公开(公告)号：US07129680B2

公开(公告)日：2006-10-31

申请号：US10718306

申请日：2003-11-20

申请人： Hiroshi Higashitani ,  Takeo Yasuho

发明人： Hiroshi Higashitani ,  Takeo Yasuho

IPC分类号： G05F6/613

CPC分类号： H02M3/1582 ,  H02M2001/0032 ,  Y02B70/16

摘要： DC/DC converter includes a voltage converting circuit connected between the input terminal and output terminal, a fast transient response circuit, a step-up and step-down operation determining circuit, a voltage comparator, and a switch control circuit.

摘要翻译： DC / DC转换器包括连接在输入端子和输出端子之间的电压转换电路，快速瞬态响应电路，升压和降压操作确定电路，电压比较器和开关控制电路。

公开(公告)号：US07161371B2

公开(公告)日：2007-01-09

申请号：US10488552

申请日：2003-02-19

申请人： Hiroshi Higashitani ,  Takeo Yasuho ,  Masaaki Hayama

发明人： Hiroshi Higashitani ,  Takeo Yasuho ,  Masaaki Hayama

IPC分类号： G01R31/02

CPC分类号： G01R31/02 ,  G01R31/28 ,  H01L21/4857 ,  H01L21/563 ,  H01L23/49822 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/97 ,  H01L25/0652 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/8114 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/16 ,  H05K1/186 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0723 ,  H05K2203/063 ,  H05K2203/1147 ,  H05K2203/167 ,  H05K2203/171 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A module component which includes circuit substrate 3 having one or more components 1 on at least one of the surfaces, and junction circuit substrate 5 having hollow 4, or hole, disposed corresponding to the portion of the one or more components 1 mounted on the one surface of circuit substrate 3 for fitting the mounted components 1 in. These substrates are laminated to form a single body so that mounted components 1 is contained within the inside. The above configuration ensures high reliability in the layer-to-layer connection, and enables to mount a plurality of components densely with a high dimensional accuracy. Thus a highly reliable compact module component is offered.

摘要翻译： 一种模块部件，其包括在至少一个表面上具有一个或多个部件1的电路基板3，以及具有中空部分4或孔的接合电路基板5，其对应于安装在一个或多个部件上的一个或多个部件1的部分 用于安装安装部件1的电路基板3的表面。这些基板被层压以形成单体，使得安装的部件1被包含在内部。 上述配置确保了层间连接的高可靠性，并且能够以高尺寸精度密集地安装多个部件。 因此，提供了高度可靠的紧凑型模块组件。

公开(公告)号：US07423418B2

公开(公告)日：2008-09-09

申请号：US11650976

申请日：2007-01-09

申请人： Hiroshi Higashitani ,  Takeo Yasuho ,  Masaki Hayama

发明人： Hiroshi Higashitani ,  Takeo Yasuho ,  Masaki Hayama

IPC分类号： G01R31/28

CPC分类号： G01R31/02 ,  G01R31/28 ,  H01L21/4857 ,  H01L21/563 ,  H01L23/49822 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/97 ,  H01L25/0652 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/8114 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/16 ,  H05K1/186 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0723 ,  H05K2203/063 ,  H05K2203/1147 ,  H05K2203/167 ,  H05K2203/171 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A module component which includes circuit substrate 3 having one or more components 1 on at least one of the surfaces, and junction circuit substrate 5 having hollow 4, or hole, disposed corresponding to the portion of the one or more components 1 mounted on the one surface of circuit substrate 3 for fitting the mounted components 1 in. These substrates are laminated to form a single body so that mounted components 1 is contained within the inside. The above configuration ensures high reliability in the layer-to-layer connection, and enables to mount a plurality of components densely with a high dimensional accuracy. Thus a highly reliable compact module component is offered.

摘要翻译： 一种模块部件，其包括在至少一个表面上具有一个或多个部件1的电路基板3，以及具有中空部分4或孔的接合电路基板5，其对应于安装在一个或多个部件上的一个或多个部件1的部分 用于安装安装部件1的电路基板3的表面。这些基板被层压以形成单体，使得安装的部件1被包含在内部。 上述配置确保了层间连接的高可靠性，并且能够以高尺寸精度密集地安装多个部件。 因此提供了高度可靠的紧凑型模块组件。

公开(公告)号：US20050017740A1

公开(公告)日：2005-01-27

申请号：US10488552

申请日：2003-02-19

申请人： Hiroshi Higashitani ,  Takeo Yasuho ,  Masaaki Hayama

发明人： Hiroshi Higashitani ,  Takeo Yasuho ,  Masaaki Hayama

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H05K1/18 ,  H05K3/46 ,  G01R31/02

CPC分类号： G01R31/02 ,  G01R31/28 ,  H01L21/4857 ,  H01L21/563 ,  H01L23/49822 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/97 ,  H01L25/0652 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/8114 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/16 ,  H05K1/186 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0723 ,  H05K2203/063 ,  H05K2203/1147 ,  H05K2203/167 ,  H05K2203/171 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A module component which includes circuit substrate 3 having one or more components 1 on at least one of the surfaces, and junction circuit substrate 5 having hollow 4, or hole, disposed corresponding to the portion of the one or more components 1 mounted on the one surface of circuit substrate 3 for fitting the mounted components 1 in. These substrates are laminated to form a single body so that mounted components 1 is contained within the inside. The above configuration ensures high reliability in the layer-to-layer connection, and enables to mount a plurality of components densely with a high dimensional accuracy. Thus a highly reliable compact module component is offered.

摘要翻译： 一种模块部件，其包括在至少一个表面上具有一个或多个部件1的电路基板3，以及具有中空部分4或孔的接合电路基板5，其对应于安装在一个或多个部件上的一个或多个部件1的部分 用于安装安装部件1的电路基板3的表面。这些基板被层压以形成单体，使得安装的部件1被包含在内部。 上述配置确保了层间连接的高可靠性，并且能够以高尺寸精度密集地安装多个部件。 因此，提供了高度可靠的紧凑模块组件。

公开(公告)号：US20070182000A1

公开(公告)日：2007-08-09

申请号：US11650976

申请日：2007-01-09

申请人： Hiroshi Higashitani ,  Takeo Yasuho ,  Masaaki Hayama

发明人： Hiroshi Higashitani ,  Takeo Yasuho ,  Masaaki Hayama

IPC分类号： H01L23/34

CPC分类号： G01R31/02 ,  G01R31/28 ,  H01L21/4857 ,  H01L21/563 ,  H01L23/49822 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/97 ,  H01L25/0652 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/8114 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/16 ,  H05K1/186 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0723 ,  H05K2203/063 ,  H05K2203/1147 ,  H05K2203/167 ,  H05K2203/171 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A module component which includes circuit substrate 3 having one or more components 1 on at least one of the surfaces, and junction circuit substrate 5 having hollow 4, or hole, disposed corresponding to the portion of the one or more components 1 mounted on the one surface of circuit substrate 3 for fitting the mounted components 1 in. These substrates are laminated to form a single body so that mounted components 1 is contained within the inside. The above configuration ensures high reliability in the layer-to-layer connection, and enables to mount a plurality of components densely with a high dimensional accuracy. Thus a highly reliable compact module component is offered.

摘要翻译： 一种模块部件，其包括在至少一个表面上具有一个或多个部件1的电路基板3，以及具有中空部分4或孔的接合电路基板5，其对应于安装在一个或多个部件上的一个或多个部件1的部分 用于安装安装部件1的电路基板3的表面。这些基板被层压以形成单体，使得安装的部件1被包含在内部。 上述配置确保了层间连接的高可靠性，并且能够以高尺寸精度密集地安装多个部件。 因此，提供了高度可靠的紧凑型模块组件。

公开(公告)号：US5535244A

公开(公告)日：1996-07-09

申请号：US252902

申请日：1994-06-02

申请人： Etsuto Nakatsu ,  Hiroshi Higashitani ,  Haruo Ohta

发明人： Etsuto Nakatsu ,  Hiroshi Higashitani ,  Haruo Ohta

IPC分类号： H04L27/38 ,  H04L5/12

CPC分类号： H04L27/3836

摘要： A digital modulating/demodulating apparatus includes a demodulator for demodulating a modulated signal into a demodulated positional signal in response to a receipt of the modulated signal, a decoder for decoding the demodulated positional signal into a digital signal of N bits. A previous signal point on the constellation plane is defined by a previous demodulated positional signal and a current signal point on the constellation plane is defined by a current demodulated positional signal. The decoder outputs a digital signal of N bits, based on en amplitude and a phase of the previous signal point and the amplitude and the phase of the current signal point.

摘要翻译： 数字调制/解调装置包括：解调器，用于响应于调制信号的接收，将调制信号解调为解调位置信号;解码器，用于将解调的位置信号解码为N位数字信号。 星座平面上的先前信号点由先前解调的位置信号定义，并且星座平面上的当前信号点由电流解调的位置信号定义。 解码器基于先前信号点的振幅和相位以及当前信号点的幅度和相位输出N位的数字信号。

公开(公告)号：US20090154067A1

公开(公告)日：2009-06-18

申请号：US12368569

申请日：2009-02-10

申请人： Junichi Kurita ,  Kenji Kuranuki ,  Youichi Aoshima ,  Hiroshi Higashitani ,  Tsuyoshi Yoshino

发明人： Junichi Kurita ,  Kenji Kuranuki ,  Youichi Aoshima ,  Hiroshi Higashitani ,  Tsuyoshi Yoshino

IPC分类号： H01G9/00

CPC分类号： H01G9/012 ,  H01F17/0006 ,  H01F27/40 ,  H01G9/14 ,  H01G9/28 ,  H03H1/0007 ,  H03H2001/0085

摘要： A chip-type filter has a laminated body formed by stacking a plurality of capacitor elements, a pair of positive electrode terminals, a pair of negative electrode terminals, insulating outer resin, and an inductor section. The laminated body includes capacitor elements in a first group and capacitor elements in a second group, the positive electrode sections in both groups are disposed on the opposite sides with respect to the negative electrode sections. Positive electrode terminals are electrically connected to the positive electrode sections of capacitor elements in the first group and those of capacitor elements in the second group, respectively. Negative electrode terminals are electrically connected to the negative electrode sections in the laminated body, and are disposed at both ends of the direction crossing the connecting direction between the positive electrode terminals. The inductor section is insulated from the negative electrode sections and couples the positive electrode terminals.

摘要翻译： 芯片型滤波器具有通过堆叠多个电容器元件，一对正极端子，一对负极端子，绝缘外部树脂和电感器部分而形成的层叠体。 层叠体包括第一组中的电容器元件和第二组中的电容器元件，两组中的正极部分相对于负极部分设置在相对侧上。 正极端子分别电连接到第一组中的电容器元件的正极部分和第二组中的电容器元件的正极部分。 负极端子与层叠体中的负极部电连接，并且配置在与正极端子之间的连接方向交叉的方向的两端。 电感器部分与负极部分绝缘并连接正极端子。

公开(公告)号：US07839151B2

公开(公告)日：2010-11-23

申请号：US11885944

申请日：2006-04-18

申请人： Junichi Kurita ,  Hiroshi Higashitani ,  Kazuo Kawahito ,  Tsuyoshi Yoshino

发明人： Junichi Kurita ,  Hiroshi Higashitani ,  Kazuo Kawahito ,  Tsuyoshi Yoshino

IPC分类号： G01R31/12

CPC分类号： G01R31/028 ,  G01R27/28 ,  H01G9/04 ,  H01G9/15 ,  H01G13/00

摘要： A capacitor inspection device includes a substrate made of an insulating material, a first conductor unit and a second conductor unit arranged on the substrate, a signal input unit and a signal output unit attached to the substrate, a network analyzer and a pressurizing unit. The network analyzer has an input port connected to the signal input unit and an output port connected to the signal output unit. The first and second conductor units make contact with an anode and a cathode of a capacitor, respectively. The pressurizing unit presses the anode of capacitor onto the first conductor unit and the cathode onto the second conductor unit.

摘要翻译： 电容器检查装置包括由绝缘材料制成的基板，布置在基板上的第一导体单元和第二导体单元，附接到基板的信号输入单元和信号输出单元，网络分析器和加压单元。 网络分析仪具有连接到信号输入单元的输入端口和连接到信号输出单元的输出端口。 第一和第二导体单元分别与电容器的阳极和阴极接触。 加压单元将电容器的阳极压在第一导体单元上并将阴极压到第二导体单元上。

公开(公告)号：US07800462B2

公开(公告)日：2010-09-21

申请号：US12404999

申请日：2009-03-16

申请人： Junichi Kurita ,  Kenji Kuranuki ,  Youichi Aoshima ,  Hiroshi Higashitani ,  Tsuyoshi Yoshino

发明人： Junichi Kurita ,  Kenji Kuranuki ,  Youichi Aoshima ,  Hiroshi Higashitani ,  Tsuyoshi Yoshino

IPC分类号： H03H7/00 ,  H01G9/04

CPC分类号： H05K1/0231 ,  H01G9/012 ,  H01G9/28 ,  H05K1/165 ,  H05K2201/09772 ,  H05K2201/10015

摘要： A printed board is mounted with a chip-type solid electrolytic capacitor of a four-terminal structure where a pair of positive electrode terminals are disposed at opposite positions and a pair of negative electrode terminals are disposed at opposite positions on a mounting surface. The printed board has a pair of positive electrode patterns and a pair of negative electrode patterns to which the positive electrode terminals and negative electrode terminals of the chip-type solid electrolytic capacitor are connected, respectively. The printed board further has an inductor section that is insulated from the negative electrode patterns, and electrically connects the positive electrode patterns.

摘要翻译： 印刷电路板安装有四端结构的芯片式固体电解电容器，其中一对正电极端子设置在相对位置，一对负电极端子设置在安装表面上的相对位置。 印刷电路板分别具有一对正电极图案和一对负电极图案，芯片型固体电解电容器的正极端子和负极端子分别连接到负极图案。 印刷电路板还具有与负电极图案绝缘的电感器部分，并且电连接正电极图案。

公开(公告)号：US07612987B2

公开(公告)日：2009-11-03

申请号：US12368569

申请日：2009-02-10

申请人： Junichi Kurita ,  Kenji Kuranuki ,  Youichi Aoshima ,  Hiroshi Higashitani ,  Tsuyoshi Yoshino

发明人： Junichi Kurita ,  Kenji Kuranuki ,  Youichi Aoshima ,  Hiroshi Higashitani ,  Tsuyoshi Yoshino

IPC分类号： H01G9/00

CPC分类号： H01G9/012 ,  H01F17/0006 ,  H01F27/40 ,  H01G9/14 ,  H01G9/28 ,  H03H1/0007 ,  H03H2001/0085

摘要： A chip-type filter has a laminated body formed by stacking a plurality of capacitor elements, a pair of positive electrode terminals, a pair of negative electrode terminals, insulating outer resin, and an inductor section. The laminated body includes capacitor elements in a first group and capacitor elements in a second group, the positive electrode sections in both groups are disposed on the opposite sides with respect to the negative electrode sections. Positive electrode terminals are electrically connected to the positive electrode sections of capacitor elements in the first group and those of capacitor elements in the second group, respectively. Negative electrode terminals are electrically connected to the negative electrode sections in the laminated body, and are disposed at both ends of the direction crossing the connecting direction between the positive electrode terminals. The inductor section is insulated from the negative electrode sections and couples the positive electrode terminals.

摘要翻译： 芯片型滤波器具有通过堆叠多个电容器元件，一对正极端子，一对负极端子，绝缘外部树脂和电感器部分而形成的层叠体。 层叠体包括第一组中的电容器元件和第二组中的电容器元件，两组中的正极部分相对于负极部分设置在相对侧上。 正极端子分别电连接到第一组中的电容器元件的正极部分和第二组中的电容器元件的正极部分。 负极端子与层叠体中的负极部电连接，并且配置在与正极端子之间的连接方向交叉的方向的两端。 电感器部分与负极部分绝缘并连接正极端子。