摘要:
A sputtering apparatus including a target holder configured to hold at least two targets; a substrate holder configured to hold a substrate; a first shutter plate arranged between the target holder and the substrate holder, the first shutter plate having at least two holes and being capable of rotating around an axis; a second shutter plate arranged between the first shutter plate and the substrate holder, the second shutter plate having at least two holes and being capable of rotating around the axis; wherein the first and second shutter plates are rotated such that paths are simultaneously created between the at least two targets and the substrate through the at least two holes of the rotated first shutter plate and the at least two holes of the rotated second shutter plate, and a film is formed on the substrate by co-sputtering of the at least two targets.
摘要:
HfO2 films and ZrO2 films are currently being developed for use as capacitor dielectric films in 85 nm technology node DRAM. However, these films will be difficult to use in 65 nm technology node or later DRAM, since they have a relative dielectric constant of only 20-25. The dielectric constant of such films may be increased by stabilizing their cubic phase. However, this results in an increase in the leakage current along the crystal grain boundaries, which makes it difficult to use these films as capacitor dielectric films. To overcome this problem, the present invention dopes a base material of HfO2 or ZrO2 with an oxide of an element having a large ion radius, such as Y or La, to increase the oxygen coordination number of the base material and thereby increase its relative dielectric constant to 30 or higher even when the base material is in its amorphous state. Thus, the present invention provides dielectric films that can be used to form DRAM capacitors that meet the 65 nm technology node or later.
摘要:
To achieve a higher operating speed, higher reliability, and lower power consumption by reducing the thickness of an inter-poly silicon insulator film between a floating gate and a control gate of a flash memory, a silicon dioxide film, a silicon nitride film, tantalum pentoxide, and a silicon dioxide film are formed in a multilayer structure to serve as the inter-poly insulator film between a floating gate and a control gate. With this configuration, tantalum pentoxide formed on the silicon nitride film has a dielectric constant of 50 or more, which is higher than that of the silicon dioxide film, and the thickness of the inter-poly silicon insulator film can be reduced.
摘要:
It is an object of the present invention to provide a fine memory cell structure preventing a reaction between an interlayer insulating film and a ferroelectric film and suitable for high integration. According to the invention, there is provided a structure in which a reaction barrier film 43 is interposed between a ferroelectric film 71 and an interlayer insulating film 32 and side walls of a diffusion barrier film 51 are not brought into direct contact with the ferroelectric film 71. Thereby, the reaction between the interlayer insulating film 32 and the ferroelectric film 71 can be restrained and exfoliation of the ferroelectric film 71 can be prevented.
摘要:
A semiconductor device includes a capacitor having a lower electrode (102), a high-dielectric-constant or ferroelectric thin film (103), and an upper electrode (104) which are subsequently stacked. An impurity having an action of suppressing the catalytic activity of a metal or a conductive oxide constituting the electrode is added to the upper electrode (104). The addition of the impurity is effective to prevent inconveniences such as a reduction in capacitance, an insulation failure, and the peeling of the electrode due to hydrogen heat-treatment performed after formation of the upper electrode (104), and to improve the long-term reliability.
摘要:
A semiconductor integrated circuit in which the storage capacitor has an increased capacitance and a decreased leakage current. The storage capacitor is formed by the steps of: forming a polysilicon bottom electrode having semispherical silicon crystals formed thereon; performing plasma nitriding on the surface of said bottom electrode at a temperature lower than 550° C., thereby forming a film of silicon nitride having a film thickness smaller than 1.5 nm; and depositing a film of amorphous tantalum pentoxide and then crystallizing said amorphous tantalum pentoxide. The silicon nitride film has improved resistance to oxidation and also has a reduced leakage current. As a result, the polysilicon bottom electrode becomes resistant to oxidation and the storage capacitor increases in capacitance and decreases in leakage current.
摘要:
A diffusion preventive layer extending between the bottom surface of a lower electrode and an interconnection connecting the lower electrode to one of the diffusion layer of a switching transistor is self-aligned. As a result, side trench is produced since a hole pattern is formed by using a dummy film, and even if a contact plug of a memory section is misaligned with the diffusion preventive layer, the contact plug is out of direct contact with a dielectric film having a high permittivity. Hence, a highly reliable device can be obtained.
摘要:
A semiconductor device having a bottom electrode, a ferroelectric film, and a top electrode formed on a semiconductor substrate, wherein the angle of each of the main cross sectional sides of the ferroelectric film relative to the main surface of the semiconductor substrate is less than 75 degrees. Forming the ferroelectric film into the trapezoid in cross section having such an angle provides a microscopic capacitor without electrical short-circuit between the top and bottom electrodes if the top electrode, the ferroelectric film, and the bottom electrode are etched with single photolithography process step. The novel technique implements a microscopic memory cell structure suitable for highly integrated memory devices.
摘要:
An ac/dc converting circuit adapted to output a direct voltage that is higher than a full wave rectified voltage of an alternating input voltage is provided which includes an alternating current filter, and a condenser with a positive electrode and a negative electrode coupled to a dc output side of a full wave rectifying circuit. The full wave rectifying circuit includes a switching portion having upper and lower arms each having a semiconductor rectifying element and a self-commutated semiconductor switching element, and a rectifying portion having upper and lower arms each having a semiconductor rectifying element. The semiconductor rectifying elements in the upper arms of the full wave rectifying circuit has a common cathode coupled to the positive electrode, and the semiconductor rectifying elements in the lower arms has a common anode coupled to the negative electrode. The ac/dc converting circuit further includes a resistor provided between a coupling point of the rectifying elements of the upper arms of the full wave rectifying circuit and the negative electrode. In operation, a signal for controlling an ON/OFF state of the switching element of the lower arm of the switching portion is generated while the switching element of its upper arm is in an OFF state, when the direct output voltage is higher than the input alternating voltage, and a voltage at an ac input terminal between the rectifying elements of the switching portion is lower than a voltage at an ac input terminal between the rectifying elements of the rectifying portion.
摘要:
A positioning control system is used to control the stoppage of a conveyed article stably and with good repeatability with a magnetic conveyor system element on the receiving side when a conveyed article is passed between magnetic conveyor device elements in a noncontacting magnetic conveyor system configured from at least two magnetic conveyor system elements. The system comprises two independently operating magnetic conveyor system elements, and is provided with drive shafts 18A-18C, each of which has helical magnetic poles at its surface, and a guide path 14 along which a carrier 13 travels, and the carrier is equipped with magnetic poles of equal pitch to the pitch of the helical magnetic poles. When the rotary shafts rotate, the carrier moves over the guide path by a magnetic coupling action and is passed between the magnetic conveyor system elements. The system further includes a rotation angle sensor 34 which senses a specific rotation angle of the drive shaft, a position check sensor 35 which senses the reception of the carrier, and control units 32A and 32B which position the carrier when the sensing of both sensors 34, 35 has been performed synchronously.