公开(公告)号：US5314954A

公开(公告)日：1994-05-24

申请号：US997367

申请日：1992-12-23

申请人： Hiroshi Ohishi ,  Shinji Inaba ,  Masao Kimura ,  Koichi Fujishiro ,  Masanao Kawabe ,  Takumi Tanaka ,  Keizo Kyuda ,  Souichiro Kishimoto ,  Takamasa Owaki ,  Akio Motoyama

发明人： Hiroshi Ohishi ,  Shinji Inaba ,  Masao Kimura ,  Koichi Fujishiro ,  Masanao Kawabe ,  Takumi Tanaka ,  Keizo Kyuda ,  Souichiro Kishimoto ,  Takamasa Owaki ,  Akio Motoyama

IPC分类号： C08F8/14 ,  C08G63/00 ,  C08F293/00

CPC分类号： C08G63/00 ,  C08F8/14 ,  C08F2810/40

摘要： A process is disclosed for preparing of aromatic polyester-polystyrene block copolymers which comprises subjecting preferentially styrene polymers (A) having terminal functional groups reactive with acid chloride groups and an excess of aromatic dicarboxylic acid dihalides (C) to condensation and then subjecting continuously the resultant mixture and aromatic dihydroxy compounds (B) to interfacial polymerization at the ratio (A)/[(B)+(C)] by weight of 5/95 to 80/20, without separating reaction products of styrene polymers (A) and aromatic dicarboxylic acid dihalides (C), and the block copolymers thus prepared contain a small amount of uncopolymerized styrene polymers, have long aromatic polyester segments, show low birefringence, good transparency, exceptionally low birefringence, low melt viscosity, and good mechanical strength, and are particularly useful as materials for optical instruments.

摘要翻译： 公开了用于制备芳族聚酯 - 聚苯乙烯嵌段共聚物的方法，其包括使具有与酰氯基团反应的末端官能团的苯乙烯聚合物（A）和过量的芳族二羧酸二卤化物（C）进行缩合，然后连续地使所得 混合物和芳族二羟基化合物（B）以5/95至80/20的重量比（A）/ [（B）+（C））的比例进行界面聚合，而不分离苯乙烯聚合物（A）和芳族化合物 二羧酸二卤化物（C），并且由此制备的嵌段共聚物含有少量未聚合的苯乙烯聚合物，具有长的芳族聚酯链段，显示低双折射，良好的透明性，特别低的双折射，低熔体粘度和良好的机械强度，并且 特别适用于光学仪器的材料。

公开(公告)号：US5256735A

公开(公告)日：1993-10-26

申请号：US774984

申请日：1991-10-17

申请人： Hiroshi Ohishi ,  Masao Kimura ,  Shinji Inaba ,  Masanao Kawabe

发明人： Hiroshi Ohishi ,  Masao Kimura ,  Shinji Inaba ,  Masanao Kawabe

IPC分类号： C08G63/00 ,  C08G63/81

CPC分类号： C08G63/00

摘要： A process is disclosed for the preparation of aromatic polyester-polystyrene block copolymers by solution polycondensation of styrene polymers (A) having terminal functional groups reactive with acid halide or hydroxyl groups, aromatic dihydroxy compounds (B), and aromatic dicarboxylic acid dihalides (C) at (A)/[(B)+(C)] (by weight) of 5/95 to 80/20 and the polymers are suitable as molding materials for optical instruments for their good transparency, particularly low birefringence, low melt viscosity, and good mechanical strength.

公开(公告)号：US06780502B2

公开(公告)日：2004-08-24

申请号：US10261625

申请日：2002-10-02

申请人： Shinji Inaba ,  Koji Nakamura ,  Koichi Fujishiro ,  Kazuhiko Mizuuchi

发明人： Shinji Inaba ,  Koji Nakamura ,  Koichi Fujishiro ,  Kazuhiko Mizuuchi

IPC分类号： B32B2718

CPC分类号： H05K3/4661 ,  B32B7/06 ,  C08L63/10 ,  G03F7/0047 ,  G03F7/032 ,  G03F7/038 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K3/0023 ,  H05K3/184 ,  H05K3/287 ,  H05K2201/0133 ,  H05K2201/0212 ,  H05K2203/066 ,  H05K2203/0793 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/31511 ,  Y10T428/31786 ,  Y10T428/31794 ,  C08L2666/02 ,  H01L2924/00

摘要： This invention relates to an insulating resin composition which exhibits high impact resistance and heat resistance and good adhesiveness to the plating metal, is selectively etchable by a permanganate salt commonly used in a plating operation and suited for an insulating layer in multilayer wiring boards. The insulating resin composition is a photo-polymerizable or thermally polymerizable resin composition comprising 3-10 parts by weight of a crosslinked elastic polymer per 100 parts by weight of a resin component (excluding the crosslinked elastic poly and including monomers) and said crosslinked elastic polymer has carboxyl groups and is dispersed with an average secondary particle diameter in the range of 0.5-2 &mgr;m.

摘要翻译： 本发明涉及一种具有高耐冲击性和耐热性以及对电镀金属具有良好粘合性的绝缘树脂组合物，可以通过电镀操作中常用的适用于多层布线板中绝缘层的高锰酸盐进行选择性蚀刻。 绝缘性树脂组合物为光聚合性或热聚合性树脂组合物，其含有相对于每100重量份树脂成分（不包括交联弹性聚合物和单体）和所述交联弹性聚合物3〜10重量份的交联弹性聚合物 具有羧基并以0.5-2μm的平均二次粒径分散。

公开(公告)号：US20050173809A1

公开(公告)日：2005-08-11

申请号：US11038299

申请日：2005-01-19

申请人： Yukihiro Yamamoto ,  Keiji Iwata ,  Yukio Sasaki ,  Kohei Tatsumi ,  Vivek Dutta ,  Tomofumi Jin ,  Koji Nakamura ,  Shinji Inaba

发明人： Yukihiro Yamamoto ,  Keiji Iwata ,  Yukio Sasaki ,  Kohei Tatsumi ,  Vivek Dutta ,  Tomofumi Jin ,  Koji Nakamura ,  Shinji Inaba

IPC分类号： H01L23/12 ,  H01L21/48 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/48 ,  H01L23/485

CPC分类号： H01L24/05 ,  H01L21/56 ,  H01L23/293 ,  H01L23/3114 ,  H01L24/03 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/0401 ,  H01L2224/05001 ,  H01L2224/0554 ,  H01L2224/11334 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/1148 ,  H01L2224/11901 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1316 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/1146

摘要： This invention is aimed at providing a wafer-level package which is capable of relaxing the stress in a chip-size package and exalting the reliability of the operation of mounting on a printed board and a method for the production thereof. This invention is directed toward a wafer-level package of a semiconductor substrate possessed of either or both of an electrode part and a wiring layer connected to an electrode part, which is provided on the semiconductor substrate with an insulating layer formed mainly of a fluorene skeleton-containing resin and on the electrode part with one step or a plurality of steps of posts, and on the posts with bumps formed of electroconductive balls and a method for the production thereof.

摘要翻译： 本发明的目的在于提供一种晶片级封装，其能够缓解芯片尺寸封装中的应力，并提高安装在印刷电路板上的操作的可靠性及其制造方法。 本发明涉及一种具有电极部分和与电极部分连接的布线层中的任一者或两者的半导体基板的晶片级封装，该半导体基板设置在主要由芴骨架形成的绝缘层的半导体基板上 并且在具有一步或多个台阶的电极部分上，以及在由导电球形成的凸起的柱上和其制造方法之间。