Abstract:
A heat radiation structure is provided for a semiconductor device, by which a mounting height of the semiconductor device can be lowered to increase an accommodation density in a shelf, and the mounting/dismounting is easily carried out. In a heat-radiation structure for a semiconductor device, in which a semiconductor device (2) is mounted on a printed circuit board (1) so that the bottom surface thereof confronts an opening (1a) formed in the printed circuit board, a heat-conductive member (3, 11) is brought into tight contact with the bottom surface of the semiconductor device and the opposite end surface of thereof is protruded through the opening (1a) from the back side of the printed circuit board while in tight contact with a heat-radiation plate (4) disposed at that position, so that heat generated from the semiconductor device is transmitted to the heat-radiation plate (4) via the heat-conductive member (3, 11) and radiated from the outer surface thereof into air. At least one of the semiconductor device (2) and the heat-radiation plate (4) is made of a magnetic substance so that the two members are brought into tight contact with the heat-conductive member by the attraction force of a permanent magnet (3, 10) disposed between the two members.
Abstract:
The holding mechanism holds an object under inspection in a manner that the substantially entire surface of the object may relatively be scanned by a laser beam. A spherical integrating light collector has an opening disposed close to the inspected surface of the object held by the holding mechanism. A laser beam illuminating mechanism is coupled with the other end of the spherical integrating light collector, and illuminates the inspected surface of the object with the laser beam through the opening. A photo-electric converter receives the scattered light as is reflected by the inspected surface and collected by the spherical integrating light collector, and converts the scattered light into an electrical signal representing an amount of light. An analog to digital converter converts the electrical signal derived from the photo-electric converter into a digital signal. A peak detector receives the digital signal derived from the analog to digital converter to detect peak values at predetermined periods. A mean value calculator calculates a mean value using a digital signal output from the analog to digital converter. A reference value storing memory stores a reference value to determine defects present on the inspected surface of the object. A threshold level calculator calculates the threshold level using the reference value and the mean value. A defect detector compares peak values derived from the peak detector with the threshold level, and detects the surface defects on the basis of the result of the comparison.
Abstract:
In a propeller measuring device, moving means move a probe relative to the propeller to a plurality of reference positions indicative of positions on a desired propeller shape. The probe determines the deviation from reference position and a recorder records the deviation. In one embodiment, the measuring means measures only from the time the probe contacts the propeller being measured until the reference position, which is a given distance beyond the position on a desired shape, is reached.
Abstract:
The present invention provides a multi-structured internal heat exchange-type distillation column including at least an outermost heat exchange section, an intermediate section, and an innermost heat exchange section, in which the innermost heat exchange section is isolated from the intermediate section, the outermost heat exchange section is also isolated from the intermediate section, the outermost heat exchange section and the innermost heat exchange section are in communication with one another through at least two vapor tunnel connecting ports, a channel is formed inside the outermost heat exchange section in such a manner that, in a case where at least one of the vapor tunnel connecting ports serves as an inlet for vapor from the innermost heat exchange section into the outermost heat exchange section, and the other vapor tunnel connecting port serves as an outlet for vapor from the outermost heat exchange section back to the innermost heat exchange section, the vapor can smoothly flow in one-way traffic from the inlet toward the outlet, and either the outermost heat exchange section and the innermost heat exchange section, or the intermediate section, is a rectifying section, and the other is a stripping section. The distillation column of the present invention has excellent efficiency of internal heat exchange.
Abstract:
The present invention provides a multi-structured internal heat exchange-type distillation column comprising at least an outermost heat exchange section, an intermediate section, and an innermost heat exchange section, in which the innermost heat exchange section is isolated from the intermediate section, the outermost heat exchange section is also isolated from the intermediate section, the outermost heat exchange section and the innermost heat exchange section are in communication with one another through at least two vapor tunnel connecting ports, a channel is formed inside the outermost heat exchange section in such a manner that, in a case where at least one of the vapor tunnel connecting ports serves as an inlet for vapor from the innermost heat exchange section into the outermost heat exchange section, and the other vapor tunnel connecting port serves as an outlet for vapor from the outermost heat exchange section back to the innermost heat exchange section, the vapor can smoothly flow in one-way traffic from the inlet toward the outlet, and either the outermost heat exchange section and the innermost heat exchange section, or the intermediate section, is a rectifying section, and the other is a stripping section. The distillation column of the present invention has excellent efficiency of internal heat exchange.
Abstract:
This invention relates to a subrack device applicable for an SDH network, and more particularly to a subrack device which can be produced flexibly in response to a customer's need. The subrack device has a subrack body commonly used regardless of a type of the subrack device. The subrack body has a circuit-board-unit housing portion and an outer-connecting-board mounting portion. Circuit boards and outer-connecting-board connecting-boards of different types are prepared. The outer-connecting-board mounting portion has a plurality of outer-connecting-board mounting territories. The outer-connecting-boards are plugged in the outer-connecting-board mounting territories to produce the subrack device meeting the customer's need.
Abstract:
A test connector for an electronic circuit unit to be mounted on a shelf (11) of an electronic apparatus, which is adapted to be inserted on the shelf only when a projection (33) on the electronic circuit unit comes into a matching position relative to a groove (25) provided on a frame portion (21) of the shelf (11). Guide members (51, 53) with guide grooves (55, 65) which guide the opposite side edges of the electronic circuit unit (27) are provided on a printed wiring board (45) which has connectors (47, 49) at the opposite ends thereof. A plurality of rod members (61, 63) are slidably located on the guide member (51). When mounting the electronic circuit unit, at least one of the rod members (61) or (63) is slid forwardly by the projection (33), prohibiting the placement of the test connector (43) on the shelf (11) unless a protruded end of the rod member (63) is in a matching position relative to the groove (25) on the shelf (11).
Abstract:
A parallel light beam having a predetermined diameter is projected onto an aluminum deposition film formed on a semiconductor wafer in a direction normal to the wafer surface. Light reflected by the aluminum deposition film is converted into reflected light intensity data by a plurality of photoelectric conversion elements arranged in a spherical surface with the center thereof at the center of the parallel light beam incidence spot. The reflected light intensity data are stored in a RAM in a microprocessor. The data stored in the RAM are displayed as a reflected light intensity distribution plot on a display unit for comparison with a standard reflected light intensity distribution plot, whereby the bonding property of the aluminum deposition film is judged.
Abstract:
In the process of forming a through-hole or blind-hole at desired positions of a the substrate material, the present invention sets a drilling target position for each hole and a plurality of auxiliary drilling positions at a periphery of the drilling target position, and performs a plurality of drillings at the drilling target position and the plurality of auxiliary drilling positions. In another preferred embodiment of the present invention, a plurality of drillings are performed only at the auxiliary drilling positions per one hole at the desired position. According to the present invention, through-holes or blind-holes having several sizes of diameters can be formed by using one drilling jig under a single drilling condition. Accordingly, it is possible to efficiently produce circuit boards at low costs.
Abstract:
With a liquid ejection apparatus where a liquid-transporting body is attached to an agitator shaft, the liquid-transporting body is revolved about the agitator shaft, with the rotational speed being changed in accordance with a change in liquid depth. Hence ejection liquid ejected from an upper opening of the liquid-transporting body over a large ejection distance and in sufficient volume, is distributed onto the inner surface of the tank and/or into the space above the liquid surface, thereby washing the inner surface of the tank, maintaining the heat transfer area, dispersing a foam layer on the liquid surface, and promoting evaporation of liquid in the tank.