公开(公告)号：US08993064B2

公开(公告)日：2015-03-31

申请号：US13510406

申请日：2010-11-12

申请人： Hironao Okayama ,  Kouji Nanbu ,  Akira Kaneko ,  Hajime Ota ,  Kotaro Ohki ,  Takashi Yamaguchi ,  Kazuhiko Hayashi ,  Kazuya Ohmatsu

发明人： Hironao Okayama ,  Kouji Nanbu ,  Akira Kaneko ,  Hajime Ota ,  Kotaro Ohki ,  Takashi Yamaguchi ,  Kazuhiko Hayashi ,  Kazuya Ohmatsu

IPC分类号： C22F1/08 ,  C23C10/02 ,  H01L39/24 ,  H01L39/02 ,  B32B15/20 ,  C22C9/00 ,  C22C19/03

CPC分类号： C22C9/00 ,  B32B15/015 ,  C21D8/1255 ,  C22C19/03 ,  C22C38/007 ,  C22C38/40 ,  C22F1/08 ,  H01L39/2454 ,  Y10T428/12903 ,  Y10T428/12924 ,  Y10T428/12979

摘要： Provided are a substrate for a superconducting compound and a method for manufacturing the substrate which can realize the excellent adhesive strength simultaneously with high orientation of copper. An absorbed material on a surface of a copper foil to which rolling is applied at a draft of 90% or more is removed by applying sputter etching to the surface of the copper foil, sputter etching is applied to a nonmagnetic metal sheet, the copper foil and the metal sheet are bonded to each other by applying a pressure to the copper foil and the metal sheet using reduction rolls, crystals of the copper in the copper foil are oriented by heating a laminated body formed by such bonding, copper is diffused into the metal sheet by heating with a copper diffusion distance of 10 nm or more, and a protective layer is laminated to a surface of the copper foil of the laminated body.

摘要翻译： 提供了一种用于超导化合物的基板和用于制造基板的方法，其可以在铜的高取向同时实现优异的粘合强度。 通过对铜箔的表面进行溅射蚀刻，去除在90％以上的卷取条件下施加轧制的铜箔的表面上的吸收材料，对非磁性金属板进行溅射蚀刻，铜箔 并且通过使用还原辊对铜箔和金属板施加压力来将金属片彼此接合，铜箔中的铜的晶体通过加热由这种键合形成的层叠体而取向，铜扩散到 金属片通过加热铜扩散距离为10nm以上，并且保护层层压到层叠体的铜箔的表面。

公开(公告)号：US20130040821A1

公开(公告)日：2013-02-14

申请号：US13510406

申请日：2010-11-12

申请人： Hironao Okayama ,  Kouji Nanbu ,  Akira Kaneko ,  Hajime Ota ,  Kotaro Ohki ,  Takashi Yamaguchi ,  Kazuhiko Hayashi ,  Kazuya Ohmatsu

发明人： Hironao Okayama ,  Kouji Nanbu ,  Akira Kaneko ,  Hajime Ota ,  Kotaro Ohki ,  Takashi Yamaguchi ,  Kazuhiko Hayashi ,  Kazuya Ohmatsu

IPC分类号： H01L39/02 ,  B32B15/20 ,  B32B15/18 ,  H01L39/24

CPC分类号： C22C9/00 ,  B32B15/015 ,  C21D8/1255 ,  C22C19/03 ,  C22C38/007 ,  C22C38/40 ,  C22F1/08 ,  H01L39/2454 ,  Y10T428/12903 ,  Y10T428/12924 ,  Y10T428/12979

摘要： Provided are a substrate for a superconducting compound and a method for manufacturing the substrate which can realize the excellent adhesive strength simultaneously with high orientation of copper. An absorbed material on a surface of a copper foil to which rolling is applied at a draft of 90% or more is removed by applying sputter etching to the surface of the copper foil, sputter etching is applied to a nonmagnetic metal sheet, the copper foil and the metal sheet are bonded to each other by applying a pressure to the copper foil and the metal sheet using reduction rolls, crystals of the copper in the copper foil are oriented by heating a laminated body formed by such bonding, copper is diffused into the metal sheet by heating with a copper diffusion distance of lOnm or more, and a protective layer is laminated to a surface of the copper foil of the laminated body.

摘要翻译： 提供了一种用于超导化合物的基板和用于制造基板的方法，其可以在铜的高取向同时实现优异的粘合强度。 通过对铜箔的表面进行溅射蚀刻，去除在90％以上的卷取条件下施加轧制的铜箔的表面上的吸收材料，对非磁性金属板进行溅射蚀刻，铜箔 并且通过使用还原辊对铜箔和金属板施加压力来将金属片彼此接合，铜箔中的铜的晶体通过加热由这种键合形成的层叠体而取向，铜扩散到 金属片通过加热至100nm以上的铜扩散距离，并且在层叠体的铜箔的表面上层叠保护层。

公开(公告)号：US08815777B2

公开(公告)日：2014-08-26

申请号：US13383957

申请日：2010-07-08

申请人： Hironao Okayama ,  Teppei Kurokawa ,  Kouji Nanbu ,  Yoshihiko Isobe ,  Takashi Koshiro ,  Akira Kaneko ,  Hajime Ota ,  Kotaro Ohki ,  Takashi Yamaguchi ,  Kazuya Ohmastu

发明人： Hironao Okayama ,  Teppei Kurokawa ,  Kouji Nanbu ,  Yoshihiko Isobe ,  Takashi Koshiro ,  Akira Kaneko ,  Hajime Ota ,  Kotaro Ohki ,  Takashi Yamaguchi ,  Kazuya Ohmastu

IPC分类号： H01L39/24

CPC分类号： H01L39/2454 ,  B32B15/01 ,  B32B15/015 ,  B32B15/04 ,  B32B15/20 ,  C22C9/00 ,  C22F1/08

摘要： A metal laminated substrate for an oxide superconducting wire is produced by removing, in a state where a copper foil to which rolling is applied at a draft of 90% or more is held at a temperature below a recrystallization temperature, an absorbed material on a surface of the copper foil by applying sputter etching to the surface of the copper foil; removing an absorbed material on a surface of a nonmagnetic metal sheet by applying sputter etching to the surface of the nonmagnetic metal sheet; bonding the copper foil and the metal sheet to each other by reduction rolls at an applied pressure of 300 MPa to 1500 MPa; orienting crystals of the copper by heating a laminated body obtained by bonding at a crystal orientation temperature of copper or above; and forming a protective layer on a copper-side surface of the laminated body by coating.

摘要翻译： 在将氧化物超导线材的金属层压基板在以90％以上的牵伸下施加轧制的铜箔保持在低于再结晶温度的温度的状态下，除去表面上的吸收材料， 通过对铜箔的表面进行溅射蚀刻; 通过对非磁性金属片的表面进行溅射蚀刻，去除非磁性金属片表面上的吸收材料; 在300MPa〜1500MPa的施加压力下通过还原辊将铜箔和金属板彼此接合; 通过加热通过在铜或更高的晶体取向温度下接合获得的层压体来取向铜的晶体; 并通过涂布在层叠体的铜侧表面上形成保护层。

公开(公告)号：US20120208703A1

公开(公告)日：2012-08-16

申请号：US13383957

申请日：2010-07-08

申请人： Hironao Okayama ,  Teppei Kurokawa ,  Kouji Nanbu ,  Yoshihiko Isobe ,  Takashi Koshiro ,  Akira Kaneko ,  Hajime Ota ,  Kotaro Ohki ,  Takashi Yamaguchi ,  Kazuya Ohmastu

发明人： Hironao Okayama ,  Teppei Kurokawa ,  Kouji Nanbu ,  Yoshihiko Isobe ,  Takashi Koshiro ,  Akira Kaneko ,  Hajime Ota ,  Kotaro Ohki ,  Takashi Yamaguchi ,  Kazuya Ohmastu

IPC分类号： H01L39/02 ,  H01L39/24

CPC分类号： H01L39/2454 ,  B32B15/01 ,  B32B15/015 ,  B32B15/04 ,  B32B15/20 ,  C22C9/00 ,  C22F1/08

摘要： A metal laminated substrate for an oxide superconducting wire is produced by removing, in a state where a copper foil to which rolling is applied at a draft of 90% or more is held at a temperature below a recrystallization temperature, an absorbed material on a surface of the copper foil by applying sputter etching to the surface of the copper foil; removing an absorbed material on a surface of a nonmagnetic metal sheet by applying sputter etching to the surface of the nonmagnetic metal sheet; bonding the copper foil and the metal sheet to each other by reduction rolls at an applied pressure of 300 MPa to 1500 MPa; orienting crystals of the copper by heating a laminated body obtained by bonding at a crystal orientation temperature of copper or above; and forming a protective layer on a copper-side surface of the laminated body by coating.

摘要翻译： 在将氧化物超导线材的金属层压基板在以90％以上的牵伸下施加轧制的铜箔保持在低于再结晶温度的温度的状态下，除去表面上的吸收材料， 通过对铜箔的表面进行溅射蚀刻; 通过对非磁性金属片的表面进行溅射蚀刻，去除非磁性金属片表面上的吸收材料; 在300MPa〜1500MPa的施加压力下通过还原辊将铜箔和金属板彼此接合; 通过加热通过在铜或更高的晶体取向温度下接合获得的层压体来取向铜的晶体; 并通过涂布在层叠体的铜侧表面上形成保护层。

公开(公告)号：US20110290380A1

公开(公告)日：2011-12-01

申请号：US13127905

申请日：2009-10-20

申请人： Hironao Okayama ,  Akira Kaneko ,  Kouji Nanbu

发明人： Hironao Okayama ,  Akira Kaneko ,  Kouji Nanbu

IPC分类号： C22F1/08 ,  C23F1/00 ,  C22C9/00

CPC分类号： C22F1/08 ,  B32B15/01 ,  B32B15/015 ,  C22C9/00 ,  C22C38/02 ,  C22C38/44 ,  C22C38/58 ,  C30B25/18 ,  C30B29/06 ,  C30B29/16 ,  C30B29/40 ,  C30B29/52 ,  C30B33/00 ,  H01L23/142 ,  H01L31/03921 ,  H01L33/007 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K1/09 ,  H05K3/022 ,  H05K2201/0355 ,  H05K2203/1105 ,  Y02E10/50 ,  H01L2924/00

摘要： Disclosed is a metal laminated substrate for forming an epitaxial growth film for forming a semiconductor element having high biaxial crystal orientation on a surface of a metal substrate and a method of manufacturing the metal laminated substrate. The manufacturing method includes the steps of activating at least one surface of a metal plate T1 by sputter etching or the like; activating at least one surface of a metal foil T2 made of Cu or a Cu alloy which is cold-rolled at a rolling reduction of 90% or more; laminating the metal plate and the metal foil such that an activated surface of the metal plate and an activated surface of the metal foil face each other in an opposed manner and applying cold rolling to the metal plate and the metal foil which are laminated to each other at a rolling reduction of 10% or less, for example; and biaxially orienting crystals of the metal foil by heat treatment at a temperature of not lower than 150° C. and not higher than 1000° C.

摘要翻译： 公开了一种用于形成用于在金属基板的表面上形成具有高双轴晶体取向的半导体元件的外延生长膜的金属层压基板和制造金属层叠基板的方法。 该制造方法包括通过溅射蚀刻等激活金属板T1的至少一个表面的步骤; 激活由Cu或Cu合金制成的金属箔T2的至少一个表面，其中轧制压下率为90％以上; 层压金属板和金属箔，使得金属板的活化表面和金属箔的活化表面相反地相对地面对并对彼此层压的金属板和金属箔进行冷轧 例如在压下率为10％以下的情况下。 并且在不低于150℃且不高于1000℃的温度下通过热处理将金属箔的晶体双轴取向。

公开(公告)号：US20110290378A1

公开(公告)日：2011-12-01

申请号：US13127869

申请日：2009-10-20

申请人： Hironao Okayama ,  Kouji Nanbu ,  Akira Kaneko

发明人： Hironao Okayama ,  Kouji Nanbu ,  Akira Kaneko

IPC分类号： C22F1/00 ,  B32B15/08 ,  C23C14/34

CPC分类号： C30B1/02 ,  B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B2255/06 ,  B32B2255/20 ,  B32B2307/306 ,  B32B2307/518 ,  B32B2307/538 ,  B32B2307/732 ,  C22F1/08 ,  C23C14/562 ,  C30B1/04 ,  H01L31/03682 ,  H01L31/0392 ,  H01L31/18 ,  H05K1/0393 ,  H05K1/09 ,  H05K3/022 ,  H05K2201/0355 ,  H05K2203/1105 ,  Y02E10/546

摘要： Disclosed are a polymer laminated substrate for forming an epitaxial growth film having a highly-crystal-oriented surface and a method of manufacturing the polymer laminated substrate. The method of manufacturing a polymer laminated substrate for forming an epitaxial growth film includes the steps of: activating at least one surface of a polymer sheet T1; activating at least one surface of a metal foil T2 which is made of Cu or a Cu alloy and is formed by cold rolling at a draft of 90% or more; laminating the polymer sheet and the metal foil such that an activated surface of the polymer sheet and an activated surface of the metal foil face each other in an opposed manner and applying cold rolling to the polymer sheet and the metal foil which are laminated to each other; and biaxially orienting crystals of the metal foil by heat treatment.

摘要翻译： 公开了一种用于形成具有高结晶取向表面的外延生长膜的聚合物层压基板和制造聚合物层压基板的方法。 制造用于形成外延生长膜的聚合物层压基板的方法包括以下步骤：激活聚合物片材T1的至少一个表面; 激活由Cu或Cu合金制成的金属箔T2的至少一个表面，并通过以90％以上的牵伸下的冷轧形成; 层叠聚合物片和金属箔，使得聚合物片的活化表面和金属箔的活化表面以相反的方式彼此面对并对彼此层压的聚合物片和金属箔进行冷轧 ; 并通过热处理将金属箔的晶体双轴取向。

公开(公告)号：US20120040840A1

公开(公告)日：2012-02-16

申请号：US13127928

申请日：2009-11-11

申请人： Hironao Okayama ,  Akira Kaneko ,  Takeshi Kato ,  Masaya Konishi

发明人： Hironao Okayama ,  Akira Kaneko ,  Takeshi Kato ,  Masaya Konishi

IPC分类号： H01B12/02 ,  H01L39/24

CPC分类号： H01L39/2454 ,  Y10T29/49014

摘要： [Problem]A metal laminated substrate for an oxide superconducting wire is provided at a low cost. The metal laminated substrate has high strength, and stable high biaxial orientation in the longitudinal direction.[Means for Resolution]A metal laminated substrate for an oxide superconducting wire is manufactured such that a non-magnetic metal plate T1 having a thickness of not more than 0.2 mm and a metal foil T2 made of Cu alloy which is formed by cold rolling at a draft of not less than 90% and has a thickness of not more than 50 μm is laminated to each other by room-temperature surface active bonding, after lamination, crystal of the metal foil is oriented by heat treatment at a temperature of not less than 150° C. and not more than 1000° C. and, thereafter, an epitaxial growth film T3 made of Ni or an Ni alloy having a thickness of not more than 10 μm is laminated to the metal foil.

摘要翻译： [问题]以低成本提供了用于氧化物超导线材的金属层叠基板。 金属层压基板具有高强度，并且在纵向上具有稳定的高双轴取向。 [解决方法]制造氧化物超导线金属层叠基板，使得厚度不大于0.2mm的非磁性金属板T1和由Cu合金制成的金属箔T2通过冷轧形成 通过室温表面活性粘合将不小于90％的厚度不大于50μm的通过层压，层压之后，金属箔的晶体在不低于的温度下进行热处理 在150℃以上1000℃以下，然后将由Ni或Ni合金制成的厚度不大于10μm的外延生长膜T3层叠在金属箔上。

公开(公告)号：US09034124B2

公开(公告)日：2015-05-19

申请号：US13127928

申请日：2009-11-11

申请人： Hironao Okayama ,  Akira Kaneko ,  Takeshi Kato ,  Masaya Konishi

发明人： Hironao Okayama ,  Akira Kaneko ,  Takeshi Kato ,  Masaya Konishi

IPC分类号： H01B12/02 ,  H01L39/24

CPC分类号： H01L39/2454 ,  Y10T29/49014

摘要： A metal laminated substrate for an oxide superconducting wire is manufactured such that a non-magnetic metal plate T1 having a thickness of not more than 0.2 mm and a metal foil T2 made of Cu alloy which is formed by cold rolling at a draft of not less than 90% and has a thickness of not more than 50 μm is laminated to each other by room-temperature surface active bonding, after lamination, crystal of the metal foil is oriented by heat treatment at a temperature of not less than 150° C. and not more than 1000° C. and, thereafter, an epitaxial growth film T3 made of Ni or an Ni alloy having a thickness of not more than 10 μm is laminated to the metal foil.

摘要翻译： 制造用于氧化物超导线材的金属层压基板，使得厚度不大于0.2mm的非磁性金属板T1和由Cu合金制成的金属箔T2以不低于 90％以上，通过室温表面活性粘合而层叠不大于50μm的厚度，层压后，金属箔的结晶在不低于150℃的温度下进行热处理。 并且不超过1000℃，然后将厚度不大于10μm的由Ni或Ni合金制成的外延生长膜T3层压到金属箔上。

公开(公告)号：US06777863B1

公开(公告)日：2004-08-17

申请号：US09646349

申请日：2001-01-03

申请人： Hironao Okayama ,  Tsuneyuki Ide ,  Yasuo Tahara ,  Hiroshi Fujishige ,  Akira Ikeda ,  Setsuo Takaki

发明人： Hironao Okayama ,  Tsuneyuki Ide ,  Yasuo Tahara ,  Hiroshi Fujishige ,  Akira Ikeda ,  Setsuo Takaki

IPC分类号： H01J2980

CPC分类号： C21D8/0273 ,  C21D8/0205 ,  C21D8/0236 ,  C21D8/0268 ,  C22C38/004 ,  C22C38/08 ,  C22C38/105 ,  H01J9/142 ,  H01J29/07 ,  H01J2229/0733

摘要： A material is provided for marking aperture grilles for use in a color picture tube which has excellent yield strength, high temperature creep strength, and superior magnetic characteristics as compared to conventional materials. The material is made by cold-rolling a low carbon sheet containing 9 to 30 weight % of Ni or 9 to 30 weight % of Ni and 0.1 to 5 weight % of Co, and annealing the cold-rolled steel sheet at a temperature of 400-500° C.

摘要翻译： 提供了一种用于标记用于彩色显像管的孔格栅的材料，其与常规材料相比具有优异的屈服强度，高温蠕变强度和优异的磁特性。 该材料通过冷轧含有9〜30重量％的Ni或9〜30重量％的Ni和0.1〜5重量％的Co的低碳板，并在400℃的温度下退火冷轧钢板 -500°C

公开(公告)号：US06617776B1

公开(公告)日：2003-09-09

申请号：US09869201

申请日：2001-06-25

申请人： Tsuneyuki Ide ,  Takahiko Miyazaki ,  Susumu Sigemasa ,  Yasuo Tahara ,  Hironao Okayama

发明人： Tsuneyuki Ide ,  Takahiko Miyazaki ,  Susumu Sigemasa ,  Yasuo Tahara ,  Hironao Okayama

IPC分类号： H01J2980

CPC分类号： C22C38/002 ,  C22C38/004 ,  C22C38/04 ,  C22C38/08 ,  C22C38/16 ,  C22C38/18 ,  H01J29/07 ,  H01J2229/0733

摘要： It is an object of this invention to provide a shadow mask material for use in a color picture tube excellent in tensile strength and excellent in high temperature creep strength, a shadow mask and a picture tube incorporating the same. For this purpose, the shadow mask material according to this invention uses a low carbon alloy steel sheet containing from 0.05 to 2.5% by weight of Cu and 0.001 to 0.4% by weight of P, or from 0.05 to 2.5% by weight of Cu, from 0.001 to 0.4% by weight of P and from 0.01 to 1.75% by weight of Ni.

摘要翻译： 本发明的目的是提供一种用于拉伸强度优异，耐高温蠕变强度优异的彩色显像管中的荫罩材料，荫罩和包含该荫罩材料的显像管。 为此，根据本发明的荫罩材料使用含有0.05-2.5重量％的Cu和0.001-0.4重量％的P或0.05-2.5重量％的Cu的低碳合金钢板， 0.01〜0.4重量％的P和0.01〜1.75重量％的Ni。