Abstract:
A parallel light beam having a predetermined diameter is projected onto an aluminum deposition film formed on a semiconductor wafer in a direction normal to the wafer surface. Light reflected by the aluminum deposition film is converted into reflected light intensity data by a plurality of photoelectric conversion elements arranged in a spherical surface with the center thereof at the center of the parallel light beam incidence spot. The reflected light intensity data are stored in a RAM in a microprocessor. The data stored in the RAM are displayed as a reflected light intensity distribution plot on a display unit for comparison with a standard reflected light intensity distribution plot, whereby the bonding property of the aluminum deposition film is judged.
Abstract:
A dimension measuring apparatus for measuring the dimensions of a secondary electron emission object has a scanning electron microscope main body with a display, and a dimension measuring section connected to the main body. The dimension measuring section has a cursor setter for displaying cursors on the display. A memory stores image signals which are divided into picture elements and assigned to addresses. The image signals are used as image data. A CPU section receives the image data from the memory, obtains reference points for designating two ends of a line corresponding to a dimension of a sample to be measured based on the received image signals, and measures the dimension of the sample.
Abstract:
The holding mechanism holds an object under inspection in a manner that the substantially entire surface of the object may relatively be scanned by a laser beam. A spherical integrating light collector has an opening disposed close to the inspected surface of the object held by the holding mechanism. A laser beam illuminating mechanism is coupled with the other end of the spherical integrating light collector, and illuminates the inspected surface of the object with the laser beam through the opening. A photo-electric converter receives the scattered light as is reflected by the inspected surface and collected by the spherical integrating light collector, and converts the scattered light into an electrical signal representing an amount of light. An analog to digital converter converts the electrical signal derived from the photo-electric converter into a digital signal. A peak detector receives the digital signal derived from the analog to digital converter to detect peak values at predetermined periods. A mean value calculator calculates a mean value using a digital signal output from the analog to digital converter. A reference value storing memory stores a reference value to determine defects present on the inspected surface of the object. A threshold level calculator calculates the threshold level using the reference value and the mean value. A defect detector compares peak values derived from the peak detector with the threshold level, and detects the surface defects on the basis of the result of the comparison.
Abstract:
A heat radiation structure is provided for a semiconductor device, by which a mounting height of the semiconductor device can be lowered to increase an accommodation density in a shelf, and the mounting/dismounting is easily carried out. In a heat-radiation structure for a semiconductor device, in which a semiconductor device (2) is mounted on a printed circuit board (1) so that the bottom surface thereof confronts an opening (1a) formed in the printed circuit board, a heat-conductive member (3, 11) is brought into tight contact with the bottom surface of the semiconductor device and the opposite end surface of thereof is protruded through the opening (1a) from the back side of the printed circuit board while in tight contact with a heat-radiation plate (4) disposed at that position, so that heat generated from the semiconductor device is transmitted to the heat-radiation plate (4) via the heat-conductive member (3, 11) and radiated from the outer surface thereof into air. At least one of the semiconductor device (2) and the heat-radiation plate (4) is made of a magnetic substance so that the two members are brought into tight contact with the heat-conductive member by the attraction force of a permanent magnet (3, 10) disposed between the two members.
Abstract:
An optical fiber cable lead-in structure for a shelf (1) having a space (7) for receiving a remaining portion of the optical fiber cable (23), and an electronic circuit unit (12) mounted thereon having a board (14) and a surface plate (15) provided perpendicularly at one side of the board (14); the surface plate (15) covering the front side of the shelf (1) when mounting, comprising: an optical connection (21;25) for connection between the optical fiber cable (23) and the electronic circuit unit (12), which is provided on the board (14) adjacent to the backside of the surface plate (15); an outwardly protruding portion (33) that is provided in the surface plate (15) so as to correspond to the optical connection (21;25), such that an attaching and detaching operation of the optical connection (21;25) may be easily effected; and an opening (27) that is provided in the surface plate (15) such that the optical fiber cable (23) extending from the remaining fiber cable receiving space (7) is wired so as to extend along the surface plate (15) until it passes through the opening (27) of the surface plate (15) while describing a slight arch, and in turn to extend along the backside of the surface plate (15) while describing another slight arch until it reaches the optical connection (21;25) on the board (14) of the electronic circuit unit (12).
Abstract:
In a propeller measuring device, moving means move a probe relative to the propeller to a plurality of reference positions indicative of positions on a desired propeller shape. The probe determines the deviation from reference position and a recorder records the deviation. In one embodiment, the measuring means measures only from the time the probe contacts the propeller being measured until the reference position, which is a given distance beyond the position on a desired shape, is reached.
Abstract:
The present invention provides a multi-structured internal heat exchange-type distillation column including at least an outermost heat exchange section, an intermediate section, and an innermost heat exchange section, in which the innermost heat exchange section is isolated from the intermediate section, the outermost heat exchange section is also isolated from the intermediate section, the outermost heat exchange section and the innermost heat exchange section are in communication with one another through at least two vapor tunnel connecting ports, a channel is formed inside the outermost heat exchange section in such a manner that, in a case where at least one of the vapor tunnel connecting ports serves as an inlet for vapor from the innermost heat exchange section into the outermost heat exchange section, and the other vapor tunnel connecting port serves as an outlet for vapor from the outermost heat exchange section back to the innermost heat exchange section, the vapor can smoothly flow in one-way traffic from the inlet toward the outlet, and either the outermost heat exchange section and the innermost heat exchange section, or the intermediate section, is a rectifying section, and the other is a stripping section. The distillation column of the present invention has excellent efficiency of internal heat exchange.
Abstract:
The present invention provides a multi-structured internal heat exchange-type distillation column comprising at least an outermost heat exchange section, an intermediate section, and an innermost heat exchange section, in which the innermost heat exchange section is isolated from the intermediate section, the outermost heat exchange section is also isolated from the intermediate section, the outermost heat exchange section and the innermost heat exchange section are in communication with one another through at least two vapor tunnel connecting ports, a channel is formed inside the outermost heat exchange section in such a manner that, in a case where at least one of the vapor tunnel connecting ports serves as an inlet for vapor from the innermost heat exchange section into the outermost heat exchange section, and the other vapor tunnel connecting port serves as an outlet for vapor from the outermost heat exchange section back to the innermost heat exchange section, the vapor can smoothly flow in one-way traffic from the inlet toward the outlet, and either the outermost heat exchange section and the innermost heat exchange section, or the intermediate section, is a rectifying section, and the other is a stripping section. The distillation column of the present invention has excellent efficiency of internal heat exchange.
Abstract:
This invention relates to a subrack device applicable for an SDH network, and more particularly to a subrack device which can be produced flexibly in response to a customer's need. The subrack device has a subrack body commonly used regardless of a type of the subrack device. The subrack body has a circuit-board-unit housing portion and an outer-connecting-board mounting portion. Circuit boards and outer-connecting-board connecting-boards of different types are prepared. The outer-connecting-board mounting portion has a plurality of outer-connecting-board mounting territories. The outer-connecting-boards are plugged in the outer-connecting-board mounting territories to produce the subrack device meeting the customer's need.
Abstract:
A test connector for an electronic circuit unit to be mounted on a shelf (11) of an electronic apparatus, which is adapted to be inserted on the shelf only when a projection (33) on the electronic circuit unit comes into a matching position relative to a groove (25) provided on a frame portion (21) of the shelf (11). Guide members (51, 53) with guide grooves (55, 65) which guide the opposite side edges of the electronic circuit unit (27) are provided on a printed wiring board (45) which has connectors (47, 49) at the opposite ends thereof. A plurality of rod members (61, 63) are slidably located on the guide member (51). When mounting the electronic circuit unit, at least one of the rod members (61) or (63) is slid forwardly by the projection (33), prohibiting the placement of the test connector (43) on the shelf (11) unless a protruded end of the rod member (63) is in a matching position relative to the groove (25) on the shelf (11).