公开(公告)号：US06734541B2

公开(公告)日：2004-05-11

申请号：US10173004

申请日：2002-06-18

申请人： Hiroshi Shimoe ,  Naohisa Okumura ,  Takashi Imoto ,  Ryuji Hosokawa

发明人： Hiroshi Shimoe ,  Naohisa Okumura ,  Takashi Imoto ,  Ryuji Hosokawa

IPC分类号： H01L2302

CPC分类号： H01L25/0657 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2224/0401

摘要： A semiconductor laminated module comprises a plurality of unit packages in which semiconductor chips are bonded to base substrates with a first adhesive, a second adhesive to form a laminated body by bonding the plurality of unit packages to each other, a third adhesive formed to cover an upper surface of the semiconductor chips and having substantially the same thermal expansion coefficient as that of the first adhesive, and an uppermost substrate bonded to uppermost one of the unit packages with the second adhesive.

摘要翻译： 半导体层叠模块包括多个单元封装，其中半导体芯片利用第一粘合剂结合到基底基板上，第二粘合剂通过将多个单元封装彼此粘合而形成层压体;第三粘合剂，其形成为覆盖 半导体芯片的上表面，并且具有与第一粘合剂基本相同的热膨胀系数，以及用第二粘合剂粘合到最上一个单元封装的最上面的基板。

公开(公告)号：US20060055061A1

公开(公告)日：2006-03-16

申请号：US11216144

申请日：2005-09-01

申请人： Ryuji Hosokawa ,  Takashi Imoto

发明人： Ryuji Hosokawa ,  Takashi Imoto

IPC分类号： H01L23/48

CPC分类号： H01L24/06 ,  H01L21/565 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/50 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/4824 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/92147 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01067 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a substrate having first and second surfaces, the substrate having an opening; a first adhesive layer provided on the first surface; a second adhesive layer provided under the second surface; a third adhesive layer provided around the opening; a semiconductor chip arranging a plurality of chip bonding pads in a central portion of the semiconductor chip and adhered on the third adhesive layer; substrate bonding pads adhered under the second adhesive layer; bonding wires connecting the chip bonding pads to the substrate bonding pads; and an encapsulating resin provided around the semiconductor chip.

摘要翻译： 半导体器件包括具有第一和第二表面的衬底，衬底具有开口; 设置在第一表面上的第一粘合剂层; 设置在所述第二表面下方的第二粘合剂层; 围绕所述开口设置的第三粘合剂层; 半导体芯片，其在所述半导体芯片的中心部分布置多个芯片焊盘并粘附在所述第三粘合剂层上; 衬底粘合垫粘附在第二粘合剂层下面; 将芯片接合焊盘连接到衬底接合焊盘的接合线; 以及设置在半导体芯片周围的封装树脂。

公开(公告)号：US07608911B2

公开(公告)日：2009-10-27

申请号：US12213766

申请日：2008-06-24

申请人： Takashi Imoto ,  Chiaki Takubo ,  Ryuji Hosokawa ,  Yoshihisa Imori ,  Takao Sato ,  Tetsuya Kurosawa ,  Mika Kiritani

发明人： Takashi Imoto ,  Chiaki Takubo ,  Ryuji Hosokawa ,  Yoshihisa Imori ,  Takao Sato ,  Tetsuya Kurosawa ,  Mika Kiritani

IPC分类号： H01L29/06

CPC分类号： H01L23/3142 ,  H01L23/3121 ,  H01L23/3178 ,  H01L23/5222 ,  H01L23/5329 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10155 ,  H01L2924/10157 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device is disclosed, which comprises a semiconductor element in which a laminated film composed of a plurality of layers including an insulating film is formed on a surface of a semiconductor substrate, and a portion of the laminated film is removed from the surface of the semiconductor substrate so that the semiconductor substrate is exposed at the portion, a mounting substrate on which the semiconductor element is mounted, and a resin layer which seals at least a surface side of the semiconductor element with resin.

摘要翻译： 公开了一种半导体器件，其包括半导体元件，其中在半导体衬底的表面上形成由包括绝缘膜的多个层组成的层叠膜，并且将层压膜的一部分从 半导体衬底，使得半导体衬底在该部分处露出，其上安装有半导体元件的安装衬底和用树脂密封半导体元件的至少表面侧的树脂层。

公开(公告)号：US20070196956A1

公开(公告)日：2007-08-23

申请号：US11712373

申请日：2007-03-01

申请人： Takashi Imoto ,  Chiaki Takubo ,  Ryuji Hosokawa ,  Yoshihisa Imori ,  Takao Sato ,  Tetsuya Kurosawa ,  Mika Kiritani

发明人： Takashi Imoto ,  Chiaki Takubo ,  Ryuji Hosokawa ,  Yoshihisa Imori ,  Takao Sato ,  Tetsuya Kurosawa ,  Mika Kiritani

IPC分类号： H01L21/00 ,  H01L21/302

CPC分类号： H01L23/3142 ,  H01L23/3121 ,  H01L23/3178 ,  H01L23/5222 ,  H01L23/5329 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10155 ,  H01L2924/10157 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device is disclosed, which comprises a semiconductor element in which a laminated film composed of a plurality of layers including an insulating film is formed on a surface of a semiconductor substrate, and a portion of the laminated film is removed from the surface of the semiconductor substrate so that the semiconductor substrate is exposed at the portion, a mounting substrate on which the semiconductor element is mounted, and a resin layer which seals at least a surface side of the semiconductor element with resin.

摘要翻译： 公开了一种半导体器件，其包括半导体元件，其中在半导体衬底的表面上形成由包括绝缘膜的多个层组成的层叠膜，并且将层压膜的一部分从 半导体衬底，使得半导体衬底在该部分处露出，其上安装有半导体元件的安装衬底和用树脂密封半导体元件的至少表面侧的树脂层。

公开(公告)号：US07202563B2

公开(公告)日：2007-04-10

申请号：US11088879

申请日：2005-03-25

申请人： Takashi Imoto ,  Chiaki Takubo ,  Ryuji Hosokawa ,  Yoshihisa Imori ,  Takao Sato ,  Tetsuya Kurosawa ,  Mika Kiritani

发明人： Takashi Imoto ,  Chiaki Takubo ,  Ryuji Hosokawa ,  Yoshihisa Imori ,  Takao Sato ,  Tetsuya Kurosawa ,  Mika Kiritani

IPC分类号： H01L23/34 ,  H01L23/31

CPC分类号： H01L23/3142 ,  H01L23/3121 ,  H01L23/3178 ,  H01L23/5222 ,  H01L23/5329 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10155 ,  H01L2924/10157 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device is disclosed, which comprises a semiconductor element in which a laminated film composed of a plurality of layers including an insulating film is formed on a surface of a semiconductor substrate, and a portion of the laminated film is removed from the surface of the semiconductor substrate so that the semiconductor substrate is exposed at the portion, a mounting substrate on which the semiconductor element is mounted, and a resin layer which seals at least a surface side of the semiconductor element with resin.

摘要翻译： 公开了一种半导体器件，其包括半导体元件，其中在半导体衬底的表面上形成由包括绝缘膜的多个层组成的层叠膜，并且将层压膜的一部分从 半导体衬底，使得半导体衬底在该部分处露出，其上安装有半导体元件的安装衬底和用树脂密封半导体元件的至少表面侧的树脂层。

公开(公告)号：US20080265443A1

公开(公告)日：2008-10-30

申请号：US12213766

申请日：2008-06-24

申请人： Takashi Imoto ,  Chiaki Takubo ,  Ryuji Hosokawa ,  Yoshihisa Imori ,  Takao Sato ,  Tetsuya Kurosawa ,  Mika Kiritani

发明人： Takashi Imoto ,  Chiaki Takubo ,  Ryuji Hosokawa ,  Yoshihisa Imori ,  Takao Sato ,  Tetsuya Kurosawa ,  Mika Kiritani

IPC分类号： H01L23/28

CPC分类号： H01L23/3142 ,  H01L23/3121 ,  H01L23/3178 ,  H01L23/5222 ,  H01L23/5329 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10155 ,  H01L2924/10157 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device is disclosed, which comprises a semiconductor element in which a laminated film composed of a plurality of layers including an insulating film is formed on a surface of a semiconductor substrate, and a portion of the laminated film is removed from the surface of the semiconductor substrate so that the semiconductor substrate is exposed at the portion, a mounting substrate on which the semiconductor element is mounted, and a resin layer which seals at least a surface side of the semiconductor element with resin.

摘要翻译： 公开了一种半导体器件，其包括半导体元件，其中在半导体衬底的表面上形成由包括绝缘膜的多个层组成的层叠膜，并且将层压膜的一部分从 半导体衬底，使得半导体衬底在该部分处露出，其上安装有半导体元件的安装衬底和用树脂密封半导体元件的至少表面侧的树脂层。

公开(公告)号：US07405159B2

公开(公告)日：2008-07-29

申请号：US11712373

申请日：2007-03-01

申请人： Takashi Imoto ,  Chiaki Takubo ,  Ryuji Hosokawa ,  Yoshihisa Imori ,  Takao Sato ,  Tetsuya Kurosawa ,  Mika Kiritani

发明人： Takashi Imoto ,  Chiaki Takubo ,  Ryuji Hosokawa ,  Yoshihisa Imori ,  Takao Sato ,  Tetsuya Kurosawa ,  Mika Kiritani

IPC分类号： H01L21/302

CPC分类号： H01L23/3142 ,  H01L23/3121 ,  H01L23/3178 ,  H01L23/5222 ,  H01L23/5329 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10155 ,  H01L2924/10157 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device is disclosed, which comprises a semiconductor element in which a laminated film composed of a plurality of layers including an insulating film is formed on a surface of a semiconductor substrate, and a portion of the laminated film is removed from the surface of the semiconductor substrate so that the semiconductor substrate is exposed at the portion, a mounting substrate on which the semiconductor element is mounted, and a resin layer which seals at least a surface side of the semiconductor element with resin.

摘要翻译： 公开了一种半导体器件，其包括半导体元件，其中在半导体衬底的表面上形成由包括绝缘膜的多个层组成的层叠膜，并且将层压膜的一部分从 半导体衬底，使得半导体衬底在该部分处露出，其上安装有半导体元件的安装衬底和用树脂密封半导体元件的至少表面侧的树脂层。

公开(公告)号：US07298035B2

公开(公告)日：2007-11-20

申请号：US11216144

申请日：2005-09-01

申请人： Ryuji Hosokawa ,  Takashi Imoto

发明人： Ryuji Hosokawa ,  Takashi Imoto

IPC分类号： H01L21/58

CPC分类号： H01L24/06 ,  H01L21/565 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/50 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/4824 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/92147 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01067 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a substrate having first and second surfaces, the substrate having an opening; a first adhesive layer provided on the first surface; a second adhesive layer provided under the second surface; a third adhesive layer provided around the opening; a semiconductor chip arranging a plurality of chip bonding pads in a central portion of the semiconductor chip and adhered on the third adhesive layer; substrate bonding pads adhered under the second adhesive layer; bonding wires connecting the chip bonding pads to the substrate bonding pads; and an encapsulating resin provided around the semiconductor chip.

摘要翻译： 半导体器件包括具有第一和第二表面的衬底，衬底具有开口; 设置在第一表面上的第一粘合剂层; 设置在所述第二表面下方的第二粘合剂层; 围绕所述开口设置的第三粘合剂层; 半导体芯片，其在所述半导体芯片的中心部分布置多个芯片焊盘并粘附在所述第三粘合剂层上; 衬底粘合垫粘附在第二粘合剂层下面; 将芯片接合焊盘连接到衬底接合焊盘的接合线; 以及设置在半导体芯片周围的封装树脂。

公开(公告)号：US20050212145A1

公开(公告)日：2005-09-29

申请号：US11088879

申请日：2005-03-25

申请人： Takashi Imoto ,  Chiaki Takubo ,  Ryuji Hosokawa ,  Yoshihisa Imori ,  Takao Sato ,  Tetsuya Kurosawa ,  Mika Kiritani

发明人： Takashi Imoto ,  Chiaki Takubo ,  Ryuji Hosokawa ,  Yoshihisa Imori ,  Takao Sato ,  Tetsuya Kurosawa ,  Mika Kiritani

IPC分类号： H01L21/00 ,  H01L21/48 ,  H01L23/31 ,  H01L23/48 ,  H01L23/522 ,  H01L23/532

CPC分类号： H01L23/3142 ,  H01L23/3121 ,  H01L23/3178 ,  H01L23/5222 ,  H01L23/5329 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10155 ,  H01L2924/10157 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device is disclosed, which comprises a semiconductor element in which a laminated film composed of a plurality of layers including an insulating film is formed on a surface of a semiconductor substrate, and a portion of the laminated film is removed from the surface of the semiconductor substrate so that the semiconductor substrate is exposed at the portion, a mounting substrate on which the semiconductor element is mounted, and a resin layer which seals at least a surface side of the semiconductor element with resin.

摘要翻译： 公开了一种半导体器件，其包括半导体元件，其中在半导体衬底的表面上形成由包括绝缘膜的多个层组成的层叠膜，并且将层压膜的一部分从 半导体衬底，使得半导体衬底在该部分处露出，其上安装半导体元件的安装衬底以及用树脂密封半导体元件的至少表面侧的树脂层。

公开(公告)号：US5614441A

公开(公告)日：1997-03-25

申请号：US434995

申请日：1995-05-04

申请人： Ryuji Hosokawa ,  Satoru Yanagida

发明人： Ryuji Hosokawa ,  Satoru Yanagida

IPC分类号： H01L23/50 ,  H01L23/495 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H01L21/48 ,  H01L21/56 ,  H01L21/58 ,  H01L21/70

CPC分类号： H01L23/49575 ,  H01L23/49537 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  Y10T29/49121

摘要： A method of manufacturing a semiconductor device wherein, a first lead frame portion has a bed portion for mounting a semiconductor element and a plurality of inner and outer leads. A second lead frame portion has a bed portion for mounting a semiconductor element and a plurality of inner and outer leads as in the first lead frame portion coupled to the second lead frame portion through a coupling portion. The first and second lead frame portions are folded at the coupling portion and superposed such that the two semiconductor elements oppose each other. At this time, the plurality of inner and outer leads of the first and second lead frames are alternately and adjacently arranged. Each electrode of the semiconductor elements is connected to a corresponding inner lead. The superposed first and second lead frames are sealed with a mold resin while leaving end portions of the plurality of outer leads of the first and second lead frames.

摘要翻译： 一种制造半导体器件的方法，其中，第一引线框架部分具有用于安装半导体元件的床部分和多个内部和外部引线。 第二引线框架部分具有用于安装半导体元件的床部分和通过联接部分联接到第二引线框架部分的第一引线框架部分中的多个内引线和外引线。 第一引线框架部分和第二引线框架部分在耦合部分处被折叠并且叠合成使得两个半导体元件彼此相对。 此时，第一引线框架和第二引线框架的多个内引线和外引线交替地并相邻布置。 半导体元件的每个电极连接到相应的内引线。 重叠的第一和第二引线框架用模具树脂密封，同时留下第一和第二引线框架的多个外引线的端部。