CALORIMETER SENSOR
    9.
    发明申请
    CALORIMETER SENSOR 失效
    CALORIMETER传感器

    公开(公告)号:US20130029851A1

    公开(公告)日:2013-01-31

    申请号:US13481363

    申请日:2012-05-25

    IPC分类号: G01N25/48 C40B60/10 C40B20/00

    CPC分类号: G01N25/4806 B01L3/5027

    摘要: A calorimeter device includes various components located on a common substrate. A first (calorimeter) integrated chip device is located on the substrate. This first device has a first microfluidic channel that has first side and a second side. A first heat sensing circuit is located on the first side of the first channel and a second heat sensing circuit is located on the second side of the channel, opposite the first side and facing the first heat sensing circuit. A second integrated chip device is located on the substrate and proximal to the first device. The second device includes a second microfluidic channel having a fourth side and fifth side. A third heat sensing circuit is located on the third side of the second channel. A fourth heat sensing circuit is located on the fourth side of the channel, opposite the third side and facing the third heat sensing circuit.

    摘要翻译: 量热器装置包括位于公共基板上的各种部件。 第一(量热计)集成芯片器件位于衬底上。 该第一装置具有第一微流体通道,其具有第一侧和第二侧。 第一热感测电路位于第一通道的第一侧上,并且第二热感测电路位于通道的第二侧上,与第一侧相对并且面向第一热感测电路。 第二集成芯片器件位于衬底上并且靠近第一器件。 第二装置包括具有第四侧和第五侧的第二微流体通道。 第三热感测电路位于第二通道的第三侧。 第四热感测电路位于通道的第四侧,与第三侧相对并面对第三热感应电路。

    Calorimeter sensor
    10.
    发明授权
    Calorimeter sensor 失效
    热量计传感器

    公开(公告)号:US08696989B2

    公开(公告)日:2014-04-15

    申请号:US13481363

    申请日:2012-05-25

    CPC分类号: G01N25/4806 B01L3/5027

    摘要: A calorimeter device includes various components located on a common substrate. A first (calorimeter) integrated chip device is located on the substrate. This first device has a first microfluidic channel that has first side and a second side. A first heat sensing circuit is located on the first side of the first channel and a second heat sensing circuit is located on the second side of the channel, opposite the first side and facing the first heat sensing circuit. A second integrated chip device is located on the substrate and proximal to the first device. The second device includes a second microfluidic channel having a third side and fourth side. A third heat sensing circuit is located on the third side of the second channel. A fourth heat sensing circuit is located on the fourth side of the channel, opposite the third side and facing the third heat sensing circuit.

    摘要翻译: 量热器装置包括位于公共基板上的各种部件。 第一(量热计)集成芯片器件位于衬底上。 该第一装置具有第一微流体通道,其具有第一侧和第二侧。 第一热感测电路位于第一通道的第一侧上,并且第二热感测电路位于通道的第二侧上,与第一侧相对并且面向第一热感测电路。 第二集成芯片器件位于衬底上并且靠近第一器件。 第二装置包括具有第三侧面和第四侧面的第二微流体通道。 第三热感测电路位于第二通道的第三侧。 第四热感测电路位于通道的第四侧,与第三侧相对并面对第三热感应电路。