分类号： H05K3/3452 , H05K3/062 , H05K2201/0175 , H05K2203/0505 , H05K3/3447 , H05K3/3473 , H05K3/427
摘要： A process for the production of printed circuit boards having first zones of a wiring pattern for receiving solder and second sub-zones provided with solder rejecting properties so that they do not receive solder, characterized by galvanically applying a solderable etch-resistant metal layer on the first sub-zones of each conductive metal layer, by photo printing a mask of etch-resistant material on the second sub-zones, etching to remove the exposed portions of the conductive metal layer, removing the mask from the second sub-zones and providing the exposed second sub-zones with a solder rejecting property with the aid of passivation without impairing the solderability of the etch-resistant metal layers of the first sub-zones.
摘要翻译： 一种用于生产印刷电路板的方法，该印刷电路板具有用于接收焊料的布线图案的第一区域和具有阻焊性能的第二子区域，使得它们不接收焊料，其特征在于将可焊接耐腐蚀金属层电镀在 每个导电金属层的第一子区域，通过在第二子区域上印刷耐蚀刻材料的掩模，蚀刻以去除导电金属层的暴露部分，从第二子区域移除掩模并提供 暴露的第二子区域借助于钝化而具有阻焊性，而不损害第一子区域的耐蚀刻金属层的可焊性。
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