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公开(公告)号：US5734107A
公开(公告)日：1998-03-31
申请号：US624563
申请日：1996-06-28
申请人： Herbert Boehm , Ulrich Goebel , Franz Schmich , Gerald Hopf , Roland Feucht , Albert-Andreas Hoebel , Botho Ziegenbein , Bernd Maihoefer
发明人： Herbert Boehm , Ulrich Goebel , Franz Schmich , Gerald Hopf , Roland Feucht , Albert-Andreas Hoebel , Botho Ziegenbein , Bernd Maihoefer
CPC分类号： G01P15/0922 , G01N2291/02827 , Y10T29/42 , Y10T29/49103
摘要： An acceleration sensor having a piezoelectric sensor element, which is supported as a flexural resonator in a holding module and whose electrodes are connected to an evaluation circuit. The holding module mechanically fixes the sensor element in position and provides, at the same time, for its electrical contacting.
摘要翻译： PCT No.PCT / DE95 / 00953 Sec。 371日期：1996年6月28日 102（e）日期1996年6月28日PCT提交1995年7月20日PCT公布。 出版物WO96 / 05515 日期1996年2月22日具有压电传感器元件的加速度传感器，该压电传感器元件在保持模块中作为弯曲谐振器被支撑，并且其电极连接到评估电路。 保持模块将传感器元件机械地固定就位，并同时提供其电接触。
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公开(公告)号：US06308554B1
公开(公告)日：2001-10-30
申请号：US08952000
申请日：1997-10-16
申请人： Bernhard Mattes , Lothar Gademann , Werner Nitschke , Dietrich Bergfried , Gerald Hopf , Botho Ziegenbein , Klaus Meder , Ralf Henne , Thomas Walker , Bernd Maihoefer , Frank Kursawe , Peter Schaedler
发明人： Bernhard Mattes , Lothar Gademann , Werner Nitschke , Dietrich Bergfried , Gerald Hopf , Botho Ziegenbein , Klaus Meder , Ralf Henne , Thomas Walker , Bernd Maihoefer , Frank Kursawe , Peter Schaedler
IPC分类号： G01P2100
CPC分类号： G01P21/00
摘要： An electronic device includes a resonant circuit and an evaluation circuit. The resonant circuit includes an acceleration-sensitive sensor which is excited to vibrate during a testing phase of the acceleration-sensitive sensor. The evaluation circuit is coupled to the resonant circuit to determine a performance reliability of the acceleration-sensitive sensor.
摘要翻译： 电子设备包括谐振电路和评估电路。 谐振电路包括在加速度敏感传感器的测试阶段被激发以振动的加速度敏感传感器。 评估电路耦合到谐振电路以确定加速度敏感传感器的性能可靠性。
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公开(公告)号：US5499541A
公开(公告)日：1996-03-19
申请号：US278667
申请日：1994-07-21
申请人： Gerald Hopf , Botho Ziegenbein , Bernd Maihoefer
发明人： Gerald Hopf , Botho Ziegenbein , Bernd Maihoefer
CPC分类号： G01P15/0922 , G01L1/18 , Y10S84/24
摘要： A piezoelectric force sensor includes a piezoelectric plate, with one electrode on each of the top and bottom sides of the plate. One of the electrodes is electrically connected via a conductor to a contact pad. In the case that the piezoelectric plate experiences breakage, the conductor is broken, and the remaining residual capacitance of the conductor and contact pad becomes so comparatively small that the breakage can be reliably detected.
摘要翻译： 压电力传感器包括压电板，在板的顶侧和底侧各有一个电极。 电极中的一个通过导体电连接到接触垫。 在压电板遇到破损的情况下，导体断裂，并且导体和接触焊盘的剩余电容变得相当小，从而可以可靠地检测断裂。
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公开(公告)号：US07746085B2
公开(公告)日：2010-06-29
申请号：US11040539
申请日：2005-01-20
申请人： Gerald Hopf , Oliver Kohn , Thomas Walker
发明人： Gerald Hopf , Oliver Kohn , Thomas Walker
IPC分类号： G01R27/26
摘要： A micromechanical sensor having an analyzer circuit and at least two detecting elements, each of the two detecting elements being connected to the analyzer circuit by at least one signal line. At least one signal line is connected to both detecting elements.
摘要翻译： 一种具有分析器电路和至少两个检测元件的微机械传感器，两个检测元件中的每一个通过至少一个信号线连接到分析器电路。 至少一个信号线连接到两个检测元件。
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公开(公告)号：US20110049505A1
公开(公告)日：2011-03-03
申请号：US12871666
申请日：2010-08-30
申请人： Johannes Grabowski , Holger Hoefer , Thomas Klaus , Gerald Hopf
发明人： Johannes Grabowski , Holger Hoefer , Thomas Klaus , Gerald Hopf
CPC分类号： H01L23/645 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L25/0655 , H01L2224/45124 , H01L2224/48091 , H01L2224/48137 , H01L2224/48465 , H01L2224/48471 , H01L2224/49052 , H01L2224/49175 , H01L2224/4945 , H01L2224/85181 , H01L2224/85186 , H01L2224/85986 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/30105 , H01L2224/78 , H01L2224/05599 , H01L2924/00012 , H01L2924/00
摘要： A device includes a first semiconductor chip and a second semiconductor chip which are connected to each other in an electrically conductive manner via a bonding wire, the bonding wire having a contact to the first semiconductor chip at a first contact point and having a contact to the second semiconductor chip at a second contact point, and the device including a further bonding wire which has a further first contact point and a further second contact point, a maximum distance between the bonding wire and a direct connecting line between the first and second contact points perpendicular to the connecting line being greater than a further maximum distance between the further bonding wire and a further connecting line between the further first contact point and the further second contact point perpendicular to the further connecting line.
摘要翻译： 一种器件包括通过接合线以导电方式彼此连接的第一半导体芯片和第二半导体芯片，所述接合线在第一接触点处具有与所述第一半导体芯片的接触，并且具有与所述第一接触点的接触 所述第二半导体芯片在第二接触点处，并且所述器件包括另外的接合线，所述另外的接合线具有另外的第一接触点和另外的第二接触点，所述接合线与所述第一和第二接触点之间的直接连接线之间的最大距离 垂直于连接线的另一个连接线大于另外的接合线之间的另一最大距离，以及另外的第一接触点和垂直于另一连接线的另外的第二接触点之间的另一连接线。
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公开(公告)号：US20050160831A1
公开(公告)日：2005-07-28
申请号：US11040539
申请日：2005-01-20
申请人： Gerald Hopf , Oliver Kohn , Thomas Walker
发明人： Gerald Hopf , Oliver Kohn , Thomas Walker
摘要： A micromechanical sensor having an analyzer circuit and at least two detecting elements, each of the two detecting elements being connected to the analyzer circuit by at least one signal line. At least one signal line is connected to both detecting elements.
摘要翻译： 一种具有分析器电路和至少两个检测元件的微机械传感器，两个检测元件中的每一个通过至少一个信号线连接到分析器电路。 至少一个信号线连接到两个检测元件。
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