METHOD, TREATMENT STATION AND ASSEMBLY FOR TREATING A PLANAR MATERIAL TO BE TREATED
    1.
    发明申请
    METHOD, TREATMENT STATION AND ASSEMBLY FOR TREATING A PLANAR MATERIAL TO BE TREATED 有权
    方法,处理站和组装处理待处理的平面材料

    公开(公告)号:US20120080322A1

    公开(公告)日:2012-04-05

    申请号:US13320522

    申请日:2010-05-12

    Applicant: Henry Kunze

    Inventor: Henry Kunze

    Abstract: In order to remove treatment liquid (21) from a planar material to be treated (10), which is transported in an assembly for the electrolytic or wet-chemical treatment of the material to be treated (10), or to promote the exchange of material on the surface of the material to be treated (10), a roll with a roll surface (4, 14) is provided. The roll surface (4, 14) is arranged relative to a transport path of the material to be treated (10) so that a gap (8, 18) remains between the roll surface (4, 14) and a useful region of the material to be treated (10) opposing the roll surface (4, 14), which extends over the useful region. The roll is driven rotatably so that at the gap (8, 18) a relative speed is produced between the roll surface (4, 14) and the material to be treated (10).

    Abstract translation: 为了将待处理的平面材料(10)中的处理液(21)从用于电解或湿化学处理待处理材料(10)的组件中运输,或促进交换 提供待处理材料(10)的表面上的材料,具有辊表面(4,14)的辊。 辊表面(4,14)相对于待处理材料(10)的输送路径布置,使得间隙(8,18)保留在辊表面(4,14)和材料的有用区域之间 待处理(10)与在有用区域上延伸的辊表面(4,14)相对。 辊可旋转地驱动,使得在间隙(8,18)处,在辊表面(4,14)和待处理材料(10)之间产生相对速度。

    Treatment unit for the wet-chemical or electrolytic treatment of flat workpieces
    2.
    发明申请
    Treatment unit for the wet-chemical or electrolytic treatment of flat workpieces 有权
    用于湿式化学或电解处理扁平工件的处理单元

    公开(公告)号:US20070012560A1

    公开(公告)日:2007-01-18

    申请号:US10581353

    申请日:2004-07-12

    Abstract: The present invention relates to treatment units for the wet-chemical or electrolytic treatment of flat workpieces (1), such as metal foils, printed circuit foils or printed circuit boards, in which the workpieces (1) are transported on a conveying path by means of conveying members (6, 6′, 6″, 7). The treatment unit comprises carrier elements (4) with recesses (21), said carrier elements (4) being oriented to be parallel to the conveying path, and at least one module system for carrying the conveying members (6, 6′, 6″, 7) that consist of insertion elements (14, 26), preferably arranged in pairs, the at least one module system being configured such that it registers with and is preferably slidable into the recesses (21) of the carrier elements (4). The treatment unit is preferably utilized in horizontal conveyorized lines.

    Abstract translation: 本发明涉及用于湿式化学或电解处理扁平工件(1)的处理单元,例如金属箔,印刷电路箔或印刷电路板,其中工件(1)通过装置在输送路径上输送 的输送构件(6,6',6“,7)。 处理单元包括具有凹槽(21)的载体元件(4),所述载体元件(4)被定向成平行于输送路径,并且至少一个模块系统用于承载传送构件(6,6',6' ',7),其包括优选成对布置的插入元件(14,26),所述至少一个模块系统被配置为使得其与载体元件(4)的凹部(21)配准并优选地可滑动到所述载体元件(4)的凹部(21) 。 处理单元优选地用于水平输送线。

    VERTICAL SYSTEM FOR THE PLATING TREATMENT OF A WORK PIECE AND METHOD FOR CONVEYING THE WORK PIECE

    公开(公告)号:US20100200410A1

    公开(公告)日:2010-08-12

    申请号:US12602674

    申请日:2008-06-03

    Abstract: The present invention relates to a vertical system for the plating treatment of a work piece (W), the said system including at least two treatment modules (100) and at least one transport device for conveying at least one work piece (W) to a treatment module (100) and for transferring the work piece (W) to retaining devices (130) in the treatment module (100). The retaining devices (130) for the work piece (W) are provided in the treatment modules (100). The transport device includes at least one gripping device (10) retaining the work piece (W) each with at least one fastening device (20, 30). Each fastening device (20, 30) includes first clamping devices (25, 35) that are each associated with one side of the work piece (W) and second clamping devices (26). At least one first clamping device (25, 35) associated with a first side of the work piece (W) is designed and disposed such that the position of the first side of the work piece (W) can be defined by the first clamping device (25, 35). At least one second clamping device (26) associated with a second side of the work piece (W) is designed and disposed such that a clamping force can be exerted onto the work piece (W) by the said clamping device. Both the first clamping device (25, 35) and the second clamping device (26) are moveable. According to the invention, the gripping device (10) is actuated as follows: a) moving the first clamping device (25, 35) such that the first clamping device (25, 35) takes over a contact position and thereby the position of the first side of the work piece (W) is defined, and b) moving the second clamping device (26) such that the second clamping device (26) takes over a clamping position and the work piece (W) is thereby clamped together with the at least one first clamping device (25, 35). In doing so the first clamping device (25, 35) takes over the contact position before the second clamping device (26) takes the clamping position.

    APPARATUS AND METHOD FOR THE ELECTROLYTIC TREATMENT OF A PLATE-SHAPED PRODUCT
    4.
    发明申请
    APPARATUS AND METHOD FOR THE ELECTROLYTIC TREATMENT OF A PLATE-SHAPED PRODUCT 有权
    用于电镀处理板形产品的装置和方法

    公开(公告)号:US20100176004A1

    公开(公告)日:2010-07-15

    申请号:US12602703

    申请日:2008-06-03

    Abstract: An apparatus for the electrolytic treatment of the product L using a treatment agent is used to make the treatment of a plate-shaped product more uniform. This apparatus includes: devices for retaining 40, 42 the product L in the apparatus, one or a plurality of flow devices 10, which each include at least one nozzle 15 and are disposed situated opposite the product L, one or a plurality of counter electrodes 30, which are inert relative to the treatment agent and are disposed parallel to at least one treatment surface, means for generating a relative movement 44 between the product L, on the side, and the flow devices 10 and/or the counter electrodes 30, on the other side, in at least one direction parallel to a treatment surface. The product L can be immersed into the treatment agent during the treatment.

    Abstract translation: 使用用于使用处理剂电解处理产品L的装置来使板状产品的处理更均匀。 该装置包括:用于将产品L保持在设备中的装置,一个或多个流动装置10,每个流动装置10包括至少一个喷嘴15并且设置成与产品L相对设置,一个或多个对置电极 30,其相对于处理剂是惰性的并且平行于至少一个处理表面设置,用于在产品L和侧流体装置10和/或对电极30之间产生相对运动的装置44, 在另一侧,在平行于处理表面的至少一个方向上。 产品L可以在处理过程中浸入处理剂中。

    Apparatus and method for the electrolytic treatment of a plate-shaped product
    5.
    发明授权
    Apparatus and method for the electrolytic treatment of a plate-shaped product 有权
    用于电镀处理板状产品的装置和方法

    公开(公告)号:US08545687B2

    公开(公告)日:2013-10-01

    申请号:US12602703

    申请日:2008-06-03

    Abstract: Apparatus for the electrolytic treatment of the product L using a treatment agent is used to make the treatment of a plate-shaped product more uniform. This apparatus includes devices 40, 42 for retaining the product L in the apparatus, one or more flow devices 10, which each include at least one nozzle 15 and are disposed situated opposite the product L, one or more counter electrodes 30, which are inert relative to the treatment agent and are disposed parallel to at least one treatment surface, eccentric motor means for generating a relative movement 44 between the product L, on the side, and the flow devices 10 and/or the counter electrodes 30, on the other side, in at least one direction parallel to a treatment surface. The product L can be immersed in the treatment agent during treatment.

    Abstract translation: 用于使用处理剂电解处理产品L的装置用于使板状产品的处理更均匀。 该装置包括用于将产品L保持在设备中的装置40,42,一个或多个流动装置10,每个流动装置10包括至少一个喷嘴15并且设置成与产品L相对设置,一个或多个对电极30是惰性的 相对于处理剂并且平行于至少一个处理表面设置的偏心马达装置,用于在另一方的产品L和流动装置10和/或对置电极30之间产生相对运动44 在平行于处理表面的至少一个方向上。 产品L可以在处理过程中浸入处理剂中。

    Treatment unit for the wet-chemical or electrolytic treatment of flat workpieces
    6.
    发明授权
    Treatment unit for the wet-chemical or electrolytic treatment of flat workpieces 有权
    用于湿式化学或电解处理扁平工件的处理单元

    公开(公告)号:US07993486B2

    公开(公告)日:2011-08-09

    申请号:US10581353

    申请日:2004-12-07

    Abstract: The present invention relates to treatment units for the wet-chemical or electrolytic treatment of flat workpieces (1), such as metal foils, printed circuit foils or printed circuit boards, in which the workpieces (1) are transported on a conveying path by means of conveying members (6, 6′, 6″, 7). The treatment unit comprises carrier elements (4) with recesses (21), said carrier elements (4) being oriented to be parallel to the conveying path, and at least one module system for carrying the conveying members (6, 6′, 6″, 7) that consist of insertion elements (14, 26), preferably arranged in pairs, the at least one module system being configured such that it registers with and is preferably slidable into the recesses (21) of the carrier elements (4). The treatment unit is preferably utilized in horizontal conveyorized lines.

    Abstract translation: 本发明涉及用于湿式化学或电解处理扁平工件(1)的处理单元,例如金属箔,印刷电路箔或印刷电路板,其中工件(1)通过装置在输送路径上输送 的输送构件(6,6',6“,7)。 处理单元包括具有凹槽(21)的载体元件(4),所述载体元件(4)被定向成平行于传送路径,并且至少一个模块系统用于承载输送构件(6,6',6“ ,7),其包括优选成对布置的插入元件(14,26),所述至少一个模块系统被配置为使得其与所述载体元件(4)的凹部(21)配准并且优选地可滑动到所述载体元件(4)的凹部(21)中。 处理单元优选地用于水平输送线。

    Method and assembly for treating a planar material to be treated and device for removing or holding off treatment liquid
    7.
    发明授权
    Method and assembly for treating a planar material to be treated and device for removing or holding off treatment liquid 有权
    用于处理待处理的平面材料的方法和组件以及用于去除或阻止处理液体的装置

    公开(公告)号:US09016230B2

    公开(公告)日:2015-04-28

    申请号:US13320504

    申请日:2010-05-12

    Abstract: In order to remove treatment liquid (21) from a planar material to be treated (10), which is transported in an assembly for wet-chemical treatment of the material to be treated (10), a retaining surface (4, 14) is provided for holding back the treatment liquid (21). The retaining surface (4, 14) is arranged relative to a transport path of the material to be treated (10) so that a gap (8, 18) remains between the retaining surface (4, 14) and a surface of the material to be treated (10) opposing the retaining surface (4, 14), when the material to be treated (10) is moved past the retaining surface (4, 14). The retaining surface (4, 14) may, for example, be provided as an offset portion of a peripheral surface of a roll (2, 3).

    Abstract translation: 为了从待处理材料(10)的湿化学处理组件中输送的待处理平面材料(10)中除去处理液(21),保持面(4,14)为 用于阻止处理液体(21)。 保持表面(4,14)相对于待处理材料(10)的输送路径布置,使得间隙(8,18)保留在保持表面(4,14)和材料表面之间 当待处理材料(10)移动经过保持表面(4,14)时,被处理(10)与保持表面(4,14)相对。 保持表面(4,14)可以例如被设置为辊(2,3)的外周表面的偏移部分。

    Nozzle arrangement
    8.
    发明授权
    Nozzle arrangement 有权
    喷嘴布置

    公开(公告)号:US07650897B2

    公开(公告)日:2010-01-26

    申请号:US10536624

    申请日:2003-11-28

    Abstract: A nozzle arrangement is described which may in particular be used as a flow nozzle in galvanization systems with horizontal throughput of printed-circuit boards. The nozzle arrangement comprises a longitudinal housing (2) with at least one fluid feed opening to feed a treatment fluid for treating a work piece, for example a printed-circuit board, and preferably a plurality of slotted fluid delivery openings (8) for releasing the treatment fluid. In the housing (2) a fluid channel (5) is formed for feeding the treatment fluid from the fluid feed opening to the fluid delivery openings (8). In order to achieve the most even possible flow speed of the treatment fluid at the fluid delivery openings (8), (a) the throughput of the fluid channel (5) for the treatment fluid reduces continuously from the fluid feed opening in the longitudinal direction of the housing (2) and/or (b) before the delivery of the fluid from the fluid delivery openings (8) a storage chamber is provided.

    Abstract translation: 描述了一种喷嘴布置,其可以特别地用作具有印刷电路板的水平吞吐量的镀锌系统中的流动喷嘴。 喷嘴装置包括具有至少一个流体供给开口的纵向壳体(2),用于输送用于处理工件的处理流体,例如印刷电路板,并且优选地,多个用于释放的开槽流体输送开口(8) 治疗液。 在壳体(2)中,形成流体通道(5),用于将处理流体从流体供给口供给流体输送口(8)。 为了实现流体输送口(8)处理流体最均匀的流速,(a)用于处理流体的流体通道(5)的通过量从纵向方向上的流体供给口连续地减少 (2)和/或(b)在从流体输送口(8)输送流体之前提供储存室。

    Nozzle arrangement
    9.
    发明申请
    Nozzle arrangement 有权
    喷嘴布置

    公开(公告)号:US20060102213A1

    公开(公告)日:2006-05-18

    申请号:US10536624

    申请日:2003-11-28

    Abstract: A nozzle arrangement is described which may in particular be used as a flow nozzle in galvanization systems with horizontal throughput of printed-circuit boards. The nozzle arrangement comprises a longitudinal housing (2) with at least one fluid feed opening to feed a treatment fluid for treating a work piece, for example a printed-circuit board, and preferably a plurality of slotted fluid delivery openings (8) for releasing the treatment fluid. In the housing (2) a fluid channel (5) is formed for feeding the treatment fluid from the fluid feed opening to the fluid delivery openings (8). In order to achieve the most even possible flow speed of the treatment fluid at the fluid delivery openings (8), (a) the throughput of the fluid channel (5) for the treatment fluid reduces continuously from the fluid feed opening in the longitudinal direction of the housing (2) and/or (b) before the delivery of the fluid from the fluid delivery openings (8) a storage chamber is provided.

    Abstract translation: 描述了一种喷嘴布置,其可以特别地用作具有印刷电路板的水平吞吐量的镀锌系统中的流动喷嘴。 喷嘴装置包括具有至少一个流体供给开口的纵向壳体(2),用于输送用于处理工件的处理流体,例如印刷电路板,并且优选地,多个用于释放的开槽流体输送开口(8) 治疗液。 在壳体(2)中,形成流体通道(5),用于将处理流体从流体供给口供给流体输送口(8)。 为了实现流体输送口(8)处理流体最均匀的流速,(a)用于处理流体的流体通道(5)的通过量从纵向方向上的流体供给开口连续地减少 (2)和/或(b)在从流体输送口(8)输送流体之前提供储存室。

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