Artificial pancreas
    1.
    发明授权
    Artificial pancreas 失效
    人造胰腺

    公开(公告)号:US4515584A

    公开(公告)日:1985-05-07

    申请号:US508910

    申请日:1983-06-29

    IPC分类号: A61M5/172 A61J7/00

    CPC分类号: A61M5/1723

    摘要: An artificial pancreas comprising a blood sugar determination unit for measuring the blood sugar of the living body, an injection unit including a container for a blood sugar control agent and a feed pump for the control agent and adapted to inject the control agent into the living body, and an arithmetic control unit for calculating the dose of the control agent based on the blood sugar measurement and controlling the pump of the injection unit in accordance with the result of calculation. The blood sugar determination unit has an electrode assembly to be inserted into the living body for measuring the blood sugar. The feed pump comprises a plurality of rollers rotatably mounted on a rotatable roller holder along the outer periphery of the holder and an elastic tube having an intermediate portion reeved around some of the rollers under tension.

    摘要翻译: 一种人造胰腺,包括用于测量生物体血糖的血糖测定单元,包括用于血糖控制剂的容器的注射单元和用于控制剂的进料泵,并且适于将控制剂注入生物体 以及算术控制单元,其根据血糖测量计算控制剂的剂量,并根据计算结果控制注射单元的泵。 血糖测定单元具有插入生物体中用于测量血糖的电极组件。 进料泵包括沿着保持器的外周可旋转地安装在可旋转辊保持器上的多个辊,以及具有在张力下围绕一些辊周围的中间部分的弹性管。

    Wired circuit board having enhanced contrast between conductive pattern and insulating layer during inspection
    3.
    发明授权
    Wired circuit board having enhanced contrast between conductive pattern and insulating layer during inspection 有权
    有线电路板在检查期间具有增强的导电图案和绝缘层之间的对比度

    公开(公告)号:US09084359B2

    公开(公告)日:2015-07-14

    申请号:US13137300

    申请日:2011-08-04

    申请人: Norihiko Okamoto

    发明人: Norihiko Okamoto

    IPC分类号: H05K3/10 G11B5/48 H05K1/02

    摘要: A method for producing a wired circuit board includes the steps of preparing a metal supporting layer; forming an insulating layer on the metal supporting layer; roughening the surface of the insulating layer; forming a conductive pattern on the insulating layer; and inspecting the presence or absence of a defect of the conductive pattern by using an inspection device provided with a light emitting portion emitting incident light that enters the insulating layer and the conductive pattern and a light receiving portion receiving reflected light that is reflected from the incident light. The incident light has a wavelength in the range of 435 to 500 nm and includes inclined light that inclines so as to form an angle of more than 0° to not more than 30° with respect to the optical axis thereof.

    摘要翻译: 一种制造布线电路板的方法包括制备金属支撑层的步骤; 在金属支撑层上形成绝缘层; 使绝缘层的表面粗糙化; 在绝缘层上形成导电图案; 并且通过使用设置有发射入射到绝缘层和导电图案的入射光的发光部分的检查装置和接收从事件反射的反射光的光接收部分检查导电图案的缺陷的存在或不存在 光。 入射光的波长在435〜500nm的范围内,并且包括相对于其光轴形成大于0°至不大于30°的角度的倾斜光。

    JOINT SYSTEM, SUBSTRATE PROCESSING SYSTEM, AND JOINT METHOD
    4.
    发明申请
    JOINT SYSTEM, SUBSTRATE PROCESSING SYSTEM, AND JOINT METHOD 审中-公开
    接头系统,基板处理系统和接头方法

    公开(公告)号:US20130153116A1

    公开(公告)日:2013-06-20

    申请号:US13818356

    申请日:2011-03-15

    IPC分类号: H01L21/673

    摘要: The present disclosure includes: a joint processing station including a coating unit applying an adhesive to a processing target substrate or a supporting substrate, a first heat processing unit heating the substrates coated with the adhesive, a second heat processing unit heating the substrates to a higher temperature, a reversing unit reversing front and rear surfaces of the substrate, a joint unit joining the processing target substrate and the supporting substrate together by pressing them, and a transfer region for transferring the substrates to the units; and a transfer-in/out station transferring the substrates into/from the joint processing station.

    摘要翻译: 本公开内容包括:联合处理站,包括将涂布单元施加到处理目标基板或支撑基板上的涂布单元,加热涂覆有粘合剂的基板的第一热处理单元,将基板加热到更高的第二加热单元 温度反转单元,反转基板的前表面和后表面;接合单元,其通过压制将加工对象基板和支撑基板接合在一起;以及转印区域,用于将基板转印到单元; 以及将基板传送到/从联合处理站的转入/输出站。

    SEPARATION SYSTEM, SEPARATION METHOD, PROGRAM AND COMPUTER STORAGE MEDIUM
    5.
    发明申请
    SEPARATION SYSTEM, SEPARATION METHOD, PROGRAM AND COMPUTER STORAGE MEDIUM 有权
    分离系统,分离方法,程序和计算机存储介质

    公开(公告)号:US20130146229A1

    公开(公告)日:2013-06-13

    申请号:US13818150

    申请日:2011-03-04

    IPC分类号: H01L21/02

    摘要: The present invention is used for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive into the processing target substrate and the supporting substrate, and includes: a separation processing station performing predetermined processing on the processing target substrate, the supporting substrate, and the superposed substrate; a transfer-in/out station transferring the substrates into/from the separation processing station; and a transfer unit transferring the substrates between the separation processing station and the transfer-in/out station, wherein the separation processing station includes: a separation unit separating the superposed substrate into the processing target substrate and the supporting substrate; a first cleaning unit cleaning the processing target substrate separated in the separation unit; and a second cleaning unit cleaning the supporting substrate separated in the separation unit.

    摘要翻译: 本发明用于将处理对象基板和支撑基板与粘合剂接合在一起的叠加基板分离到处理对象基板和支撑基板中,并且包括:对处理对象进行预定处理的分离处理站 基板,支撑基板和叠置基板; 将基板传送到分离处理站/从分离处理站传送的输入/输出站; 以及转移单元,其在所述分离处理站和所述分离处理站之间传送所述基板,其中所述分离处理站包括:分离单元,将所述叠加的基板分离成所述处理对象基板和所述支撑基板; 清洗分离单元中分离的处理对象基板的第一清洗单元; 以及清洁在分离单元中分离的支撑基板的第二清洁单元。

    Separation system, separation method, program and computer storage medium
    6.
    发明授权
    Separation system, separation method, program and computer storage medium 有权
    分离系统,分离方法,程序和计算机存储介质

    公开(公告)号:US09330898B2

    公开(公告)日:2016-05-03

    申请号:US13818150

    申请日:2011-03-04

    摘要: The present invention is used for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive into the processing target substrate and the supporting substrate, and includes: a separation processing station performing predetermined processing on the processing target substrate, the supporting substrate, and the superposed substrate; a transfer-in/out station transferring the substrates into/from the separation processing station; and a transfer unit transferring the substrates between the separation processing station and the transfer-in/out station, wherein the separation processing station includes: a separation unit separating the superposed substrate into the processing target substrate and the supporting substrate; a first cleaning unit cleaning the processing target substrate separated in the separation unit; and a second cleaning unit cleaning the supporting substrate separated in the separation unit.

    摘要翻译: 本发明用于将处理对象基板和支撑基板与粘合剂接合在一起的叠加基板分离到处理对象基板和支撑基板中,并且包括:对处理对象进行预定处理的分离处理站 基板,支撑基板和叠置基板; 将基板传送到分离处理站/从分离处理站传送的输入/输出站; 以及转移单元,其在所述分离处理站和所述分离处理站之间传送所述基板,其中所述分离处理站包括:分离单元,将所述叠加的基板分离成所述处理对象基板和所述支撑基板; 清洗分离单元中分离的处理对象基板的第一清洗单元; 以及清洁在分离单元中分离的支撑基板的第二清洁单元。

    BONDING SYSTEM, SUBSTRATE PROCESSING SYSTEM, AND BONDING METHOD
    7.
    发明申请
    BONDING SYSTEM, SUBSTRATE PROCESSING SYSTEM, AND BONDING METHOD 审中-公开
    焊接系统,基板加工系统和粘接方法

    公开(公告)号:US20140158303A1

    公开(公告)日:2014-06-12

    申请号:US14131247

    申请日:2012-06-25

    IPC分类号: H01L21/677

    摘要: This bonding system comprises a bonding processing station and a carry in/out station which carries a substrate to be processed, a supporting substrate or a bonded substrate that is obtained by bonding a substrate to be processed and a supporting substrate into/out of the bonding processing station. The bonding processing station comprises a coating device which applies an adhesive to the substrate to be processed or the supporting substrate and a heat treatment device that heats the substrate, to which the adhesive has been applied. In addition, a bonding device turns over one of the substrates, and presses the overturned substrate against the other substrate with an adhesive therebetween, thereby bonding the substrates together. A conveyance region conveys the substrate(s) to the coating device, the heat treatment device and the bonding device.

    摘要翻译: 该接合系统包括接合处理站和承载要处理的基板的承载/输出站,支撑基板或键合基板,其通过将待处理基板和支撑基板接合/接合而获得 加工站。 接合处理站包括对待处理基板或支撑基板施加粘合剂的涂布装置和加热粘合剂已经涂布的基板的热处理装置。 此外,接合装置翻转其中一个基板,并且将翻转的基板以其间的粘合剂压靠在另一个基板上,从而将基板粘合在一起。 输送区域将基板输送到涂布装置,热处理装置和粘合装置。

    Wired circuit board and producing method thereof
    8.
    发明申请
    Wired circuit board and producing method thereof 有权
    有线电路板及其制造方法

    公开(公告)号:US20120055697A1

    公开(公告)日:2012-03-08

    申请号:US13137300

    申请日:2011-08-04

    申请人: Norihiko Okamoto

    发明人: Norihiko Okamoto

    IPC分类号: H05K1/00 H05K3/10

    摘要: A method for producing a wired circuit board includes the steps of preparing a metal supporting layer; forming an insulating layer on the metal supporting layer; roughening the surface of the insulating layer; forming a conductive pattern on the insulating layer; and inspecting the presence or absence of a defect of the conductive pattern by using an inspection device provided with a light emitting portion emitting incident light that enters the insulating layer and the conductive pattern and a light receiving portion receiving reflected light that is reflected from the incident light. The incident light has a wavelength in the range of 435 to 500 nm and includes inclined light that inclines so as to form an angle of more than 0° to not more than 30° with respect to the optical axis thereof.

    摘要翻译: 一种制造布线电路板的方法包括制备金属支撑层的步骤; 在金属支撑层上形成绝缘层; 使绝缘层的表面粗糙化; 在绝缘层上形成导电图案; 并且通过使用设置有发射入射到绝缘层和导电图案的入射光的发光部分的检查装置和接收从事件反射的反射光的光接收部分检查导电图案的缺陷的存在或不存在 光。 入射光的波长在435〜500nm的范围内,并且包括相对于其光轴形成大于0°至不大于30°的角度的倾斜光。

    Lockup control system of automatic transmission

    公开(公告)号:US06780140B2

    公开(公告)日:2004-08-24

    申请号:US10420004

    申请日:2003-04-22

    IPC分类号: F16H6158

    摘要: In a lockup control system of an automatic transmission with a lockup torque converter, a controller pre-stores a predetermined lockup control map including at least a predetermined coast slip lockup area, within which the system executes a slip lockup control mode under the vehicle's coasting condition, so that a speed difference between input and output speeds of the torque converter is brought closer to a predetermined value. The controller determines whether a first transition from the vehicle's driving condition to the predetermined coast slip lockup area occurs in a release mode of the lockup clutch or a second transition from the vehicle's coasting condition to the predetermined coast slip lockup area occurs in the release mode. When the first transition occurs, the lockup clutch is conditioned in the slip lockup control mode. When the second transition occurs, the lockup clutch is conditioned in the release mode.