公开(公告)号：US20060011711A1

公开(公告)日：2006-01-19

申请号：US11179545

申请日：2005-07-13

申请人： Toshikazu Mino

发明人： Toshikazu Mino

IPC分类号： B23K31/02

CPC分类号： H05K3/3436 ,  B23K1/012 ,  B23K2101/40 ,  H01L24/81 ,  H01L2224/11822 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/81011 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014 ,  H05K3/3489 ,  H05K3/3494 ,  H05K2201/0379 ,  H05K2201/10977 ,  H05K2203/0195 ,  H05K2203/0278 ,  H05K2203/0485 ,  Y02P70/613 ,  H01L2224/0401

摘要： According to an aspect of the invention, there is provided a method of fabricating a semiconductor device including, heating a semiconductor component including a first solder bump, pressing the first solder bump onto a stage having asperity, coating a flux on the first solder bump, heating a substrate including a second solder bump, pressing the second solder bump onto the stage having asperity, coating the flux on the second solder bump, contacting the first solder bump on the second solder bump by disposing the semiconductor component on the substrate, and coupling the first solder bump and the second solder bump by heating the semiconductor component and the substrate.

摘要翻译： 根据本发明的一个方面，提供了一种制造半导体器件的方法，包括：加热包括第一焊料凸块的半导体部件，将第一焊料凸块按压到具有粗糙度的平台上，在第一焊料凸块上涂覆焊剂， 加热包括第二焊料凸块的基板，将第二焊料凸块按压到具有粗糙度的平台上，将焊剂涂覆在第二焊料凸块上，通过将半导体部件设置在基板上而与第二焊料凸块上的第一焊料凸块接触， 通过加热半导体部件和基板而形成第一焊料凸块和第二焊料凸块。

公开(公告)号：US06429372B1

公开(公告)日：2002-08-06

申请号：US09256220

申请日：1999-02-24

申请人： Hideo Taguchi ,  Junichi Asada ,  Jun Omori ,  Toshikazu Mino ,  Naohisa Okumura ,  Hiroshi Shimoe ,  Toshitsune Iijima ,  Katsuhiko Oyama

发明人： Hideo Taguchi ,  Junichi Asada ,  Jun Omori ,  Toshikazu Mino ,  Naohisa Okumura ,  Hiroshi Shimoe ,  Toshitsune Iijima ,  Katsuhiko Oyama

IPC分类号： H01L2328

CPC分类号： H01L24/85 ,  H01L23/3121 ,  H01L23/4985 ,  H01L23/49894 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/78301 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/20753 ,  H01L2924/351 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/85399 ,  H01L2224/05599

摘要： An IC chip and overhang portions are stuck to tape by an adhesive agent layer having elasticity. A plurality of solder balls are attached to the tape. By soldering the solder balls to a printed board, a semiconductor device is mounted. In the case where a temperature cycle has been caused, thermal stress occurs between the IC chip and the printed board or between the hangover portion and the printed board because of a difference in coefficient of thermal expansion between the IC chip or the hangover portion and the printed board. However, this thermal stress is absorbed by the elasticity of the adhesive agent layer. As a result, little thermal stress is applied to solder balls. Even if the above described temperature cycle is repeated, therefore, the solder balls are electrically connected to the printed board stably over a long period of time. In addition, the area of the tape is widened by the area of the hangover portions. Accordingly, a larger number of solder balls can be attached to the tape without reducing the size of each of the solder balls.

摘要翻译： 通过具有弹性的粘合剂层将IC芯片和突出部分粘附到带上。 多个焊球附着在带子上。 通过将焊球焊接到印刷电路板上，安装半导体器件。 在发生了温度循环的情况下，由于IC芯片或者宿醉部分之间的热膨胀系数不同，IC芯片和印刷电路板之间或者宿醉部分和印刷电路板之间产生热应力 印刷板 然而，这种热应力被粘合剂层的弹性所吸收。 结果，焊球几乎没有热应力。 因此，即使重复上述的温度循环，焊料球长期稳定地电连接到印刷电路板上。 此外，带的面积由宿醉部分的面积加宽。 因此，可以在不减小每个焊球的尺寸的情况下将更多数量的焊球附着到带上。