公开(公告)号：US08265407B2

公开(公告)日：2012-09-11

申请号：US12371134

申请日：2009-02-13

申请人： Soo-Kyun Kim ,  Sang-Wook Oh ,  Byung-Jun Son ,  Tae-Hwa Hong ,  Sung-Dae Cho ,  Hae-Young Lee ,  Dae-Young Kim ,  Sung-Yeol Lee ,  Nak-Kwon Lim

发明人： Soo-Kyun Kim ,  Sang-Wook Oh ,  Byung-Jun Son ,  Tae-Hwa Hong ,  Sung-Dae Cho ,  Hae-Young Lee ,  Dae-Young Kim ,  Sung-Yeol Lee ,  Nak-Kwon Lim

IPC分类号： G06K9/36

CPC分类号： G06T17/20

摘要： A method for coding three-dimensional (3D) data, and more particularly for coding geometry data included in the 3D data. The method includes: generating a bounding box including a vertex of the 3D data based on information included in the geometry data; dividing the bounding box into a plurality of partitions having an equal size; identifying a number of vertices included in each divided partition; appointing a divided partition as a leaf cell based on the identified number of vertices; and coding the geometry data using information on the dividing of the bounding box, information on vertices included in each divided partition, and information indicating the position of a vertex included in the leaf cell, when a divided partition is subdivided.

摘要翻译： 一种用于对三维（3D）数据进行编码的方法，更具体地说，用于对包括在3D数据中的几何数据进行编码。 该方法包括：基于几何数据中包含的信息，生成包含3D数据的顶点的边界框; 将所述边界框划分成具有相同大小的多个分区; 识别包括在每个划分的分区中的多个顶点; 基于所识别的顶点数目，将划分的分区指定为叶单元; 并且使用关于边界框的划分的信息，包括在每个划分的分区中的顶点的信息以及指示叶单元中包括的顶点的位置的信息来编码几何数据，当划分的分区被细分时。

公开(公告)号：US20080042279A1

公开(公告)日：2008-02-21

申请号：US11842858

申请日：2007-08-21

申请人： Hyo-Jae BANG ,  Wha-Su SIN ,  Sung-Yeol LEE ,  Yung-Hyun KIM ,  Seong-Chan HAN ,  Jung-Hyeon KIM

发明人： Hyo-Jae BANG ,  Wha-Su SIN ,  Sung-Yeol LEE ,  Yung-Hyun KIM ,  Seong-Chan HAN ,  Jung-Hyeon KIM

IPC分类号： H01L23/488 ,  H01L21/60 ,  H01L21/66

CPC分类号： H01L21/4853 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/03828 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/05609 ,  H01L2224/05611 ,  H01L2224/05613 ,  H01L2224/05616 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05669 ,  H01L2224/111 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/1369 ,  H01L2224/16 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/351 ,  H05K3/4015 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A mounting structure of a semiconductor device and a method of mounting the semiconductor device are provided. The mounting structure includes a circuit substrate having a terminal pad. A device substrate is located over the circuit substrate having a ball pad facing the terminal pad of the circuit substrate. A conductive ball is formed between the circuit substrate and the device substrate in order to connect the terminal pad of the circuit substrate to the ball pad of the device substrate. A first soldering flux including an epoxy-based resin connects the conductive ball to the ball pad of the device substrate. An underfill layer is formed between the circuit substrate and the device substrate in order to bury the conductive ball and the first soldering flux. Using the epoxy-based resin, the first soldering flux can substantially prevent crack from being generated in a solder joint between the conductive ball and the ball pad even when the device substrate is thermally deformed due to temperature variations.

摘要翻译： 提供半导体器件的安装结构和安装半导体器件的方法。 安装结构包括具有终端焊盘的电路基板。 器件衬底位于电路衬底上方，该衬底具有面向电路衬底的端子焊盘的球垫。 在电路基板和器件基板之间形成导电球，以将电路基板的端子焊盘连接到器件基板的球垫。 包括环氧基树脂的第一助焊剂将导电球连接到器件基板的球垫。 在电路基板和器件基板之间形成底部填充层，以便埋入导电球和第一焊剂。 使用环氧树脂，即使当器件基板由于温度变化而发生热变形时，第一焊剂可以基本上防止在导电球和球垫之间的焊接接头中产生裂纹。

公开(公告)号：US06209194B1

公开(公告)日：2001-04-03

申请号：US08943231

申请日：1997-10-03

申请人： Ju Il Kang ,  Byung Ro Kim ,  Sung Yeol Lee ,  Hyun Ho Kim ,  Young Ki Park

发明人： Ju Il Kang ,  Byung Ro Kim ,  Sung Yeol Lee ,  Hyun Ho Kim ,  Young Ki Park

IPC分类号： B23P1900

CPC分类号： G01R31/2893 ,  G01R31/2851 ,  G01R31/2887 ,  Y10T29/49137 ,  Y10T29/53174 ,  Y10T29/53178

摘要： An automatic loading and unloading apparatus using servo motors allows simultaneous loading and unloading of two or more semiconductor device packages into and from test devices. The loading and unloading apparatus has a feeding mechanism which has a feed container carrying two semiconductor device packages which have not yet been tested; a loading tool for transferring those two semiconductor device packages from the feed container to a centering position; a DC test contact tool; an insertion tool; a removal tool; and a sorting station for sorting the semiconductor device packages depending on results of a burn-in test. The tools of the apparatus are driven by the action of servo motors, thereby allowing independent movements thereof in the vertical and horizontal directions.

摘要翻译： 使用伺服电动机的自动装卸装置允许将两个或多个半导体器件封装同时装入和卸载进入测试装置和从测试装置卸载。 装载和卸载装置具有进给机构，其具有携带两个尚未被测试的半导体器件封装的馈送容器; 用于将这两个半导体器件封装从进料容器转移到定心位置的装载工具; DC测试接触工具; 插入工具; 移除工具; 以及根据老化测试的结果对半导体器件封装进行分类的分类站。 该装置的工具由伺服电机的作用驱动，从而允许其在垂直和水平方向上的独立移动。

公开(公告)号：US20090202160A1

公开(公告)日：2009-08-13

申请号：US12371134

申请日：2009-02-13

申请人： Soo-Kyun KIM ,  Sang-Wook Oh ,  Byung-Jun Son ,  Tae-Hwa Hong ,  Sung-Dae Cho ,  Hae-Young Lee ,  Dae-Young Kim ,  Sung-Yeol Lee ,  Nak-Kwon Lim

发明人： Soo-Kyun KIM ,  Sang-Wook Oh ,  Byung-Jun Son ,  Tae-Hwa Hong ,  Sung-Dae Cho ,  Hae-Young Lee ,  Dae-Young Kim ,  Sung-Yeol Lee ,  Nak-Kwon Lim

IPC分类号： G06K9/46 ,  G06T15/00

CPC分类号： G06T17/20

摘要： A method for coding three-dimensional (3D) data, and more particularly for coding geometry data included in the 3D data. The method includes: generating a bounding box including a vertex of the 3D data based on information included in the geometry data; dividing the bounding box into a plurality of partitions having an equal size; identifying a number of vertices included in each divided partition; appointing a divided partition as a leaf cell based on the identified number of vertices; and coding the geometry data using information on the dividing of the bounding box, information on vertices included in each divided partition, and information indicating the position of a vertex included in the leaf cell, when a divided partition is subdivided.

摘要翻译： 一种用于对三维（3D）数据进行编码的方法，更具体地说，用于对包括在3D数据中的几何数据进行编码。 该方法包括：基于几何数据中包含的信息，生成包含3D数据的顶点的边界框; 将所述边界框划分成具有相同大小的多个分区; 识别包括在每个划分的分区中的多个顶点; 基于所识别的顶点数目，将划分的分区指定为叶单元; 并且使用关于边界框的划分的信息，包括在每个划分的分区中的顶点的信息以及指示叶单元中包括的顶点的位置的信息来编码几何数据，当划分的分区被细分时。