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1.发明授权公开(公告)号：US08993064B2
公开(公告)日：2015-03-31
申请号：US13510406
申请日：2010-11-12
申请人： Hironao Okayama , Kouji Nanbu , Akira Kaneko , Hajime Ota , Kotaro Ohki , Takashi Yamaguchi , Kazuhiko Hayashi , Kazuya Ohmatsu
发明人： Hironao Okayama , Kouji Nanbu , Akira Kaneko , Hajime Ota , Kotaro Ohki , Takashi Yamaguchi , Kazuhiko Hayashi , Kazuya Ohmatsu
CPC分类号： C22C9/00 , B32B15/015 , C21D8/1255 , C22C19/03 , C22C38/007 , C22C38/40 , C22F1/08 , H01L39/2454 , Y10T428/12903 , Y10T428/12924 , Y10T428/12979
摘要： Provided are a substrate for a superconducting compound and a method for manufacturing the substrate which can realize the excellent adhesive strength simultaneously with high orientation of copper. An absorbed material on a surface of a copper foil to which rolling is applied at a draft of 90% or more is removed by applying sputter etching to the surface of the copper foil, sputter etching is applied to a nonmagnetic metal sheet, the copper foil and the metal sheet are bonded to each other by applying a pressure to the copper foil and the metal sheet using reduction rolls, crystals of the copper in the copper foil are oriented by heating a laminated body formed by such bonding, copper is diffused into the metal sheet by heating with a copper diffusion distance of 10 nm or more, and a protective layer is laminated to a surface of the copper foil of the laminated body.
摘要翻译： 提供了一种用于超导化合物的基板和用于制造基板的方法，其可以在铜的高取向同时实现优异的粘合强度。 通过对铜箔的表面进行溅射蚀刻，去除在90％以上的卷取条件下施加轧制的铜箔的表面上的吸收材料，对非磁性金属板进行溅射蚀刻，铜箔 并且通过使用还原辊对铜箔和金属板施加压力来将金属片彼此接合，铜箔中的铜的晶体通过加热由这种键合形成的层叠体而取向，铜扩散到 金属片通过加热铜扩散距离为10nm以上，并且保护层层压到层叠体的铜箔的表面。
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2.发明申请公开(公告)号：US20130040821A1
公开(公告)日：2013-02-14
申请号：US13510406
申请日：2010-11-12
申请人： Hironao Okayama , Kouji Nanbu , Akira Kaneko , Hajime Ota , Kotaro Ohki , Takashi Yamaguchi , Kazuhiko Hayashi , Kazuya Ohmatsu
发明人： Hironao Okayama , Kouji Nanbu , Akira Kaneko , Hajime Ota , Kotaro Ohki , Takashi Yamaguchi , Kazuhiko Hayashi , Kazuya Ohmatsu
CPC分类号： C22C9/00 , B32B15/015 , C21D8/1255 , C22C19/03 , C22C38/007 , C22C38/40 , C22F1/08 , H01L39/2454 , Y10T428/12903 , Y10T428/12924 , Y10T428/12979
摘要： Provided are a substrate for a superconducting compound and a method for manufacturing the substrate which can realize the excellent adhesive strength simultaneously with high orientation of copper. An absorbed material on a surface of a copper foil to which rolling is applied at a draft of 90% or more is removed by applying sputter etching to the surface of the copper foil, sputter etching is applied to a nonmagnetic metal sheet, the copper foil and the metal sheet are bonded to each other by applying a pressure to the copper foil and the metal sheet using reduction rolls, crystals of the copper in the copper foil are oriented by heating a laminated body formed by such bonding, copper is diffused into the metal sheet by heating with a copper diffusion distance of lOnm or more, and a protective layer is laminated to a surface of the copper foil of the laminated body.
摘要翻译： 提供了一种用于超导化合物的基板和用于制造基板的方法，其可以在铜的高取向同时实现优异的粘合强度。 通过对铜箔的表面进行溅射蚀刻，去除在90％以上的卷取条件下施加轧制的铜箔的表面上的吸收材料，对非磁性金属板进行溅射蚀刻，铜箔 并且通过使用还原辊对铜箔和金属板施加压力来将金属片彼此接合，铜箔中的铜的晶体通过加热由这种键合形成的层叠体而取向，铜扩散到 金属片通过加热至100nm以上的铜扩散距离，并且在层叠体的铜箔的表面上层叠保护层。
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3.发明授权公开(公告)号：US08815777B2
公开(公告)日：2014-08-26
申请号：US13383957
申请日：2010-07-08
申请人： Hironao Okayama , Teppei Kurokawa , Kouji Nanbu , Yoshihiko Isobe , Takashi Koshiro , Akira Kaneko , Hajime Ota , Kotaro Ohki , Takashi Yamaguchi , Kazuya Ohmastu
发明人： Hironao Okayama , Teppei Kurokawa , Kouji Nanbu , Yoshihiko Isobe , Takashi Koshiro , Akira Kaneko , Hajime Ota , Kotaro Ohki , Takashi Yamaguchi , Kazuya Ohmastu
IPC分类号： H01L39/24
CPC分类号： H01L39/2454 , B32B15/01 , B32B15/015 , B32B15/04 , B32B15/20 , C22C9/00 , C22F1/08
摘要： A metal laminated substrate for an oxide superconducting wire is produced by removing, in a state where a copper foil to which rolling is applied at a draft of 90% or more is held at a temperature below a recrystallization temperature, an absorbed material on a surface of the copper foil by applying sputter etching to the surface of the copper foil; removing an absorbed material on a surface of a nonmagnetic metal sheet by applying sputter etching to the surface of the nonmagnetic metal sheet; bonding the copper foil and the metal sheet to each other by reduction rolls at an applied pressure of 300 MPa to 1500 MPa; orienting crystals of the copper by heating a laminated body obtained by bonding at a crystal orientation temperature of copper or above; and forming a protective layer on a copper-side surface of the laminated body by coating.
摘要翻译： 在将氧化物超导线材的金属层压基板在以90％以上的牵伸下施加轧制的铜箔保持在低于再结晶温度的温度的状态下，除去表面上的吸收材料， 通过对铜箔的表面进行溅射蚀刻; 通过对非磁性金属片的表面进行溅射蚀刻，去除非磁性金属片表面上的吸收材料; 在300MPa〜1500MPa的施加压力下通过还原辊将铜箔和金属板彼此接合; 通过加热通过在铜或更高的晶体取向温度下接合获得的层压体来取向铜的晶体; 并通过涂布在层叠体的铜侧表面上形成保护层。
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4.发明申请公开(公告)号：US20120208703A1
公开(公告)日：2012-08-16
申请号：US13383957
申请日：2010-07-08
申请人： Hironao Okayama , Teppei Kurokawa , Kouji Nanbu , Yoshihiko Isobe , Takashi Koshiro , Akira Kaneko , Hajime Ota , Kotaro Ohki , Takashi Yamaguchi , Kazuya Ohmastu
发明人： Hironao Okayama , Teppei Kurokawa , Kouji Nanbu , Yoshihiko Isobe , Takashi Koshiro , Akira Kaneko , Hajime Ota , Kotaro Ohki , Takashi Yamaguchi , Kazuya Ohmastu
CPC分类号： H01L39/2454 , B32B15/01 , B32B15/015 , B32B15/04 , B32B15/20 , C22C9/00 , C22F1/08
摘要： A metal laminated substrate for an oxide superconducting wire is produced by removing, in a state where a copper foil to which rolling is applied at a draft of 90% or more is held at a temperature below a recrystallization temperature, an absorbed material on a surface of the copper foil by applying sputter etching to the surface of the copper foil; removing an absorbed material on a surface of a nonmagnetic metal sheet by applying sputter etching to the surface of the nonmagnetic metal sheet; bonding the copper foil and the metal sheet to each other by reduction rolls at an applied pressure of 300 MPa to 1500 MPa; orienting crystals of the copper by heating a laminated body obtained by bonding at a crystal orientation temperature of copper or above; and forming a protective layer on a copper-side surface of the laminated body by coating.
摘要翻译： 在将氧化物超导线材的金属层压基板在以90％以上的牵伸下施加轧制的铜箔保持在低于再结晶温度的温度的状态下，除去表面上的吸收材料， 通过对铜箔的表面进行溅射蚀刻; 通过对非磁性金属片的表面进行溅射蚀刻，去除非磁性金属片表面上的吸收材料; 在300MPa〜1500MPa的施加压力下通过还原辊将铜箔和金属板彼此接合; 通过加热通过在铜或更高的晶体取向温度下接合获得的层压体来取向铜的晶体; 并通过涂布在层叠体的铜侧表面上形成保护层。
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5.发明申请METHOD FOR MANUFACTURING METAL LAMINATED SUBSTRATE FOR SEMICONDUCTOR ELEMENT FORMATION AND METAL LAMINATED SUBSTRATE FOR SEMICONDUCTOR ELEMENT FORMATION 审中-公开用于半导体元素形成的金属层压基板和用于半导体元件形成的金属层压基板的方法公开(公告)号：US20110290380A1
公开(公告)日：2011-12-01
申请号：US13127905
申请日：2009-10-20
申请人： Hironao Okayama , Akira Kaneko , Kouji Nanbu
发明人： Hironao Okayama , Akira Kaneko , Kouji Nanbu
CPC分类号： C22F1/08 , B32B15/01 , B32B15/015 , C22C9/00 , C22C38/02 , C22C38/44 , C22C38/58 , C30B25/18 , C30B29/06 , C30B29/16 , C30B29/40 , C30B29/52 , C30B33/00 , H01L23/142 , H01L31/03921 , H01L33/007 , H01L2924/0002 , H05K1/0393 , H05K1/09 , H05K3/022 , H05K2201/0355 , H05K2203/1105 , Y02E10/50 , H01L2924/00
摘要： Disclosed is a metal laminated substrate for forming an epitaxial growth film for forming a semiconductor element having high biaxial crystal orientation on a surface of a metal substrate and a method of manufacturing the metal laminated substrate. The manufacturing method includes the steps of activating at least one surface of a metal plate T1 by sputter etching or the like; activating at least one surface of a metal foil T2 made of Cu or a Cu alloy which is cold-rolled at a rolling reduction of 90% or more; laminating the metal plate and the metal foil such that an activated surface of the metal plate and an activated surface of the metal foil face each other in an opposed manner and applying cold rolling to the metal plate and the metal foil which are laminated to each other at a rolling reduction of 10% or less, for example; and biaxially orienting crystals of the metal foil by heat treatment at a temperature of not lower than 150° C. and not higher than 1000° C.
摘要翻译： 公开了一种用于形成用于在金属基板的表面上形成具有高双轴晶体取向的半导体元件的外延生长膜的金属层压基板和制造金属层叠基板的方法。 该制造方法包括通过溅射蚀刻等激活金属板T1的至少一个表面的步骤; 激活由Cu或Cu合金制成的金属箔T2的至少一个表面，其中轧制压下率为90％以上; 层压金属板和金属箔，使得金属板的活化表面和金属箔的活化表面相反地相对地面对并对彼此层压的金属板和金属箔进行冷轧 例如在压下率为10％以下的情况下。 并且在不低于150℃且不高于1000℃的温度下通过热处理将金属箔的晶体双轴取向。
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6.发明申请POLYMER LAMINATE SUBSTRATE FOR FORMATION OF EPITAXIALLY GROWN FILM, AND MANUFACTURING METHOD THEREFOR 审中-公开用于形成外延膜的聚合物层压基板及其制造方法公开(公告)号：US20110290378A1
公开(公告)日：2011-12-01
申请号：US13127869
申请日：2009-10-20
申请人： Hironao Okayama , Kouji Nanbu , Akira Kaneko
发明人： Hironao Okayama , Kouji Nanbu , Akira Kaneko
CPC分类号： C30B1/02 , B32B15/08 , B32B15/20 , B32B27/281 , B32B2255/06 , B32B2255/20 , B32B2307/306 , B32B2307/518 , B32B2307/538 , B32B2307/732 , C22F1/08 , C23C14/562 , C30B1/04 , H01L31/03682 , H01L31/0392 , H01L31/18 , H05K1/0393 , H05K1/09 , H05K3/022 , H05K2201/0355 , H05K2203/1105 , Y02E10/546
摘要： Disclosed are a polymer laminated substrate for forming an epitaxial growth film having a highly-crystal-oriented surface and a method of manufacturing the polymer laminated substrate. The method of manufacturing a polymer laminated substrate for forming an epitaxial growth film includes the steps of: activating at least one surface of a polymer sheet T1; activating at least one surface of a metal foil T2 which is made of Cu or a Cu alloy and is formed by cold rolling at a draft of 90% or more; laminating the polymer sheet and the metal foil such that an activated surface of the polymer sheet and an activated surface of the metal foil face each other in an opposed manner and applying cold rolling to the polymer sheet and the metal foil which are laminated to each other; and biaxially orienting crystals of the metal foil by heat treatment.
摘要翻译： 公开了一种用于形成具有高结晶取向表面的外延生长膜的聚合物层压基板和制造聚合物层压基板的方法。 制造用于形成外延生长膜的聚合物层压基板的方法包括以下步骤：激活聚合物片材T1的至少一个表面; 激活由Cu或Cu合金制成的金属箔T2的至少一个表面，并通过以90％以上的牵伸下的冷轧形成; 层叠聚合物片和金属箔，使得聚合物片的活化表面和金属箔的活化表面以相反的方式彼此面对并对彼此层压的聚合物片和金属箔进行冷轧 ; 并通过热处理将金属箔的晶体双轴取向。
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7.发明授权Hydrogen separation membrane with a carrier, fuel cell and hydrogen separation apparatus having same, and method of manufacturing same 有权具有载体的氢分离膜，具有该载体的燃料电池和氢分离装置及其制造方法公开(公告)号：US09017757B2
公开(公告)日：2015-04-28
申请号：US12083241
申请日：2006-10-25
申请人： Satoshi Aoyama , Yasuhiro Izawa , Kenji Kimura , Shinji Ohsawa , Kazuo Yoshida , Kouji Nanbu
发明人： Satoshi Aoyama , Yasuhiro Izawa , Kenji Kimura , Shinji Ohsawa , Kazuo Yoshida , Kouji Nanbu
CPC分类号： H01M8/0625 , B01D53/228 , B01D67/0062 , B01D69/10 , B01D71/022 , C01B3/505 , H01M4/94 , H01M8/0637 , H01M8/0662 , Y02E60/50 , Y02E60/566 , Y10T29/49108
摘要： A method of manufacturing a hydrogen separation membrane with a carrier is characterized by including a first step of providing, between the hydrogen separation membrane and the carrier that supports the hydrogen separation membrane, a low-hardness metal membrane having a hardness that is lower than the hardness of the hydrogen separation membrane, and a second step of joining the hydrogen separation membrane, the low-hardness metal membrane, and the carrier by a cold joining method. In this case, it is possible to suppress the deformation of the hydrogen separation membrane, the low-hardness metal membrane, and the carrier and, as a result, it is possible to prevent damaging of the hydrogen separation membrane. The adhesion of the contact between the hydrogen separation membrane and the carrier is also improved. The result is that it is not necessary to increase the severity of the cold joining conditions.
摘要翻译： 一种制备具有载体的氢分离膜的方法的特征在于包括：在氢分离膜和支撑氢分离膜的载体之间提供硬度低于所述氢分离膜的低硬度金属膜的第一步骤 氢分离膜的硬度，以及通过冷连接法连接氢分离膜，低硬度金属膜和载体的第二工序。 在这种情况下，可以抑制氢分离膜，低硬度金属膜和载体的变形，结果可以防止氢分离膜的破坏。 氢分离膜和载体之间的接触的粘附性也得到改善。 结果是，不需要增加冷连接条件的严重性。
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8.发明申请公开(公告)号：US20100047648A1
公开(公告)日：2010-02-25
申请号：US12083241
申请日：2006-10-25
申请人： Satoshi Aoyama , Yasuhiro Izawa , Kenji Kimura , Shinji Ohsawa , Kazuo Yoshida , Kouji Nanbu
发明人： Satoshi Aoyama , Yasuhiro Izawa , Kenji Kimura , Shinji Ohsawa , Kazuo Yoshida , Kouji Nanbu
CPC分类号： H01M8/0625 , B01D53/228 , B01D67/0062 , B01D69/10 , B01D71/022 , C01B3/505 , H01M4/94 , H01M8/0637 , H01M8/0662 , Y02E60/50 , Y02E60/566 , Y10T29/49108
摘要： A method of manufacturing a hydrogen separation membrane with a carrier is characterized by including a first step of providing, between the hydrogen separation membrane and the carrier that supports the hydrogen separation membrane, a low-hardness metal membrane having a hardness that is lower than the hardness of the hydrogen separation membrane, and a second step of joining the hydrogen separation membrane, the low-hardness metal membrane, and the carrier by a cold joining method. In this case, it is possible to suppress the deformation of the hydrogen separation membrane, the low-hardness metal membrane, and the carrier and, as a result, it is possible to prevent damaging of the hydrogen separation membrane. The adhesion of the contact between the hydrogen separation membrane and the carrier is also improved. The result is that it is not necessary to increase the severity of the cold joining conditions.
摘要翻译： 一种制备具有载体的氢分离膜的方法的特征在于包括：在氢分离膜和支撑氢分离膜的载体之间提供硬度低于所述氢分离膜的低硬度金属膜的第一步骤 氢分离膜的硬度，以及通过冷连接法连接氢分离膜，低硬度金属膜和载体的第二工序。 在这种情况下，可以抑制氢分离膜，低硬度金属膜和载体的变形，结果可以防止氢分离膜的破坏。 氢分离膜和载体之间的接触的粘附性也得到改善。 结果是，不需要增加冷连接条件的严重性。
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