公开(公告)号：US07401988B2

公开(公告)日：2008-07-22

申请号：US11673257

申请日：2007-02-09

申请人： Takayuki Katano ,  Hidefumi Matsui ,  Junichi Kitano ,  Yo Suzuki ,  Masami Yamashita ,  Toru Aoyama ,  Hiroyuki Iwaki ,  Satoru Shimura

发明人： Takayuki Katano ,  Hidefumi Matsui ,  Junichi Kitano ,  Yo Suzuki ,  Masami Yamashita ,  Toru Aoyama ,  Hiroyuki Iwaki ,  Satoru Shimura

IPC分类号： G03D5/00 ,  B05C11/00

CPC分类号： H01L21/67178 ,  G03F7/70991 ,  H01L21/67017 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67184 ,  H01L21/67742 ,  H01L21/67778 ,  Y10T29/41

摘要： On top of respective areas divided by partition plates, that is, a cassette station, a processing station, and an interface section in a coating and developing processing system, gas supply sections for supplying an inert gas into the respective areas are provided. Exhaust pipes for exhausting atmospheres in the respective areas are provided at the bottom of the respective areas. The atmospheres in the respective areas are maintained in a clean condition by supplying the inert gas not containing impurities such as oxygen and fine particles from the respective gas supply sections into the respective areas and exhausting the atmospheres in the respective areas from the exhaust pipes.

摘要翻译： 在涂覆和显影处理系统中由分隔板，即盒式磁带站，加工站和界面部分划分的各个区域之上，提供用于向各个区域供应惰性气体的气体供应部分。 在各个区域的底部设置用于各区域的排气的排气管。 通过将不含杂质的惰性气体（例如氧气和细颗粒）从各个气体供应区域供应到各个区域中并且从排气管排出各个区域中的气氛，将各个区域中的气氛保持在清洁状态。

公开(公告)号：US07208066B2

公开(公告)日：2007-04-24

申请号：US10649780

申请日：2003-08-28

申请人： Junichi Kitano ,  Yuji Matsuyama ,  Takahiro Kitano ,  Takayuki Katano ,  Hidefumi Matsui ,  Yo Suzuki ,  Masami Yamashita ,  Toru Aoyama ,  Hiroyuki Iwaki ,  Satoru Shimura ,  Masatoshi Deguchi ,  Kousuke Yoshihara ,  Naruaki Iida

发明人： Junichi Kitano ,  Yuji Matsuyama ,  Takahiro Kitano ,  Takayuki Katano ,  Hidefumi Matsui ,  Yo Suzuki ,  Masami Yamashita ,  Toru Aoyama ,  Hiroyuki Iwaki ,  Satoru Shimura ,  Masatoshi Deguchi ,  Kousuke Yoshihara ,  Naruaki Iida

IPC分类号： C23F1/00 ,  H01L21/306 ,  B05C11/00

CPC分类号： H01L21/67178 ,  G03F7/70991 ,  H01L21/67017 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67184 ,  H01L21/67742 ,  H01L21/67778 ,  Y10T29/41

摘要： On top of respective areas divided by partition plates, that is, a cassette station, a processing station, and an interface section in a coating and developing processing system, gas supply sections for supplying an inert gas into the respective areas are provided. Exhaust pipes for exhausting atmospheres in the respective areas are provided at the bottom of the respective areas. The atmospheres in the respective areas are maintained in a clean condition by supplying the inert gas not containing impurities such as oxygen and fine particles from the respective gas supply sections into the respective areas and exhausting the atmospheres in the respective areas from the exhaust pipes.

摘要翻译： 在涂覆和显影处理系统中由分隔板，即盒式磁带站，加工站和界面部分划分的各个区域之上，提供用于向各个区域供应惰性气体的气体供应部分。 在各个区域的底部设置用于各区域的排气的排气管。 通过将不含杂质的惰性气体（例如氧气和细颗粒）从各个气体供应区域供应到各个区域中并且从排气管排出各个区域中的气氛，将各个区域中的气氛保持在清洁状态。

公开(公告)号：US20050130445A1

公开(公告)日：2005-06-16

申请号：US11042199

申请日：2005-01-26

申请人： Hidefumi Matsui ,  Junichi Kitano

发明人： Hidefumi Matsui ,  Junichi Kitano

IPC分类号： G03F7/38 ,  H01L21/00 ,  H01L21/027 ,  H01L21/677 ,  C23C16/00 ,  H01L21/31 ,  H01L21/469 ,  H01L21/84

CPC分类号： H01L21/67178 ,  H01L21/67748 ,  H01L21/67751

摘要： The wafer coated with the resist is deliberately placed in the vapor before being transferred to an aligner that exposes the resist on the wafer, the vapor, for example, the moisture, uniformly adheres onto the resist on the wafer. As a result, the substrate can uniformly be exposed in the following exposing process, and the uniformity of the line width and the like can be improved.

公开(公告)号：US06875466B2

公开(公告)日：2005-04-05

申请号：US10300760

申请日：2002-11-21

申请人： Hidefumi Matsui ,  Junichi Kitano

发明人： Hidefumi Matsui ,  Junichi Kitano

IPC分类号： G03F7/38 ,  H01L21/00 ,  H01L21/027 ,  H01L21/677 ,  B05D3/12

CPC分类号： H01L21/67178 ,  H01L21/67748 ,  H01L21/67751

摘要： The wafer coated with the resist is deliberately placed in the vapor before being transferred to an aligner that exposes the resist on the wafer, the vapor, for example, the moisture, uniformly adheres onto the resist on the wafer. As a result, the substrate can uniformly be exposed in the following exposing process, and the uniformity of the line width and the like can be improved.

摘要翻译： 涂覆有抗蚀剂的晶片被有意地放置在蒸气中，然后被转移到将晶片上的抗蚀剂暴露的对准器，蒸气，例如水分，均匀地粘附在晶片上的抗蚀剂上。 结果，可以在随后的曝光工序中均匀地曝光基板，能够提高线宽等的均匀性。

公开(公告)号：US20070127916A1

公开(公告)日：2007-06-07

申请号：US11673257

申请日：2007-02-09

申请人： Junichi Kitano ,  Yuji Matsuyama ,  Takahiro Kitano ,  Takayuki Katano ,  Hidefumi Matsui ,  Yo Suzuki ,  Masami Yamashita ,  Toru Aoyama ,  Hiroyuki Iwaki ,  Satoru Shimura ,  Masatoshi Deguchi ,  Kousuke Yoshihara ,  Naruaki Iida

发明人： Junichi Kitano ,  Yuji Matsuyama ,  Takahiro Kitano ,  Takayuki Katano ,  Hidefumi Matsui ,  Yo Suzuki ,  Masami Yamashita ,  Toru Aoyama ,  Hiroyuki Iwaki ,  Satoru Shimura ,  Masatoshi Deguchi ,  Kousuke Yoshihara ,  Naruaki Iida

IPC分类号： G03D5/00

CPC分类号： H01L21/67178 ,  G03F7/70991 ,  H01L21/67017 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67184 ,  H01L21/67742 ,  H01L21/67778 ,  Y10T29/41

摘要： On top of respective areas divided by partition plates, that is, a cassette station, a processing station, and an interface section in a coating and developing processing system, gas supply sections for supplying an inert gas into the respective areas are provided. Exhaust pipes for exhausting atmospheres in the respective areas are provided at the bottom of the respective areas. The atmospheres in the respective areas are maintained in a clean condition by supplying the inert gas not containing impurities such as oxygen and fine particles from the respective gas supply sections into the respective areas and exhausting the atmospheres in the respective areas from the exhaust pipes.

摘要翻译： 在涂覆和显影处理系统中由分隔板，即盒式磁带站，加工站和界面部分划分的各个区域之上，提供用于向各个区域供应惰性气体的气体供应部分。 在各个区域的底部设置用于各区域的排气的排气管。 通过将不含杂质的惰性气体（例如氧气和细颗粒）从各个气体供应区域供应到各个区域中并且从排气管排出各个区域中的气氛，将各个区域中的气氛保持在清洁状态。

公开(公告)号：US06485203B2

公开(公告)日：2002-11-26

申请号：US09737473

申请日：2000-12-18

申请人： Takayuki Katano ,  Hidefumi Matsui ,  Junichi Kitano ,  Yo Suzuki ,  Masami Yamashita ,  Toru Aoyama ,  Hiroyuki Iwaki ,  Satoru Shimura

发明人： Takayuki Katano ,  Hidefumi Matsui ,  Junichi Kitano ,  Yo Suzuki ,  Masami Yamashita ,  Toru Aoyama ,  Hiroyuki Iwaki ,  Satoru Shimura

IPC分类号： G03D500

CPC分类号： H01L21/67178 ,  B05C11/08 ,  H01L21/67248 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/67754

摘要： A developing unit, a coating unit and a plurality of cooling plates are arranged in a process station which performs a resist coating and so on and a wafer is transferred among them by a substrate transfer device. The temperature of an area to where the wafer is transferred is detected by a temperature/humidity detector and the temperature of the wafer which is cooled by the cooling plates is adjusted accordingly based on a detected value so that the temperature of the wafer when transferred to the coating unit becomes a coating temperature of a processing solution. Thereby, the wafer is transferred to the coating unit while maintaining its temperature with high accuracy to be coated with a resist solution, so that a formation of an uneven processing due to the temperature change can be prevented and a uniform processing can be performed.

摘要翻译： 显影单元，涂布单元和多个冷却板布置在执行抗蚀剂涂层等的处理站中，并且通过基板传送装置在晶片之间转印晶片。 通过温度/湿度检测器检测晶片转移到的区域的温度，并且基于检测值相应地调节由冷却板冷却的晶片的温度，使得晶片转移到 涂布单元成为处理溶液的涂布温度。 由此，将晶片转印到涂布单元，同时高精度地保持其温度以涂覆抗蚀剂溶液，从而可以防止由温度变化引起的不均匀处理的形成，并且可以进行均匀的处理。

公开(公告)号：US06617095B2

公开(公告)日：2003-09-09

申请号：US09827095

申请日：2001-04-06

申请人： Junichi Kitano ,  Keiko Hada ,  Yuko Ono ,  Takayuki Katano ,  Hidefumi Matsui

发明人： Junichi Kitano ,  Keiko Hada ,  Yuko Ono ,  Takayuki Katano ,  Hidefumi Matsui

IPC分类号： C23C1600

CPC分类号： G03F7/16 ,  Y10T428/2995

摘要： A HMDS gas is supplied to a surface of a wafer W to perform a hydrophobic process, thereafter the wafer W is contained in an airtight container on a cassette stage, and is transferred to an analyzer provided at an external portion of a resist pattern forming apparatus. The analyzer performs mass spectrometry of the quantity of an ionic species such as CH9Si+, C3H9Si+, C3H9Osi− and the like on the surface of the wafer W using an analyzing section, for example, TOF-SIMS, whereby measuring a HMDS quantity (hexamethyldisilazane) on the surface of the wafer W. This method makes it possible to measure the HMDS quantity on the surface of the wafer W and to evaluate a hydrophobic process state with high reliability.

公开(公告)号：US09209506B2

公开(公告)日：2015-12-08

申请号：US13332709

申请日：2011-12-21

申请人： Junichi Kitano ,  Haruo Ikeda ,  Shunsaku Koga

发明人： Junichi Kitano ,  Haruo Ikeda ,  Shunsaku Koga

IPC分类号： H01P7/04 ,  H01P1/205

CPC分类号： H01P1/2053

摘要： A resonant circuit includes a plurality of cables, each of which including: an outer conductor made of a conductive material in a cylindrical manner; an inner conductor, made of a conductive material in an elongated manner, and disposed inside of the outer conductor; and an insulator disposed between the outer conductor and the inner conductor. The plurality of cables is disposed in series in a circular manner. The inner conductor, provided in one of adjacently disposed cables among the plurality of cables, is conductively connected to the outer conductor of another of the adjacently disposed cable.

摘要翻译： 谐振电路包括多个电缆，每个电缆包括：由导电材料制成的外导体，其为圆柱形; 由导电材料制成的内导体，并且设置在外导体的内部; 以及设置在外导体和内导体之间的绝缘体。 多个电缆以圆形方式串联布置。 设置在多个电缆中的相邻布置的电缆之一中的内部导体导电地连接到相邻布置的电缆的另一个的外部导体。

公开(公告)号：US08366872B2

公开(公告)日：2013-02-05

申请号：US13161185

申请日：2011-06-15

申请人： Kenji Tsutsumi ,  Junichi Kitano ,  Osamu Miyahara ,  Hideharu Kyouda

发明人： Kenji Tsutsumi ,  Junichi Kitano ,  Osamu Miyahara ,  Hideharu Kyouda

IPC分类号： C23F1/02

CPC分类号： C23C26/00 ,  G03F1/80 ,  G03F7/707 ,  G03F7/70916 ,  H01L21/308 ,  H01L21/6708 ,  H01L21/6715 ,  H01L21/67178 ,  H01L21/67225 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/68707

摘要： According to the present invention, during the photolithography processing of a substrate, exposure processing is performed immediately after removal of a coating film on the rear surface of the substrate, and a coating film is formed on the rear surface of the substrate immediately after the exposure processing. Thereafter, etching treatment and so on are performed, and a series of these treatment and processing steps are performed a predetermined number of times. The coating film has been formed on the rear surface of the substrate at the time for the etching treatment, so that even if the coating film gets minute scratches, the rear surface of the substrate itself is protected by the coating film and thus never scratched. Further, since the coating film on the rear surface of the substrate is removed immediately before the exposure processing, the rear surface of the substrate can be flat for the exposure processing.

摘要翻译： 根据本发明，在基板的光刻处理中，在除去基板背面的涂膜后立即进行曝光处理，在曝光后立即在基板的背面形成涂膜 处理。 此后，进行蚀刻处理等，并且进行一系列这些处理和处理步骤预定次数。 在蚀刻处理时，已经在基板的背面形成了涂膜，使得即使涂膜受到微小的划痕，基板本身的后表面也被涂膜保护，因此不会被刮伤。 此外，由于在曝光处理之前立即除去基板后表面上的涂膜，所以基板的后表面可以是平坦的，用于曝光处理。

公开(公告)号：US08111372B2

公开(公告)日：2012-02-07

申请号：US12515368

申请日：2007-11-19

申请人： Hideharu Kyouda ,  Junichi Kitano ,  Taro Yamamoto

发明人： Hideharu Kyouda ,  Junichi Kitano ,  Taro Yamamoto

IPC分类号： H01L21/66

CPC分类号： G03F7/70958 ,  G03F7/70341 ,  G03F7/70991 ,  H01L21/6715

摘要： A coating film forming apparatus for immersion light exposure includes one or more coating units configured to apply a resist film or a resist film and an additional film onto a substrate, one or more thermally processing units configured to perform a thermal process, a defect eliciting unit configured to perform a process for eliciting a latent defect of a coating film at an edge portion of the substrate, a checking unit configured to check a state of the coating film after the process by the defect eliciting unit, a control section configured to use a check result obtained by the checking unit to make a judgment of the state of the coating film and permit transfer of the substrate to the light exposure apparatus, and a cleaning unit configured to perform cleaning on the substrate before the process by the defect eliciting unit.

摘要翻译： 用于浸没曝光的涂膜形成装置包括一个或多个涂覆单元，其被配置为将抗蚀剂膜或抗蚀剂膜和附加膜施加到基板上，一个或多个热处理单元，被配置为执行热处理，缺陷引出单元 被配置为执行用于在所述基板的边缘部分处引导涂膜的潜在缺陷的处理，所述检查单元被配置为在所述缺陷引出单元处理之后检查所述涂膜的状态;控制部，被配置为使用 由检查单元获得的检查结果以判断涂膜的状态并允许将基板转移到曝光装置;以及清洁单元，被配置为在由缺陷引出单元进行处理之前在基板上进行清洁。