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    Apparatus for cleaning semiconductor wafers
    8.
    发明授权
    Apparatus for cleaning semiconductor wafers 失效
    用于清洁半导体晶片的设备

    公开(公告)号：US5626159A

    公开(公告)日：1997-05-06

    申请号：US686367

    申请日：1996-07-25

    申请人： Henry F. Erk ,  Ronald D. Bartram ,  Eugene R. Hollander ,  Jing Chai

    发明人： Henry F. Erk ,  Ronald D. Bartram ,  Eugene R. Hollander ,  Jing Chai

    IPC分类号： H01L21/304 ,  B08B3/10 ,  B08B3/12 ,  H01L21/00 ,  H01L21/306

    CPC分类号： H01L21/02052 ,  B08B3/10 ,  B08B3/12 ,  H01L21/67057 ,  Y10S134/902

    摘要： A method of cleaning a semiconductor wafer comprises placing liquid in a bath with a gas-liquid-interface defined at the surface of the liquid. A semiconductor wafer is placed in the bath so that it is oriented in a generally upright position with at least part of the wafer being in the liquid and below the gas-liquid-interface. Sonic energy is directed through the liquid. At least one of the position of the semiconductor wafer and the level of liquid in the bath relative to the semiconductor wafer is varied so that the entire surface of the wafer repeatedly passes through the gas-liquid-interface.

    摘要翻译： 一种清洁半导体晶片的方法包括将液体放置在液体界面界定的液 - 液界面的浴中。 将半导体晶片放置在浴中，使得其定向在大致直立的位置，其中晶片的至少一部分在液体中并在气液界面下方。 声能被引导通过液体。 改变半导体晶片的位置和相对于半导体晶片的液体液位中的至少一个，使得晶片的整个表面反复通过气液界面。

    Method and apparatus for processing a semiconductor wafer using novel final polishing method
    10.
    发明授权
    Method and apparatus for processing a semiconductor wafer using novel final polishing method 有权
    使用新的最终抛光方法处理半导体晶片的方法和装置

    公开(公告)号：US06709981B2

    公开(公告)日：2004-03-23

    申请号：US09928559

    申请日：2001-08-13

    申请人： Alexis Grabbe ,  Mick Bjelopavlic ,  Ashley S. Hull ,  Michele L. Haler ,  Guoqiang (David) Zhang ,  Henry F. Erk ,  Yun-Biao Xin

    发明人： Alexis Grabbe ,  Mick Bjelopavlic ,  Ashley S. Hull ,  Michele L. Haler ,  Guoqiang (David) Zhang ,  Henry F. Erk ,  Yun-Biao Xin

    IPC分类号： H01L21461

    CPC分类号： H01L21/02052 ,  B24B37/0056 ,  B24B37/042 ,  B24B37/08 ,  B24B53/017 ,  H01L21/02024 ,  Y10S438/928 ,  Y10S438/959

    摘要： A method of manufacturing a semiconductor wafer includes providing an ingot of semiconductor material, slicing the wafer from the ingot, and processing the wafer to increase parallelism of the front surface and the back surface. A final polishing operation on at least the front surface is performed by positioning the wafer between a first pad and a second pad and obtaining motion of the front and back surfaces of the wafer relative to the first and second pads to maintain parallelism of the front and back surfaces and to produce a finish on at least the front surface of the wafer so that the front surface is prepared for integrated circuit fabrication. In another aspect, the wafer is rinsed by a rinsing fluid to increase hydrodynamic lubrication. Other methods are directed to conditioning the polishing pad and to handling wafers after polishing. An apparatus for polishing wafers is also included.

    摘要翻译： 制造半导体晶片的方法包括提供半导体材料锭，从锭切片晶片，以及加工晶片以增加前表面和后表面的平行度。 通过将晶片定位在第一焊盘和第二焊盘之间并且获得晶片的前表面和后表面相对于第一和第二焊盘的运动来实现至少前表面的最终抛光操作，以保持晶片的前表面和第二焊盘的平行度 并且在至少晶片的前表面上产生光洁度，使得前表面准备用于集成电路制造。 在另一方面，通过冲洗流体冲洗晶片以增加流体动力润滑。 其他方法涉及调整抛光垫和抛光后处理晶片。 还包括用于抛光晶片的设备。