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11 条记录 (耗时 0.022 秒)

    Method for adjusting the electrical resistance of a resistance path
    1.
    发明申请
    Method for adjusting the electrical resistance of a resistance path 审中-公开
    调整电阻路径电阻的方法

    公开(公告)号：US20060164201A1

    公开(公告)日：2006-07-27

    申请号：US10540653

    申请日：2003-11-17

    申请人： Harald Guenschel ,  Roland Guenschel ,  Bernd Schumann ,  Lothar Diehl ,  Dirk Rady

    发明人： Harald Guenschel ,  Roland Guenschel ,  Bernd Schumann ,  Lothar Diehl ,  Dirk Rady

    IPC分类号： H01C7/13

    CPC分类号： H01C17/267 ,  H01C17/2408

    摘要： A method for adjusting the electrical resistance of an electrical resistor run running in meandering windings and situated between two layers, to a specified value at which the resistor run is produced having a lower resistance with reference to the specified value and having burn-up segments bridging meandering windings, and the adjustment is undertaken by cutting open selected burn-up segments. To achieve a simple adjusting method, constant current pulses having a controlled pulse duration are sent through the burn-up segments to cut open the burn-up segment.

    摘要翻译： 一种调节在蜿蜒绕组中运行并位于两层之间的电阻器的电阻的方法，其特征在于产生电阻器运行的规定值，具有相对于规定值具有较低电阻并且具有烧毁段桥接 曲折绕组，并且通过切割所选择的燃烧段进行调整。 为了实现简单的调节方法，通过燃烧段发送具有受控脉冲持续时间的恒定电流脉冲以切断燃烧段。

    Semiconductor wafer having a multitude of sensor elements and method for measuring sensor elements on a semiconductor wafer
    2.
    发明授权
    Semiconductor wafer having a multitude of sensor elements and method for measuring sensor elements on a semiconductor wafer 有权
    具有多个传感器元件的半导体晶片和用于测量半导体晶片上的传感器元件的方法

    公开(公告)号：US07872487B2

    公开(公告)日：2011-01-18

    申请号：US12276572

    申请日：2008-11-24

    申请人： Holger Ross ,  Hubert Benzel ,  Roland Guenschel ,  Harald Guenschel

    发明人： Holger Ross ,  Hubert Benzel ,  Roland Guenschel ,  Harald Guenschel

    IPC分类号： G01R31/02 ,  G01R31/26

    CPC分类号： H01L22/32 ,  H01L2924/0002 ,  H01L2924/00

    摘要： In the measurement of sensor elements in a wafer composite, whereby non-electric stimuli are to be applied to the sensor elements, a semiconductor wafer having a multitude of sensor elements, each sensor element having a voltage supply connection, a grounded connection, and at least one sensor signal output, is configured such that a bus system is integrated in the semiconductor wafer, to which bus system at least the grounded connections of the sensor elements are connected and via which a supply voltage may be applied to the sensor elements, and that each sensor element is equipped with at least one controllable switching element for selecting the sensor element, so that only a selected sensor element supplies a sensor signal to a diagnosis device.

    摘要翻译： 在晶片复合体中的传感器元件的测量中，由此将非电刺激施加到传感器元件，具有多个传感器元件的半导体晶片，每个传感器元件具有电压供应连接，接地连接和 至少一个传感器信号输出被配置为使得总线系统集成在半导体晶片中，至少连接传感器元件的接地连接的总线系统并且经由该总线系统可以将电源电压施加到传感器元件，以及 每个传感器元件配备有用于选择传感器元件的至少一个可控开关元件，使得仅一个选定的传感器元件将传感器信号提供给诊断装置。

    Pressure sensor having a silicon chip on a steel diaphragm
    4.
    发明授权
    Pressure sensor having a silicon chip on a steel diaphragm 有权
    压力传感器在钢隔膜上具有硅芯片

    公开(公告)号：US07093493B2

    公开(公告)日：2006-08-22

    申请号：US11055473

    申请日：2005-02-09

    申请人： Hubert Benzel ,  Masoud Habibi ,  Gilbert Moersch ,  Roland Guenschel ,  Jan Gebauer

    发明人： Hubert Benzel ,  Masoud Habibi ,  Gilbert Moersch ,  Roland Guenschel ,  Jan Gebauer

    IPC分类号： E03B1/00

    CPC分类号： G01L19/146 ,  G01L9/0048 ,  G01L9/0055

    摘要： A micromechanical device for measuring a pressure variable and a method for manufacturing a micromechanical pressure sensor. The sensor includes, two components; a first component featuring a diaphragm made of a first material, and a second component of a second material. This second component is designed to have a thin first region and a thick second region. The first and second components are permanently joined together via the first diaphragm and at least a portion of the first region. The materials are selected such that the temperature expansion coefficient of the first material is higher than that of the second material. The first and second components are joined in such a manner that a lateral expansion of the first diaphragm caused by temperature changes is transferred to the first region of the second component as a lateral expansion as well.

    摘要翻译： 用于测量压力变量的微机械装置和用于制造微机械压力传感器的方法。 传感器包括两个部件; 具有由第一材料制成的隔膜的第一部件和第二材料的第二部件。 该第二部件被设计成具有薄的第一区域和厚的第二区域。 第一和第二部件通过第一隔膜和第一区域的至少一部分永久地连接在一起。 选择材料使得第一材料的温度膨胀系数高于第二材料的温度膨胀系数。 第一和第二部件以这样的方式接合，使得由温度变化引起的第一隔膜的横向膨胀也作为横向膨胀传递到第二部件的第一区域。

    SENSOR SYSTEM AND METHOD FOR MANUFACTURING SAME
    5.
    发明申请
    SENSOR SYSTEM AND METHOD FOR MANUFACTURING SAME 审中-公开
    传感器系统及其制造方法

    公开(公告)号：US20110073969A1

    公开(公告)日：2011-03-31

    申请号：US12893340

    申请日：2010-09-29

    申请人： Hubert Benzel ,  Roland Guenschel

    发明人： Hubert Benzel ,  Roland Guenschel

    IPC分类号： H01L29/84 ,  H01L21/50

    CPC分类号： B81B7/007 ,  B81B2201/0264 ,  B81B2207/096 ,  G01L9/0042 ,  G01L9/0045 ,  G01L9/0054 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014

    摘要： An assembly and connection technology for a sensor system, including a sensor element having circuit elements integrated into the top side and a carrier for the sensor element, which is simple and robust and which does not require any further packaging measures for protecting the circuit elements and electrical terminals of the sensor elements after the isolation of the sensor elements. For this purpose, the carrier is provided with through contacts. In addition, the sensor element is installed in flip-chip technology on the carrier, so that the top side of the sensor element is at least regionally capped by the carrier and the circuit elements of the sensor element can be electrically contacted from the rear side of the carrier via the through contacts.

    摘要翻译： 一种用于传感器系统的组装和连接技术，其包括具有集成在顶侧中的电路元件的传感器元件和用于传感器元件的载体，该传感器元件简单且牢固，并且不需要任何进一步的包装措施来保护电路元件和 传感器元件的电气端子隔离传感器元件后。 为此目的，通过触点提供载体。 此外，传感器元件以倒装芯片技术安装在载体上，使得传感器元件的顶侧至少被载体区域地覆盖，并且传感器元件的电路元件可以从后侧电接触 的载体通过通孔。

    Micromechanical pressure sensor
    8.
    发明授权
    Micromechanical pressure sensor 有权
    微机械压力传感器

    公开(公告)号：US07055392B2

    公开(公告)日：2006-06-06

    申请号：US10881382

    申请日：2004-06-30

    申请人： Joerg Muchow ,  Hubert Benzel ,  Roland Guenschel

    发明人： Joerg Muchow ,  Hubert Benzel ,  Roland Guenschel

    IPC分类号： G01L7/08

    CPC分类号： G01L9/0042 ,  G01L9/0054

    摘要： A micromechanical pressure sensor which is made up of at least one first component element and a second component element bordering on the first component element. In this context, the first component element includes at least one diaphragm and one cavity. The cavity is arranged or structured so that the medium to be measured gains access to the diaphragm through the cavity. In addition, in the second component element an opening is provided which guides the medium to be measured to the cavity. At least a part of the cavity represents an extension, without a transition, of the opening in the second component.

    摘要翻译： 微机械压力传感器，其由至少一个第一部件元件和与第一部件元件接壤的第二部件组成。 在本上下文中，第一部件元件包括至少一个隔膜和一个空腔。 空腔的布置或结构使得待测量的介质通过空腔进入隔膜。 另外，在第二构成要素中，设置有将待测量介质引导到空腔的开口。 空腔的至少一部分表示第二部件中的开口的没有转变的延伸部。

    Pressure sensor having a silicon chip on a steel diaphragm
    9.
    发明申请
    Pressure sensor having a silicon chip on a steel diaphragm 有权
    压力传感器在钢隔膜上具有硅芯片

    公开(公告)号：US20050178208A1

    公开(公告)日：2005-08-18

    申请号：US11055473

    申请日：2005-02-09

    申请人： Hubert Benzel ,  Masoud Habibi ,  Gilbert Moersch ,  Roland Guenschel ,  Jan Gebauer

    发明人： Hubert Benzel ,  Masoud Habibi ,  Gilbert Moersch ,  Roland Guenschel ,  Jan Gebauer

    IPC分类号： B81B3/00 ,  G01L9/00 ,  H01L29/84 ,  E03B1/00

    CPC分类号： G01L19/146 ,  G01L9/0048 ,  G01L9/0055

    摘要： A micromechanical device for measuring a pressure variable and a method for manufacturing a micromechanical pressure sensor. The sensor includes, two components; a first component featuring a diaphragm made of a first material, and a second component of a second material. This second component is designed to have a thin first region and a thick second region. The first and second components are permanently joined together via the first diaphragm and at least a portion of the first region. The materials are selected such that the temperature expansion coefficient of the first material is higher than that of the second material. The first and second components are joined in such a manner that a lateral expansion of the first diaphragm caused by temperature changes is transferred to the first region of the second component as a lateral expansion as well.

    摘要翻译： 用于测量压力变量的微机械装置和用于制造微机械压力传感器的方法。 传感器包括两个部件; 具有由第一材料制成的隔膜的第一部件和第二材料的第二部件。 该第二部件被设计成具有薄的第一区域和厚的第二区域。 第一和第二部件通过第一隔膜和第一区域的至少一部分永久地连接在一起。 选择材料使得第一材料的温度膨胀系数高于第二材料的温度膨胀系数。 第一和第二部件以这样的方式接合，使得由温度变化引起的第一隔膜的横向膨胀也作为横向膨胀传递到第二部件的第一区域。