公开(公告)号：US20050091842A1

公开(公告)日：2005-05-05

申请号：US10974910

申请日：2004-10-28

申请人： Hideya Takakura ,  Kazuo Kusuda ,  Hiroyuki Shoji

发明人： Hideya Takakura ,  Kazuo Kusuda ,  Hiroyuki Shoji

IPC分类号： H01L23/50 ,  H01L21/48 ,  H01L23/495 ,  H01L25/16 ,  H01L31/12 ,  H01L31/18 ,  H01R43/00

CPC分类号： H01L23/49565 ,  H01L21/4842 ,  H01L24/45 ,  H01L24/48 ,  H01L25/167 ,  H01L31/12 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/01038 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/5111 ,  H01L2924/00014 ,  H01L2924/00012

摘要： In a manufacturing method of a lead frame for an optical coupling device, the method includes the steps of preparing an elongated lead frame on which a plurality of tie bars are placed between a pair of side rails that are mutually in parallel with each other so as to orthogonally cross the bars, with a plurality of lead terminals being placed in a staggered form in a manner so as to orthogonally cross the tie bars, and laterally cutting the elongated lead frame to prepare a plurality of strap-shaped lead frames. Herein, the elongated lead frame is cut in such a manner that the length of protrusion of a cut end of each of the side rails from each of the tie bars is made longer than the length of protrusion of a lead terminal from each of the tie bars.

摘要翻译： 在一种用于光耦合装置的引线框架的制造方法中，该方法包括以下步骤：制备细长的引线框架，多个连接杆放置在彼此相互平行的一对侧轨之间，从而 以正交方式穿过杆，其中多个引线端子以交错的形式被放置成正交地穿过连接杆，并横向切割细长引线框架以制备多个带状引线框架。 这里，细长引线框架以这样的方式被切割，使得每个侧栏的每个侧轨的切割端的突出长度比每个连接条的引线端子的突出长度长 酒吧。

公开(公告)号：US07410305B2

公开(公告)日：2008-08-12

申请号：US11230822

申请日：2005-09-21

申请人： Nobuyuki Ohe ,  Kazuhito Nagura ,  Hideya Takakura ,  Kazuo Kusuda ,  Hiroyuki Shoji

发明人： Nobuyuki Ohe ,  Kazuhito Nagura ,  Hideya Takakura ,  Kazuo Kusuda ,  Hiroyuki Shoji

IPC分类号： G02B6/36

CPC分类号： H01L31/0203 ,  G02B6/4212 ,  H01L33/56 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00011 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01049

摘要： An optical semiconductor device has an optical semiconductor element (2) such as an LED or PD, and a light-permeable resin (4) encapsulating the optical semiconductor element. The light-permeable resin contains a base resin and filler. The light-permeable resin (4) has a characteristic that its transmittance increases with a temperature rise within an operating temperature range (e.g., −40° C.−+85° C.).

摘要翻译： 光学半导体器件具有诸如LED或PD的光学半导体元件（2）和封装光学半导体元件的透光树脂（4）。 透光树脂含有基础树脂和填料。 透光性树脂（4）具有其工作温度范围（例如-40℃〜+ 85℃）内的温度上升的透过率的特性。

公开(公告)号：US07358535B2

公开(公告)日：2008-04-15

申请号：US10747403

申请日：2003-12-30

申请人： Hiroyuki Shoji ,  Hideya Takakura ,  Kazuo Kusuda

发明人： Hiroyuki Shoji ,  Hideya Takakura ,  Kazuo Kusuda

IPC分类号： H01L21/00

CPC分类号： H01L25/167 ,  H01L31/16 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A photo-coupler semiconductor device includes first and second planar lead frames each having a main portion and a distal portion, a light emitting element and a light receiving element respectively mounted on upper surfaces of the distal portions of the first and second lead frames, a light-transmitting resin member which covers the light emitting element and the light receiving element, and supports the distal portions of the first and second lead frames in spaced opposed relation with the light emitting element and the light receiving element being mounted on the upper surfaces of the distal portions so that the main portions of the first and second lead frames are located in coplanar relation, and a opaque resin member which covers the light-transmitting resin member, and supports the main portions of the first and second lead frames. The light-transmitting resin member and the opaque resin member are each composed of an epoxy resin as a base resin.

摘要翻译： 光耦合器半导体器件包括分别安装在第一和第二引线框架的远端部分的上表面上的主要部分和远端部分的第一和第二平面引线框架，发光元件和光接收元件， 覆盖发光元件和受光元件的透光树脂构件，并且以与发光元件和受光元件隔开的相对关系的方式支撑第一引线框架和第二引线框架的远端部分，其安装在 所述远端部分使得所述第一引线框架和所述第二引线框架的主要部分位于共面关系处，以及不透明树脂构件，其覆盖所述透光树脂构件，并且支撑所述第一引线框架和所述第二引线框架的主要部分。 透光树脂构件和不透明树脂构件各自由作为基础树脂的环氧树脂构成。

公开(公告)号：US07425727B2

公开(公告)日：2008-09-16

申请号：US11226434

申请日：2005-09-15

申请人： Hiroyuki Shoji ,  Hideya Takakura ,  Kazuo Kusuda

发明人： Hiroyuki Shoji ,  Hideya Takakura ,  Kazuo Kusuda

IPC分类号： H01L21/00

CPC分类号： H01L25/167 ,  H01L21/565 ,  H01L23/3135 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L33/56 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/4846 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48599 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/8592 ,  H01L2224/85986 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2224/85186 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48227 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： An optical semiconductor element 2 is mounted on a lead frame 1, the optical semiconductor element 2 is encapsulated with a mold resin portion 14 of a first layer that has light permeability, and the mold resin portion 14 of the first layer is encapsulated with a mold resin portion 15 of a second layer that has light permeability. Then, a coefficient of linear expansion of the mold resin portion 14 of the first layer is made smaller than a coefficient of linear expansion of the mold resin portion 15 of the second layer.

摘要翻译： 将光学半导体元件2安装在引线框架1上，用具有透光性的第一层的模制树脂部分14封装光学半导体元件2，并且用模具封装第一层的模制树脂部分14 具有透光性的第二层的树脂部分15。 然后，使第一层的模制树脂部分14的线膨胀系数小于第二层的模制树脂部分15的线性膨胀系数。

公开(公告)号：US20060060882A1

公开(公告)日：2006-03-23

申请号：US11230822

申请日：2005-09-21

申请人： Nobuyuki Ohe ,  Kazuhito Nagura ,  Hideya Takakura ,  Kazuo Kusuda ,  Hiroyuki Shoji

发明人： Nobuyuki Ohe ,  Kazuhito Nagura ,  Hideya Takakura ,  Kazuo Kusuda ,  Hiroyuki Shoji

IPC分类号： H01L33/00

CPC分类号： H01L31/0203 ,  G02B6/4212 ,  H01L33/56 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00011 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01049

摘要： An optical semiconductor device has an optical semiconductor element (2) such as an LED or PD, and a light-permeable resin (4) encapsulating the optical semiconductor element. The light-permeable resin contains a base resin and filler. The light-permeable resin (4) has a characteristic that its transmittance increases with a temperature rise within an operating temperature range (e.g., −40° C.−+85° C.)

摘要翻译： 光学半导体器件具有诸如LED或PD的光学半导体元件（2）和封装光学半导体元件的透光树脂（4）。 透光树脂含有基础树脂和填料。 透光性树脂（4）具有其工作温度范围（例如-40℃〜+ 85℃）内的温度上升的透过率的特性，

公开(公告)号：US20060054901A1

公开(公告)日：2006-03-16

申请号：US11226434

申请日：2005-09-15

申请人： Hiroyuki Shoji ,  Hideya Takakura ,  Kazuo Kusuda

发明人： Hiroyuki Shoji ,  Hideya Takakura ,  Kazuo Kusuda

IPC分类号： H01L21/00 ,  H01L33/00

CPC分类号： H01L25/167 ,  H01L21/565 ,  H01L23/3135 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L33/56 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/4846 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48599 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/8592 ,  H01L2224/85986 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2224/85186 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48227 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： An optical semiconductor element 2 is mounted on a lead frame 1, the optical semiconductor element 2 is encapsulated with a mold resin portion 14 of a first layer that has light permeability, and the mold resin portion 14 of the first layer is encapsulated with a mold resin portion 15 of a second layer that has light permeability. Then, a coefficient of linear expansion of the mold resin portion 14 of the first layer is made smaller than a coefficient of linear expansion of the mold resin portion 15 of the second layer.

摘要翻译： 将光学半导体元件2安装在引线框架1上，用具有透光性的第一层的模制树脂部分14封装光学半导体元件2，并且用模具封装第一层的模制树脂部分14 具有透光性的第二层的树脂部分15。 然后，使第一层的模制树脂部分14的线膨胀系数小于第二层的模制树脂部分15的线性膨胀系数。

公开(公告)号：US07234231B2

公开(公告)日：2007-06-26

申请号：US10974910

申请日：2004-10-28

申请人： Hideya Takakura ,  Kazuo Kusuda ,  Hiroyuki Shoji

发明人： Hideya Takakura ,  Kazuo Kusuda ,  Hiroyuki Shoji

IPC分类号： H01R43/00

CPC分类号： H01L23/49565 ,  H01L21/4842 ,  H01L24/45 ,  H01L24/48 ,  H01L25/167 ,  H01L31/12 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/01038 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/5111 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A manufacturing method of an optical coupling device includes, preparing an elongated lead frame on which a plurality of tie bars are placed between a pair of side rails that are mutually in parallel with each other so as to orthogonally cross the tie bars, with a plurality of lead terminals being placed in a staggered form in a manner so as to orthogonally cross the tie bars, and laterally cutting the elongated lead frame to prepare a plurality of strap-shaped lead frames, in such a manner that the length of protrusion of a cut end of each of the side rails from each of the tie bars is made longer than the length of protrusion of a lead terminal from each of the tie bars.

摘要翻译： 光耦合装置的制造方法包括：准备细长的引线框架，多个连接杆放置在一对侧轨之间，所述多个连接杆彼此平行地彼此平行，以便与多个 的引线端子以交错的形式被放置成正交地穿过连接杆，并且横向地切割细长的引线框架以制备多个带状引线框架，使得一个 每个连接条的每个侧轨的切割端的长度大于从每个连接条引导端子的突出长度。

公开(公告)号：US06895664B2

公开(公告)日：2005-05-24

申请号：US10270005

申请日：2002-10-15

申请人： Hideya Takakura ,  Kazuo Kusuda

发明人： Hideya Takakura ,  Kazuo Kusuda

IPC分类号： H01L23/48 ,  H01L21/00 ,  H01L25/16 ,  H01L31/12 ,  H01R43/00

CPC分类号： H01L21/67144 ,  H01L25/167 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2924/3025 ,  Y10T29/49121 ,  Y10T29/4913 ,  H01L2924/00014 ,  H01L2924/00

摘要： A lead frame of an optical coupling device of the present invention is so arranged that (a) a light-emitting side section in which a plurality of header sections for mounting thereon the light-emitting elements are aligned and (b) a light-receiving side section in which a plurality of header sections for mounting thereon the light-receiving element are aligned, and (c) a connecting section for connecting the light-emitting side section and the light-receiving side section in parallel into one body. The light-emitting side section and the light-receiving side section are integrated via a connecting section at which a V groove is formed for facilitating the folding of the lead frame. As a result, it is possible to provide a low-cost lead frame of an optical coupling device with a small number of components can be realized, in a simplified manner, and a manufacturing method of the optical coupling device.

摘要翻译： 本发明的光耦合装置的引线框架被配置为：（a）其上安装有发光元件的多个集管部分对准的发光侧部分，（b）光接收部 其中多个用于安装在其上的光接收元件的集管部分对准的侧面部分，以及（c）用于将发光侧部分和光接收侧部分平行连接成一体的连接部分。 发光侧部分和光接收侧部分通过形成V沟槽的连接部分一体化，以便引导框架的折叠。 结果，可以以简单的方式提供具有少量部件的光耦合装置的低成本引线框架和光耦合装置的制造方法。

公开(公告)号：US06507035B1

公开(公告)日：2003-01-14

申请号：US09482278

申请日：2000-01-13

申请人： Yasushi Hasegawa ,  Hideya Takakura ,  Kazuo Kusuda

发明人： Yasushi Hasegawa ,  Hideya Takakura ,  Kazuo Kusuda

IPC分类号： G02B2700

CPC分类号： H01L31/167 ,  H01L25/167 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A photocoupler device includes a light emitting element; a monitor photodetector and an output photodetector for receiving light from the light emitting element; a primary side lead frame for mounting the light emitting element and the monitor photodetector; and a secondary side lead frame for mounting the output photodetector, wherein the light emitting element and the output photodetector are placed so as to face each other.

摘要翻译： 光电耦合器件包括发光元件; 监视器光电检测器和用于接收来自发光元件的光的输出光电检测器; 用于安装发光元件和监视器光电检测器的初级侧引线框架; 以及用于安装输出光电检测器的次级侧引线框架，其中发光元件和输出光电检测器被放置成彼此面对。

公开(公告)号：US5770867A

公开(公告)日：1998-06-23

申请号：US585503

申请日：1996-01-16

申请人： Naoki Sata ,  Kazuo Kusuda

发明人： Naoki Sata ,  Kazuo Kusuda

IPC分类号： H01L31/12 ,  H01L31/0203 ,  H01L31/167 ,  H01L27/15

CPC分类号： H01L31/0203 ,  H01L31/167 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247

摘要： A photocoupler device includes a light-emitting chip, a light-receiving chip, a light-emitting side lead frame for individually holding the light emitting chip and a light-receiving side lead frame for individually holding the light-receiving chip. The light-emitting and light-receiving chips are opposed to each other so as to be optically coupled and covered with a light-transmissive resin as a first molding layer, in the whole part except in the outside connecting terminal portions of the two lead frames. The first molding layer is further covered with an opaque resin as a second molding layer. In such a photocoupler device, the light-transmissive resin is made to contain fillers in an amount of 80% by weight or more and directly cover the light-emitting chip, without needing silicone-resin coating for protecting the light-emitting chip.

摘要翻译： 光电耦合器件包括发光芯片，光接收芯片，用于独立地保持发光芯片的发光侧引线框架和用于分别保持光接收芯片的光接收侧引线框架。 在两个引线框架的外部连接端子部分之外的整个部分中，发光和光接收芯片彼此相对以便被光耦合并被透光树脂覆盖，作为第一成型层 。 第一成型层进一步用不透明树脂作为第二成型层覆盖。 在这种光耦合装置中，使透光性树脂含有80重量％以上的填料，直接覆盖发光芯片，而不需要用于保护发光芯片的硅树脂涂层。