摘要:
By grinding the grinding surface of a diamond grinding tool which is formed in a predetermined shape by securing diamond abrasive grains by bond circularly or flat with high accuracy by the processing type truing method, uniformly dressing the above bond surface so as to project diamond abrasive grains, lapping the tips of the diamond abrasive grains projected from the above bond by the lapping type truing method so as to make the cutting edge height constant, the run,out of the grinding surface can be controlled to the order of submicrons and the cutting edges which are tips of the diamond abrasive grains can be aligned precisely.
摘要:
A thin-film includes an inductive element and a first and second magneto-resistive effect elements in which the first and second magneto-resistive effect elements are arranged in proximity to each other on a substrate, and one surface of the substrate perpendicular to the surface formed with the first and second magneto-resistive effect elements constitutes a slider surface, thereby providing appropriate height of the magneto-resistive effect elements.
摘要:
A method of measuring variation in dimensions and alignment error of thin film magnetic heads formed on a raw bar cut-off from a substrate is provided. Such method comprises illuminating a MR element and a resistance detector element which is formed for monitoring a lapping process, both of which are formed on the raw bar, with illuminating light whose wavelength is 300 nm or less; forming an image by imaging light reflected from the elements; and converting the image to an image signal through photoelectric conversion so as to detect variation in dimensions of the MR element and the resistance detector element formed on the raw bar, and alignment error between the MR element and the resistance detector element with a high degree of accuracy.
摘要:
A thin-film includes an inductive element and a first and second magneto-resistive effect elements in which the first and second magneto-resistive effect elements are arranged in proximity to each other on a substrate, and one surface of the substrate perpendicular to the surface formed with the first and second magneto-resistive effect elements constitutes a slider surface, thereby providing appropriate hight of the magneto-resistive effect elements.
摘要:
A thin-film includes an inductive element and a first and second magneto-resistive effect elements in which the first and second magneto-resistive effect elements are arranged in proximity to each other on a substrate, and one surface of the substrate perpendicular to the surface formed with the first and second magneto-resistive effect elements constitutes a slider surface, thereby providing appropriate hight of the magneto-resistive effect elements.
摘要:
Embodiments of the invention provide a head gimbal assembly (HGA) provided with a solder ball connecting structure suitable for the re-utilization of a suspension assembly. In one embodiment, the HGA includes lead wires provided at front ends thereof with lead pads and also includes slider pads capable of being connected to the lead pads by solder ball bonding with the use of solder balls. Respective grooves formed in the surfaces of the slider pads inhibit the solder balls from rotating and moving over the surfaces of the slider pads and the lead pads before the radiation of a laser beam.
摘要:
A thin film magnetic head includes a three-step configuration including deep and shallow groove surfaces, a super shallow groove surface, and an air bearing surface, and also, island-shaped center rail is provided in the center of the air outflow end of the disk-facing air bearing surface having a boundary on the surface of base alumina between a head element portion and a substrate, without including the surface of the substrate. Further, by providing in the surface of the substrate the super shallow groove surface shallower than a shallow groove surface, an alumina recession between the surface of the substrate and the head element portion, produced in a shallow dual step sub ambient slider, can be eliminated. Magnetic spacing between the head of the head element portion and the magnetic layer of the disk can be thereby reduced.
摘要:
Head elements are formed on a wafer to suppress deterioration in pinning strength of a pinned layer, which is caused by ESD generated during air bearing surface polishing of a thin film magnetic head. The wafer is cut into rovers in each of which are connected head elements. Rover air bearing surfaces are polished until an MR elements attain a predetermined height. A final polishing step finishes air bearing surfaces by applying an electroconductive polishing liquid to achieve a predetermined shape and surface roughness with high accuracy. A pinning defect occurrence rate is reduced by suppressing deterioration in pinning strength of a pinned layer of a read element. To achieve this, a specific resistance of the electroconductive polishing liquid is controlled to 5 GΩ·cm or less. A shallow rail and a deep rail are formed on the air bearing surfaces, and the rover is cut into thin film magnetic heads.
摘要:
Head elements are formed on a wafer in order to suppress deterioration in pinning strength of a pinned layer, which is caused by ESD generated during a thin film magnetic head production process, particularly in an air bearing surface polishing step. The wafer is cut line by line into rovers in each of which the head elements are connected; surfaces to be used as air bearing surfaces of the rover are polished until an MR element height reaches to a predetermined value. After this air bearing surface polishing, an electroconductive polishing liquid is used in a final bearing surface polishing step of finishing the air bearing surfaces to achieve a predetermined shape with high accuracy and a predetermined value of a surface roughness. In order to suppress a pinning defect occurrence rate by suppressing deterioration in pinning strength of a pinned layer of a read element, a specific resistance of the electroconductive polishing liquid is controlled to GΩ·cm or less, preferably 1 GΩ·cm or less. After that, a shallow rail and a deep rail are formed on the air bearing surfaces, and the rover is cut to accomplish thin film magnetic heads.
摘要:
Embodiments of the invention provide a head gimbal assembly (HGA) provided with a solder ball connecting structure suitable for the re-utilization of a suspension assembly. In one embodiment, the HGA includes lead wires provided at front ends thereof with lead pads and also includes slider pads capable of being connected to the lead pads by solder ball bonding with the use of solder balls. Respective grooves formed in the surfaces of the slider pads inhibit the solder balls from rotating and moving over the surfaces of the slider pads and the lead pads before the radiation of a laser beam.