公开(公告)号：US08567384B2

公开(公告)日：2013-10-29

申请号：US12449484

申请日：2008-01-24

申请人： Hiroshi Oishi ,  Koji Kitagawa ,  Hideo Kudo

发明人： Hiroshi Oishi ,  Koji Kitagawa ,  Hideo Kudo

IPC分类号： B28D1/08

CPC分类号： B28D5/0064 ,  B28D5/0076 ,  B28D5/045

摘要： The invention is directed to a method for slicing an ingot in the form of a wafer by winding a wire around a plurality of grooved rollers and pressing the wire against the ingot while making the wire travel and supplying slicing slurry to the grooved rollers, in which when the ingot is sliced, an amount of displacement of the ingot changing in an axial direction is measured and an amount of axial displacement of the grooved rollers is controlled so as to correspond to the measured amount of axial displacement of the ingot, and thereby, the ingot is sliced while controlling a relative position of the wire relative to an entire length of the ingot changing in the axial direction. As a result, a slicing method and a wire saw apparatus are provided that can perform slicing in such a way that a Bow or a Warp in a wafer obtained by slicing can be reduced, for example, by controlling a slicing path built into an ingot so that, in particular, the slicing path becomes flattened.

摘要翻译： 本发明涉及一种用于通过将线缠绕在多个带槽辊上并将线压在锭上并将线移动并将切片浆料供应到带槽辊的方法来切割晶片形式的方法，其中 当锭被切片时，测量锭在轴向上变化的位移量，并且控制带槽辊的轴向位移量，以便对应于测量的锭的轴向位移量，从而， 在控制线相对于锭的整个长度在轴向方向上的相对位置的同时对锭进行切片。 结果，提供了一种切片方法和线锯装置，其可以执行切片，使得可以通过例如通过控制内置在锭中的切片路径来减少通过切片获得的晶片中的弓或翘曲 使得特别是切片路径变平。

公开(公告)号：US20100089377A1

公开(公告)日：2010-04-15

申请号：US12449484

申请日：2008-01-24

申请人： Hiroshi Oishi ,  Koji Kitagawa ,  Hideo Kudo

发明人： Hiroshi Oishi ,  Koji Kitagawa ,  Hideo Kudo

IPC分类号： B28D1/06 ,  B28D1/08

CPC分类号： B28D5/0064 ,  B28D5/0076 ,  B28D5/045

摘要： The invention is directed to a method for slicing an ingot in the form of a wafer by winding a wire around a plurality of grooved rollers and pressing the wire against the ingot while making the wire travel and supplying slicing slurry to the grooved rollers, in which when the ingot is sliced, an amount of displacement of the ingot changing in an axial direction is measured and an amount of axial displacement of the grooved rollers is controlled so as to correspond to the measured amount of axial displacement of the ingot, and thereby, the ingot is sliced while controlling a relative position of the wire relative to an entire length of the ingot changing in the axial direction. As a result, a slicing method and a wire saw apparatus are provided that can perform slicing in such a way that a Bow or a Warp in a wafer obtained by slicing can be reduced, for example, by controlling a slicing path built into an ingot so that, in particular, the slicing path becomes flattened.

摘要翻译： 本发明涉及一种用于通过将线缠绕在多个带槽辊上并将线压在锭上并将线移动并将切片浆料供应到带槽辊的方法来切割晶片形式的方法，其中 当锭被切片时，测量锭在轴向上变化的位移量，并且控制带槽辊的轴向位移量，以便对应于测量的锭的轴向位移量，从而， 在控制线相对于锭的整个长度在轴向方向上的相对位置的同时对锭进行切片。 结果，提供了一种切片方法和线锯装置，其可以执行切片，使得可以通过例如通过控制内置在锭中的切片路径来减少通过切片获得的晶片中的弓或翘曲 使得特别是切片路径变平。

公开(公告)号：US08454410B2

公开(公告)日：2013-06-04

申请号：US12449400

申请日：2008-01-29

申请人： Koji Kitagawa ,  Junichi Ueno ,  Syuichi Kobayashi ,  Hideo Kudo ,  Tadakazu Miyashita ,  Atsushi Kajikura ,  Yoshinobu Nishimoto

发明人： Koji Kitagawa ,  Junichi Ueno ,  Syuichi Kobayashi ,  Hideo Kudo ,  Tadakazu Miyashita ,  Atsushi Kajikura ,  Yoshinobu Nishimoto

IPC分类号： B24B29/00

CPC分类号： B24B37/015 ,  B24B37/08 ,  B24B55/06

摘要： Provided is a polishing apparatus comprising a lower stool (12), a motor (18a) and a speed reducer (19a) for driving the lower stool, and a box (17) for covering at least the portion of the lower stool below the working action face. The polishing apparatus polishes a wafer by forcing the wafer to contact the lower stool and by rotating the lower stool. The box has its inside separated by partitions (31a and 31b) into a plurality of regions, and the motor for driving the lower stool is arranged in a region other than the region containing the lower stool. The polishing apparatus can manufacture a wafer of a stable shape, irrespective of the time elapsed from the running start and the presence/absence of the stop of the polishing apparatus.

摘要翻译： 本发明提供一种抛光装置，其包括下部凳子（12），用于驱动下部凳子的电动机（18a）和减速器（19a）以及用于至少覆盖下部工作部分的下部凳子的箱体（17） 动作面。 抛光装置通过迫使晶片接触下粪和旋转下粪来抛光晶片。 箱体的内部由隔板（31a和31b）分隔成多个区域，并且用于驱动下部便器的电动机布置在除了包含下部凳子的区域以外的区域中。 抛光装置可以制造具有稳定形状的晶片，而与运行开始所经过的时间和抛光装置的停止的存在/不存在无关。

公开(公告)号：US20100144249A1

公开(公告)日：2010-06-10

申请号：US12449400

申请日：2008-01-29

申请人： Koji Kitagawa ,  Junichi Ueno ,  Syuichi Kobayashi ,  Hideo Kudo ,  Tadakazu Miyashita ,  Atsushi Kajikura ,  Yoshinobu Nishimoto

发明人： Koji Kitagawa ,  Junichi Ueno ,  Syuichi Kobayashi ,  Hideo Kudo ,  Tadakazu Miyashita ,  Atsushi Kajikura ,  Yoshinobu Nishimoto

IPC分类号： B24B7/17 ,  B24B7/20 ,  B24B41/06 ,  B24B55/00 ,  B24B47/00

CPC分类号： B24B37/015 ,  B24B37/08 ,  B24B55/06

摘要： Provided is a polishing apparatus comprising a lower stool (12), a motor (18a) and a speed reducer (19a) for driving the lower stool, and a box (17) for covering at least the portion of the lower stool below the working action face. The polishing apparatus polishes a wafer by forcing the wafer to contact the lower stool and by rotating the lower stool. The box has its inside separated by partitions (31a and 31b) into a plurality of regions, and the motor for driving the lower stool is arranged in a region other than the region containing the lower stool. The polishing apparatus can manufacture a wafer of a stable shape, irrespective of the time elapsed from the running start and the presence/absence of the stop of the polishing apparatus.

摘要翻译： 本发明提供一种抛光装置，其包括下部凳子（12），用于驱动下部凳子的电动机（18a）和减速器（19a）以及用于至少覆盖下部工作部分的下部凳子的箱体（17） 动作面。 抛光装置通过迫使晶片接触下粪和旋转下粪来抛光晶片。 箱体的内部由隔板（31a和31b）分隔成多个区域，并且用于驱动下部便器的电动机布置在除了包含下部凳子的区域以外的区域中。 抛光装置可以制造具有稳定形状的晶片，而与运行开始所经过的时间和抛光装置的停止的存在/不存在无关。

公开(公告)号：US20100258103A1

公开(公告)日：2010-10-14

申请号：US12734452

申请日：2008-12-01

申请人： Koji Kitagawa

发明人： Koji Kitagawa

IPC分类号： B28D5/04 ,  B28D7/00

CPC分类号： B28D5/045 ,  B24B27/0633 ,  B28D5/0064 ,  B28D5/007 ,  Y02P70/179

摘要： The present invention is a wire saw in which a wire is wound around a plurality of grooved rollers, the workpiece is sliced into wafers by causing the wire to travel and pressing the workpiece against the wire while a slurry is supplied to the grooved rollers, the wire saw controlling in such a manner that the workpiece is sliced while a supply temperature of the slurry is increased from the start to the end of slicing the workpiece. As a result, there is provided a wire saw in which Warp of the workpiece to be sliced can be improved by suppressing a decrease in a temperature of the workpiece in the vicinity of the slicing end portion of the workpiece and by making an increase in displacement of the grooved roller during slicing straight, that is, by making the slicing trajectory depicted in the workpiece close to a straight line.

摘要翻译： 本发明是一种线锯，其中绕线缠绕在多个带槽的辊子上，通过使线材在将浆料供应到带槽的辊子上行进并将工件压在线材上的同时将工件切成晶片， 线锯控制方式使得工件被切片，同时浆料的供应温度从切割工件的开始到结束增加。 结果，提供了一种线锯，其中可以通过抑制工件的切割端部附近的工件的温度降低并且通过增加位移来提高要切割的工件的翘曲 在切割直线时，即通过使工件中描绘的切片轨迹靠近直线而形成带槽辊。

公开(公告)号：US20100206285A1

公开(公告)日：2010-08-19

申请号：US12733528

申请日：2008-10-15

申请人： Koji Kitagawa

发明人： Koji Kitagawa

IPC分类号： B28D5/04 ,  B28D1/08 ,  B24B57/02 ,  B26D1/547

CPC分类号： B28D5/045 ,  B24B27/0633 ,  B24B57/02 ,  B28D5/007 ,  Y02P70/179 ,  Y10T83/9292

摘要： A wire saw apparatus having: a wire wound around grooved rollers and axially travels in a reciprocating direction; a nozzle for supplying a slurry; and a work-feeding mechanism feeding a work toward the wire, and slicing into wafers by pressing and feeding the work against the wire traveling in a reciprocating direction while a slurry is supplied to the wire through the nozzle. A work-holding portion holds the work through a pad plate adhered to the work and a work plate, plate-shaped or block-shaped slurry-splash-blocking members are arranged in the direction of a right angle to a row of the wire wound around the grooved rollers below the work-holding portion and on both the wire cut-in side and a wire cut-out side.

摘要翻译： 一种线锯装置，其具有：缠绕在带槽辊上的线，并沿往复方向轴向移动; 用于供应浆料的喷嘴; 以及工作供给机构，其向所述导线供给工件，并且通过在通过所述喷嘴向所述焊丝供给浆料的同时通过将工件压靠并进给所述焊丝而沿往复方向进行切割而切片成晶片。 工件保持部分通过粘附在工件上的焊盘板保持工件，并且工作板，板形或块状浆料防溅部件沿与绕线的一行成直角的方向布置 围绕工作保持部分下方的沟槽辊以及线切割侧和线切割侧。

公开(公告)号：US06783644B2

公开(公告)日：2004-08-31

申请号：US10311614

申请日：2002-12-17

申请人： Minehiro Tonosaki ,  Koji Kitagawa

发明人： Minehiro Tonosaki ,  Koji Kitagawa

IPC分类号： C23C1432

CPC分类号： C23C14/5833 ,  C23C14/024 ,  C23C14/0605 ,  C23C14/325

摘要： A film deposition method, which can form a high quality functional thin film excellent in various physical properties on a surface such as a plastic substrate, is provided. A carbon precursor film is formed on the surface of the substrate K with carbon ions (N2A) using a processing source (4) (a FCVA ion source) with no voltage applied to the substrate K, and then carbon ions (N2B) are implanted in the carbon precursor film with a pulsed voltage containing a negative pulse voltage of −15 kV or less applied to the substrate K, in order to form the carbon thin film. The quality of the carbon precursor film is improved and the various physical properties of the carbon thin film can be controlled.

摘要翻译： 提供一种能够形成在诸如塑料基板的表面上具有优异的各种物理性能的高质量功能薄膜的成膜方法。 使用没有电压施加到基板K的处理源（4）（FCVA离子源）在碳基离子（N2A）的基板K的表面上形成碳前体膜，然后注入碳离子（N2B） 在具有施加到基板K的-15kV或更小的负脉冲电压的脉冲电压的碳前体膜中，以形成碳薄膜。 碳前体膜的质量得到改善，可以控制碳薄膜的各种物理性质。

公开(公告)号：US06773843B2

公开(公告)日：2004-08-10

申请号：US10093934

申请日：2002-03-11

申请人： Koji Kitagawa ,  Eiji Kato ,  Yukio Naruse ,  Takashi Inaba ,  Yasuo Ido

发明人： Koji Kitagawa ,  Eiji Kato ,  Yukio Naruse ,  Takashi Inaba ,  Yasuo Ido

IPC分类号： H01M810

CPC分类号： H01M8/2484 ,  H01M8/0271 ,  H01M8/04225 ,  H01M8/241 ,  H01M8/248 ,  H01M8/2485 ,  H01M2250/30 ,  Y02B90/18

摘要： A portable fuel cell stack is provided in which the number of components is reduced by reducing the number of flow field plates, cell performance is improved by reducing the number of contact portions to thereby lower internal resistance, and fuel is supplied from the center of an end plate directly to a fuel distribution manifold. The portable fuel cell stack includes two end plates, a plurality of unit cells positioned between the two end plates, a fuel distribution manifold positioned in the center of the unit cell for fuel supply thereto, a tie bolt passed through the centers of the fuel manifold and the unit cell for integration of these members, and fixing nuts threaded to both ends of the tie bolt for integrally clamping the plurality of unit cells together between the end plates via an O-ring, etc. The unit cell includes a polymer electrolyte membrane, an oxygen electrode and a fuel electrode installed on both sides of the polymer electrolyte membrane, a flow field plate adjacent to the oxygen electrode side, and a separator plate on the outside of the flow field plate adjacent in contact therewith and another separator plate on the outside of the fuel electrode side in contact therewith. One of the fixing nuts has a fuel supply port connecting to the fuel distribution manifold.

摘要翻译： 提供了一种便携式燃料电池堆，其中通过减少流场板的数量来减少部件的数量，通过减少接触部分的数量从而降低内部电阻来提高电池性能，并且从 端板直接连接到燃料分配歧管。 便携式燃料电池堆包括两个端板，位于两个端板之间的多个单元电池，位于单元电池的中心的燃料分配歧管，用于燃料供应到其中，连接螺栓穿过燃料歧管的中心 以及用于集成这些构件的单元电池，以及螺纹连接到连接螺栓的两端的固定螺母，用于通过O形环等将多个单元电池整体夹持在端板之间。单元电池包括聚合物电解质膜 安装在高分子电解质膜的两侧的氧电极和燃料电极，与氧电极侧相邻的流场板，和与其相接触的流场板的外侧的隔板， 燃料电极侧的外部与其接触。 一个固定螺母具有连接到燃料分配歧管的燃料供给口。

公开(公告)号：US06632280B2

公开(公告)日：2003-10-14

申请号：US09937132

申请日：2001-09-21

申请人： Ryoji Hoshi ,  Koji Kitagawa ,  Izumi Fusegawa ,  Tomohiko Ohta

发明人： Ryoji Hoshi ,  Koji Kitagawa ,  Izumi Fusegawa ,  Tomohiko Ohta

IPC分类号： C30B1500

CPC分类号： C30B29/06 ,  C30B15/14 ,  C30B15/206 ,  Y10T117/1032 ,  Y10T117/1068 ,  Y10T117/1072 ,  Y10T117/1088

摘要： An apparatus for growing a single crystal (20) comprising at least a main chamber (1) enclosing a crucible (5, 6) for accommodating a raw material melt (4) and a heater (7) for heating the raw material melt and a pulling chamber (2) continuously provided above the main chamber, into which a grown single crystal is pulled and stored, wherein the apparatus further comprises a cooling cylinder (11) that extends at least from a ceiling of the main chamber toward a raw material melt surface so as to surround a single crystal under pulling (3) and is forcibly cooled with a cooling medium, and an auxiliary cooling member (13) extending below the cooling cylinder and having a cylindrical shape or a shape tapered toward the downward direction. There is provided an apparatus for growing a single crystal that can exert cooling effect on a grown single crystal to the maximum extent so as to accelerate the crystal growth rate and safely produce a single crystal without leakage of cooling medium due to breakage etc.

摘要翻译： 包括至少包围坩埚的主室（ 1 ）的单晶生长装置（ 20 用于容纳原材料熔体（ 4 ）的加热器（ 7 < / BOLD> ），用于加热原料熔体和在主室上方连续设置的拉动室（ 2 ），拉出并存储生长的单晶 ，其中所述装置还包括至少从主室的天花板朝向原料熔体表面延伸的冷却圆筒（ 11 PDAT>），以围绕单晶体 （ 3 ），并用冷却介质强制冷却，并在下方延伸的辅助冷却构件（ 13 ） 具有圆筒形状或朝向下方向逐渐变细的形状。 提供了一种用于生长可以最大程度地对生长的单晶施加冷却效果的单晶的装置，以便加速晶体生长速率并且安全地生产单晶，而不会由于断裂等导致冷却介质的泄漏。 PTEXT>

公开(公告)号：US20140000580A1

公开(公告)日：2014-01-02

申请号：US14004791

申请日：2012-04-02

申请人： Koji Kitagawa

发明人： Koji Kitagawa

IPC分类号： B28D5/04

CPC分类号： B28D5/045 ,  B23D59/001

摘要： The present invention provides a method of resuming operation of a wire saw in which slicing of a workpiece is suspended and then resumed, including slicing the workpiece while detecting a traveling direction and a traveling speed of the reciprocating wire and recording them chronologically; and resuming the slicing while controlling the traveling direction and a traveling time in the traveling direction of the wire on a basis of a wire traveling history recorded until the suspending of the slicing of the workpiece such that the reciprocating cycle of the wire becomes continuous between before the suspending and after the resuming of the slicing of the workpiece. This method enables the slicing to be completed while the nanotopography of the sliced wafer is surely prevented from degrading, even when the slicing of the workpiece with a wire saw is suspended due to, for example, breaking of the wire.

摘要翻译： 本发明提供了一种线锯的恢复操作方法，其中工件的切片暂停然后恢复，包括在检测往复导线的行进方向和行进速度并按时间顺序记录的同时切割工件; 并且基于记录的线材行进历史来控制行进方向的行进方向和行进方向的行驶时间，并重新开始切片，直到暂停工件的切割，使得电线的往复循环在之前连续变化 暂停和恢复工件切片后。 该方法能够在切片晶片的纳米形貌可靠地防止劣化的同时完成切片，即使当由于例如电线断裂而用线锯将工件切片悬挂时。