公开(公告)号：US06429372B1

公开(公告)日：2002-08-06

申请号：US09256220

申请日：1999-02-24

申请人： Hideo Taguchi ,  Junichi Asada ,  Jun Omori ,  Toshikazu Mino ,  Naohisa Okumura ,  Hiroshi Shimoe ,  Toshitsune Iijima ,  Katsuhiko Oyama

发明人： Hideo Taguchi ,  Junichi Asada ,  Jun Omori ,  Toshikazu Mino ,  Naohisa Okumura ,  Hiroshi Shimoe ,  Toshitsune Iijima ,  Katsuhiko Oyama

IPC分类号： H01L2328

CPC分类号： H01L24/85 ,  H01L23/3121 ,  H01L23/4985 ,  H01L23/49894 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/78301 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/20753 ,  H01L2924/351 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/85399 ,  H01L2224/05599

摘要： An IC chip and overhang portions are stuck to tape by an adhesive agent layer having elasticity. A plurality of solder balls are attached to the tape. By soldering the solder balls to a printed board, a semiconductor device is mounted. In the case where a temperature cycle has been caused, thermal stress occurs between the IC chip and the printed board or between the hangover portion and the printed board because of a difference in coefficient of thermal expansion between the IC chip or the hangover portion and the printed board. However, this thermal stress is absorbed by the elasticity of the adhesive agent layer. As a result, little thermal stress is applied to solder balls. Even if the above described temperature cycle is repeated, therefore, the solder balls are electrically connected to the printed board stably over a long period of time. In addition, the area of the tape is widened by the area of the hangover portions. Accordingly, a larger number of solder balls can be attached to the tape without reducing the size of each of the solder balls.

摘要翻译： 通过具有弹性的粘合剂层将IC芯片和突出部分粘附到带上。 多个焊球附着在带子上。 通过将焊球焊接到印刷电路板上，安装半导体器件。 在发生了温度循环的情况下，由于IC芯片或者宿醉部分之间的热膨胀系数不同，IC芯片和印刷电路板之间或者宿醉部分和印刷电路板之间产生热应力 印刷板 然而，这种热应力被粘合剂层的弹性所吸收。 结果，焊球几乎没有热应力。 因此，即使重复上述的温度循环，焊料球长期稳定地电连接到印刷电路板上。 此外，带的面积由宿醉部分的面积加宽。 因此，可以在不减小每个焊球的尺寸的情况下将更多数量的焊球附着到带上。

公开(公告)号：US06734541B2

公开(公告)日：2004-05-11

申请号：US10173004

申请日：2002-06-18

申请人： Hiroshi Shimoe ,  Naohisa Okumura ,  Takashi Imoto ,  Ryuji Hosokawa

发明人： Hiroshi Shimoe ,  Naohisa Okumura ,  Takashi Imoto ,  Ryuji Hosokawa

IPC分类号： H01L2302

CPC分类号： H01L25/0657 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2224/0401

摘要： A semiconductor laminated module comprises a plurality of unit packages in which semiconductor chips are bonded to base substrates with a first adhesive, a second adhesive to form a laminated body by bonding the plurality of unit packages to each other, a third adhesive formed to cover an upper surface of the semiconductor chips and having substantially the same thermal expansion coefficient as that of the first adhesive, and an uppermost substrate bonded to uppermost one of the unit packages with the second adhesive.

摘要翻译： 半导体层叠模块包括多个单元封装，其中半导体芯片利用第一粘合剂结合到基底基板上，第二粘合剂通过将多个单元封装彼此粘合而形成层压体;第三粘合剂，其形成为覆盖 半导体芯片的上表面，并且具有与第一粘合剂基本相同的热膨胀系数，以及用第二粘合剂粘合到最上一个单元封装的最上面的基板。