Methods for Preparation of High-Purity Polysilicon Rods Using a Metallic Core Means
    1.
    发明申请
    Methods for Preparation of High-Purity Polysilicon Rods Using a Metallic Core Means 有权
    使用金属核心手段制备高纯度多晶硅棒的方法

    公开(公告)号:US20100221454A1

    公开(公告)日:2010-09-02

    申请号:US12160837

    申请日:2007-05-21

    IPC分类号: C23C16/24 C23C16/46

    摘要: The present invention relates to a method for preparing a polysilicon rod using a metallic core means, comprising: installing a core means in an inner space of a deposition reactor used for preparing a silicon rod, wherein the core means (C) is constituted by forming one or a plurality of separation layer(s) on the surface of a metallic core element and is connected to an electrode means (E), heating the core means (C) by supplying electricity through the electrode means (E), and supplying a reaction gas (Gf) into the inner space (Ri) for silicon deposition, thereby forming a deposition output in an outward direction on the surface of the core means (C). According to the present invention, the deposition output (D) and the core means (C) can be separated easily from the silicon rod output obtained by the process of silicon deposition, and the contamination of the deposition output caused by impurities of the metallic core element (Ca) can be minimized, thereby a high-purity silicon can be prepared in a more economic and convenient way.

    摘要翻译: 本发明涉及一种使用金属芯装置制备多晶硅棒的方法,包括:在用于制备硅棒的沉积反应器的内部空间中安装芯装置,其中芯装置(C)由成形 金属芯体表面上的一个或多个分离层,并连接到电极装置(E),通过电极装置(E)供电来加热芯装置(C),并且将 反应气体(Gf)进入用于硅沉积的内部空间(Ri)中,从而在芯装置(C)的表面上沿向外的方向形成沉积输出。 根据本发明,沉积输出(D)和芯装置(C)可以容易地从通过硅沉积过程获得的硅棒输出分离,并且由金属芯的杂质引起的沉积输出的污染 元素(Ca)可以最小化,从而可以以更经济和方便的方式制备高纯度硅。

    Sealing structure for a single-bodied end cap of splice closure for
optical cables
    4.
    发明授权
    Sealing structure for a single-bodied end cap of splice closure for optical cables 失效
    用于光缆的单体端盖的密封端盖的密封结构

    公开(公告)号:US5949022A

    公开(公告)日:1999-09-07

    申请号:US617084

    申请日:1996-03-18

    IPC分类号: G02B6/44 H02G15/013 H02G15/04

    摘要: A cable splice closure assembly includes an end cap body having at least one cable passage hole therein for the passage of a cable therethrough, the end cap body defining a seal zone for retaining a sealing material and a thread zone, and a screw plug having a cable passage hole therein for the passage of a cable therethrough, the screw plug being adapted for mating engagement with the thread zone of the end cap body.

    摘要翻译: 电缆接头闭合组件包括端盖体,其中至少有一个电缆通道孔用于使电缆穿过其中,端盖主体限定用于保持密封材料和螺纹区域的密封区域,以及具有 电缆通道孔在其中,用于使电缆穿过其中,螺塞适于与端盖主体的螺纹区域配合接合。

    Apparatus for loading and unloading semiconductor device packages using servo motors
    5.
    发明授权
    Apparatus for loading and unloading semiconductor device packages using servo motors 失效
    使用伺服电机装载和卸载半导体器件封装的装置

    公开(公告)号:US06209194B1

    公开(公告)日:2001-04-03

    申请号:US08943231

    申请日:1997-10-03

    IPC分类号: B23P1900

    摘要: An automatic loading and unloading apparatus using servo motors allows simultaneous loading and unloading of two or more semiconductor device packages into and from test devices. The loading and unloading apparatus has a feeding mechanism which has a feed container carrying two semiconductor device packages which have not yet been tested; a loading tool for transferring those two semiconductor device packages from the feed container to a centering position; a DC test contact tool; an insertion tool; a removal tool; and a sorting station for sorting the semiconductor device packages depending on results of a burn-in test. The tools of the apparatus are driven by the action of servo motors, thereby allowing independent movements thereof in the vertical and horizontal directions.

    摘要翻译: 使用伺服电动机的自动装卸装置允许将两个或多个半导体器件封装同时装入和卸载进入测试装置和从测试装置卸载。 装载和卸载装置具有进给机构,其具有携带两个尚未被测试的半导体器件封装的馈送容器; 用于将这两个半导体器件封装从进料容器转移到定心位置的装载工具; DC测试接触工具; 插入工具; 移除工具; 以及根据老化测试的结果对半导体器件封装进行分类的分类站。 该装置的工具由伺服电机的作用驱动,从而允许其在垂直和水平方向上的独立移动。