Conductive paste for screen printing
    1.
    发明授权
    Conductive paste for screen printing 有权
    丝印用导电胶

    公开(公告)号:US09390830B2

    公开(公告)日:2016-07-12

    申请号:US13499022

    申请日:2010-12-21

    摘要: There is provided a conductive paste for screen printing. The conductive paste includes: metal nanoparticles (Y) having a surface coated with a polymer compound having a branched polyalkyleneimine chain and a polymer chain selected from the group consisting of a polyoxyalkylene chain, a polymer chain composed of a polyvinyl alcohol, a polymer chain composed of a water-soluble poly(meth)acrylic acid, a polyacylalkyleneimine chain, and a polymer chain composed of a polyacrylamide; an aliphatic monocarboxylic acid having 6 to 10 carbon atoms and/or succinic anhydride; and an organic solvent (B). A polyalkylene glycol is used as the organic solvent (B).

    摘要翻译: 提供用于丝网印刷的导电膏。 导电性糊料包括:金属纳米粒子(Y),其表面涂布有具有支链聚亚烷基亚胺链的高分子化合物和选自聚氧化烯链的聚合物链,由聚乙烯醇构成的聚合物链, 的水溶性聚(甲基)丙烯酸,聚酰基亚烷基亚胺链和由聚丙烯酰胺构成的聚合物链; 具有6至10个碳原子的脂族单羧酸和/或琥珀酸酐; 和有机溶剂(B)。 使用聚亚烷基二醇作为有机溶剂(B)。

    CONDUCTIVE PASTE FOR SCREEN PRINTING
    2.
    发明申请
    CONDUCTIVE PASTE FOR SCREEN PRINTING 有权
    用于印刷的导电胶

    公开(公告)号:US20130056687A1

    公开(公告)日:2013-03-07

    申请号:US13499022

    申请日:2010-12-21

    IPC分类号: H01B1/22 B82Y30/00

    摘要: Provided is a conductive paste for screen printing, capable of being baked at a low temperature of 150° C. or lower and being printed on a plastic substrate that cannot be subjected to printing at high temperatures. The conductive paste for screen printing contains metal nanoparticles (Y) protected by an organic compound (X) containing a basic nitrogen atom; a deprotecting agent (A) for the metal nanoparticles; and an organic solvent (B), wherein an aliphatic monocarboxylic acid having 6 to 10 carbon atoms and/or an unsubstituted aliphatic dicarboxylic anhydride is used as the deprotecting agent (A) for the metal nanoparticles, and a polyalkylene glycol is used as the organic solvent (B).

    摘要翻译: 提供一种丝网印刷用导电性糊剂,其能够在150℃以下的低温下进行烘烤,并印刷在不能在高温下进行印刷的塑料基材上。 丝网印刷用导电性糊剂含有由含有碱性氮原子的有机化合物(X)保护的金属纳米粒子(Y) 用于金属纳米粒子的脱保护剂(A) 和有机溶剂(B),其中使用碳原子数为6〜10的脂族一元羧酸和/或未取代的脂族二羧酸酐作为金属纳米粒子的脱保护剂(A),使用聚亚烷基二醇作为有机溶剂 溶剂(B)。

    INK COMPOSITION FOR FORMING INSULATING FILM AND INSULATING FILM FORMED FROM THE INK COMPOSITION
    3.
    发明申请
    INK COMPOSITION FOR FORMING INSULATING FILM AND INSULATING FILM FORMED FROM THE INK COMPOSITION 有权
    用于形成绝缘膜的油墨组合物和从墨水组合物形成的绝缘膜

    公开(公告)号:US20110086946A1

    公开(公告)日:2011-04-14

    申请号:US12737145

    申请日:2009-06-03

    IPC分类号: C09D11/10

    摘要: An insulating ink composition for forming an insulating film, which sufficiently achieves a low calcination temperature, solvent resistance and an insulating property, is provided. Furthermore, an ink composition for forming an insulating film which can form, by the printing method, fine insulating film patterns necessary for formation of highly integrated organic transistors is provided. The present invention provides an ink composition which forms an insulating film, and includes an organic solvent, a polyvinylphenol-based resin, an epoxy resin and a cross-linking aid. Particularly, the ink composition is a composition wherein the organic solvent includes an organic solvent which has a vapor pressure of 11.3×102 Pa or higher at 20° C. and a boiling point of lower than 115° C. under atmospheric pressure and an organic solvent which has a vapor pressure of less than 11.3×102 Pa at 20° C. and a boiling point of 115° C. or higher under atmospheric pressure; the ink composition includes a extender component having a volume average particle diameter of 1 to 150 nm and a silicone-based releasing component.

    摘要翻译: 提供一种用于形成绝缘膜的绝缘油墨组合物,其充分地实现了低煅烧温度,耐溶剂性和绝缘性。 此外,提供一种用于形成绝缘膜的油墨组合物,其可以通过印刷方法形成形成高度集成的有机晶体管所需的精细绝缘膜图案。 本发明提供一种形成绝缘膜的油墨组合物,其包括有机溶剂,聚乙烯基苯酚类树脂,环氧树脂和交联助剂。 特别地,油墨组合物是其中有机溶剂包括在大气压下在20℃和沸点低于115℃的蒸气压为11.3×10 2 Pa或更高的有机溶剂和有机溶剂的组合物 在大气压下在20℃下蒸气压小于11.3×102Pa,沸点为115℃以上的溶剂; 油墨组合物包括体积平均粒径为1〜150nm的增量剂成分和硅酮类脱模成分。

    Conductive paste for screen printing
    4.
    发明授权
    Conductive paste for screen printing 有权
    丝印用导电胶

    公开(公告)号:US09039941B2

    公开(公告)日:2015-05-26

    申请号:US13499122

    申请日:2010-12-21

    摘要: There is provided a conductive paste for screen printing. The conductive paste includes: metal nanoparticles (Y) having an average particle diameter of 1 to 50 nm and protected with a polymer compound having a branched polyalkyleneimine chain and a polymer chain selected from the group consisting of a polyoxyalkylene chain, a polymer chain composed of a polyvinyl alcohol, a polymer chain composed of a water-soluble poly(meth)acrylic acid, a polyacylalkyleneimine chain having a hydrophilic substituent, and a polymer chain composed of a polyacrylamide; metal particles (Z) having an average particle diameter of 200 to 600 nm; a deprotecting agent (A) for the metal nanoparticles; and an organic solvent (B). An aliphatic monocarboxylic acid having 6 to 10 carbon atoms is used as the deprotecting agent (A) for the metal nanoparticles. A polyalkylene glycol is used as the organic solvent (B).

    摘要翻译: 提供用于丝网印刷的导电膏。 导电性糊剂包括:平均粒径为1〜50nm的金属纳米粒子(Y),用具有支链聚亚烷基亚胺链的聚合物化合物和选自聚氧亚烷基链的聚合物链,由 聚乙烯醇,由水溶性聚(甲基)丙烯酸组成的聚合物链,具有亲水性取代基的多酰基亚烷基亚胺链和由聚丙烯酰胺组成的聚合物链; 平均粒径为200〜600nm的金属粒子(Z) 用于金属纳米粒子的脱保护剂(A) 和有机溶剂(B)。 作为金属纳米粒子的脱保护剂(A),使用碳原子数为6〜10的脂肪族一元羧酸。 使用聚亚烷基二醇作为有机溶剂(B)。

    CONDUCTIVE PASTE FOR SCREEN PRINTING
    5.
    发明申请
    CONDUCTIVE PASTE FOR SCREEN PRINTING 有权
    用于印刷的导电胶

    公开(公告)号:US20130048920A1

    公开(公告)日:2013-02-28

    申请号:US13499122

    申请日:2010-12-21

    IPC分类号: H01B1/22 B82Y30/00

    摘要: A conductive paste for screen printing that can be fired at a low temperature of 150° C. or less and enables printing on a plastic substrate, printing on which is impossible at high temperature, is provided. A conductive paste for screen printing includes metal nanoparticles (Y) having an average particle diameter of 1 to 50 nm and protected with an organic compound (X) containing a basic nitrogen atom, metal particles (Z) having an average particle diameter of more than 100 nm and 5 μm, a deprotecting agent (A) for the metal nanoparticles, and an organic solvent (B). An aliphatic monocarboxylic acid having 6 to 10 carbon atoms is used as the deprotecting agent (A) for the metal nanoparticles and a polyalkylene glycol is used as the organic solvent (B).

    摘要翻译: 一种用于丝网印刷的导电糊剂,其可以在150℃或更低的低温下烧制,并且能够在塑料基材上进行印刷,并且可以在高温下进行印刷。 用于丝网印刷的导电性糊剂包括平均粒径为1〜50nm的金属纳米粒子(Y),被含有碱性氮原子的有机化合物(X)保护,金属粒子(Z)的平均粒径大于 100nm和5μm的金属纳米颗粒的脱保护剂(A)和有机溶剂(B)。 使用碳原子数6〜10的脂肪族一元羧酸作为金属纳米粒子的脱保护剂(A),使用聚亚烷基二醇作为有机溶剂(B)。

    Ink composition for forming insulating film and insulating film formed from the ink composition
    6.
    发明授权
    Ink composition for forming insulating film and insulating film formed from the ink composition 有权
    用于形成绝缘膜的油墨组合物和由该油墨组合物形成的绝缘膜

    公开(公告)号:US08791173B2

    公开(公告)日:2014-07-29

    申请号:US12737145

    申请日:2009-06-03

    IPC分类号: C09D11/10

    摘要: An insulating ink composition for forming an insulating film, which sufficiently achieves a low calcination temperature, solvent resistance and an insulating property, is provided. Furthermore, an ink composition for forming an insulating film which can form, by the printing method, fine insulating film patterns necessary for formation of highly integrated organic transistors is provided. The present invention provides an ink composition which forms an insulating film, and includes an organic solvent, a polyvinylphenol-based resin, an epoxy resin and a cross-linking aid. Particularly, the ink composition is a composition wherein the organic solvent includes an organic solvent which has a vapor pressure of 11.3×102 Pa or higher at 20° C. and a boiling point of lower than 115° C. under atmospheric pressure and an organic solvent which has a vapor pressure of less than 11.3×102 Pa at 20° C. and a boiling point of 115° C. or higher under atmospheric pressure; the ink composition includes a extender component having a volume average particle diameter of 1 to 150 nm and a silicone-based releasing component.

    摘要翻译: 提供一种用于形成绝缘膜的绝缘油墨组合物,其充分地实现了低煅烧温度,耐溶剂性和绝缘性。 此外,提供一种用于形成绝缘膜的油墨组合物,其可以通过印刷方法形成形成高度集成的有机晶体管所需的精细绝缘膜图案。 本发明提供一种形成绝缘膜的油墨组合物,其包括有机溶剂,聚乙烯基苯酚类树脂,环氧树脂和交联助剂。 特别地,油墨组合物是其中有机溶剂包括在大气压下在20℃和沸点低于115℃的蒸汽压为11.3×10 2 Pa或更高的有机溶剂的组合物和有机溶剂 在大气压下在20℃下蒸气压小于11.3×102Pa,沸点为115℃以上的溶剂; 油墨组合物包括体积平均粒径为1〜150nm的增量剂成分和硅酮类脱模成分。

    INK COMPOSITION FOR FORMING LIGHT SHIELDING FILM OF ORGANIC SEMICONDUCTOR DEVICE, METHOD FOR FORMING LIGHT SHIELDING FILM, AND ORGANIC TRANSISTOR DEVICE HAVING LIGHT SHIELDING FILM
    10.
    发明申请
    INK COMPOSITION FOR FORMING LIGHT SHIELDING FILM OF ORGANIC SEMICONDUCTOR DEVICE, METHOD FOR FORMING LIGHT SHIELDING FILM, AND ORGANIC TRANSISTOR DEVICE HAVING LIGHT SHIELDING FILM 有权
    用于形成有机半导体器件的轻型屏蔽膜的墨水组合物,用于形成光泽薄膜的方法,以及具有光泽薄膜的有机晶体管器件

    公开(公告)号:US20120032309A1

    公开(公告)日:2012-02-09

    申请号:US13000918

    申请日:2010-04-26

    摘要: There is provided an ink composition for forming a light shielding film in an organic semiconductor device which is capable of stably forming a fine pattern when forming a finely patterned light shielding film by the letterpress reverse printing method or microcontact printing method, which can be baked at a temperature equal to or less than the substrate heatproof temperature, and which is also capable of providing light shielding property and mechanical strength, the ink composition for forming a light shielding film in an organic semiconductor device which is an ink composition for forming a light shielding film in an organic semiconductor device comprising a black pigment; a resin component; a surface energy modifier; a quick-drying organic solvent; a slow-drying organic solvent; and a mold releasing agent, wherein the resin component comprises a solid resin that is in a solid state at 200° C. or less and a liquid resin that is in a liquid state at 10 to 50° C. at a ratio (solid resin/liquid resin) of 0.2 to 0.6.

    摘要翻译: 提供了一种用于在有机半导体器件中形成遮光膜的油墨组合物,其能够通过凸版反转印刷法或微接触印刷法形成精细图案化的遮光膜时能够稳定地形成精细图案,其可以在 温度等于或低于基板耐热温度,并且还能够提供遮光性和机械强度。在作为用于形成遮光性的油墨组合物的有机半导体装置中形成遮光膜的油墨组合物 包含黑色颜料的有机半导体器件中的膜; 树脂成分; 表面能改性剂 快干有机溶剂; 一种缓慢干燥的有机溶剂; 和脱模剂,其中所述树脂组分包括在200℃以下为固态的固体树脂和在10〜50℃下呈液态的液体树脂(固体树脂 /液体树脂)为0.2〜0.6。