摘要:
A sense amplifier in use for a memory device is made up of a pair of Schmitt trigger circuits. These Schmitt trigger circuits are cross coupled with each other so that each of the Schmitt trigger circuits operates in response to a predetermined high potential difference. The predetermined potential difference is high enough to operate each Schmitt trigger circuit according to the steeper slope of the two long slopes of a hysteresis loop of the Schmitt trigger circuit.
摘要:
A transistor circuit with hysteresis operation, which is formed with a detector part and selector part. The detector part detects a change in the level of an input signal according to one of first and second threshold levels, and generates an output signal having a level corresponding to the input signal. The level of the input signal is changed between a first level and a second level which is lower than the first level. The first and second threshold levels fall within a range defined between the first and second levels. The selector part selects one of the first and second threshold levels in accordance with the level of the output signal, and applies the selected one threshold level to the detector part.
摘要:
The gate electrode of a first CMOS inverter is connected to the drains of each transistor of a second CMOS inverter via an interconnection, and the gate electrode of the second CMOS inverter is connected to the drains of the first CMOS inverter via an interconnection, to form a flip-flop circuit. A pair of transfer transistors are connected to the nodes of this flip-flop circuit. A plurality of memory cells each constructed by the flip-flop circuit and the pair of transfer transistors are integrated in a matrix form to form a semiconductor memory device. The pair of gate electrodes are formed of a first polycrystalline silicon layer which includes an impurity of the first conductivity type. The pair of interconnections are formed of an impurity-doped second polycrystalline silicon layer and a high-melting point metal layer, and formed on a first interlayer insulation film. The high-melting point metal layer is provided to prevent an increase in the resistance value due to the formation of a pn junction formed by the interconnections.
摘要:
A semiconductor device which comprises an N channel MOS transistor deposited on a P conductivity substrate, a P channel MOS transistor mounted on said N channel MOS transistor, and a high melting metal layer interposed between the drain regions of said first and second MOS transistors in a direction perpendicular to the surface of said semiconductor device to thereby effect ohmic contact between said drain regions.
摘要:
A logic circuit comprises at least one signal input terminal, an output terminal, an output circuit including a first bipolar transistor coupled between the output terminal and a reference potential terminal, to discharge the output terminal, and an MOS type logic circuit for supplying to the base of the first bipolar transistor a signal of a level corresponding to an input signal supplied to the at least one signal input terminal. The logic circuit further comprises a control MOS transistor coupled between a power source terminal and the base of the bipolar transistor, for supplying part of the base current to the bipolar transistor in response to a signal at the output terminal.
摘要:
There is disclosed a memory cell in which a low resistance polycrystal silicon layer and a high resistance polycrystal silicon layer are connected to each other with a barrier metal layer provided therebetween and formed in a contact hole of an insulation film.
摘要:
The object of the invention is to provide a semiconductor device realizing high-speed operation of surrounding gate transistors (SGTs), which are three-dimensional semiconductors, by increasing the ON current of the SGTs. This object is achieved by a semiconductor element being provided in which a source, a drain and a gate are positioned in layers on a substrate, the semiconductor element being provided with: a silicon column; an insulating body surrounding the side surface of the silicon column; a gate surrounding the insulating body; a source region positioned above or below the silicon column; and a drain region positioned below or above the silicon column; wherein the contact surface of the silicon column with the source region is smaller than the contact surface of the silicon column with the drain region.
摘要:
The object to provide a highly-integrated SGT-based SRAM is achieved by forming an SRAM using an inverter which comprises a first island-shaped semiconductor layer, a first gate dielectric film in contact with a periphery of the first island-shaped semiconductor layer, a first gate electrode having one surface in contact with the first gate dielectric film, a second gate dielectric film in contact with another surface of the first gate electrode, a first arc-shaped semiconductor layer in contact with the second gate dielectric film, a first first-conductive-type high-concentration semiconductor layer arranged on a top of the first island-shaped semiconductor layer, a second first-conductive-type high-concentration semiconductor layer arranged underneath the first island-shaped semiconductor layer, a first second-conductive-type high-concentration semiconductor layer arranged on a top of the first arc-shaped semiconductor layer, and a second second-conductive-type high-concentration semiconductor layer arranged underneath the first arc-shaped semiconductor layer.
摘要:
In a solid-state imaging device, a pixel has a first island-shaped semiconductor (P11) formed on a substrate (1) and a drive output circuit has second island-shaped semiconductors (4a to 4c) formed on the substrate at the same height as that of the first island-shaped semiconductor (P11). The first island-shaped semiconductor (P11) has a first gate insulating layer (6b) formed on an outer periphery thereof and a first gate conductor layer (105a) surrounding the first gate insulating layer (6b). The second island-shaped semiconductors (4a to 4c) have a second gate insulating layer (6a) formed on an outer periphery thereof and a second gate conductor layer (7a) surrounding the second gate insulating layer (6a). The first gate conductor layer (105a) and the second gate conductor layer (7a) have bottom portions located on the same plane.
摘要:
The object to provide a semiconductor device comprising a highly-integrated SGT-based CMOS inverter circuit is achieved by forming an inverter which comprises: a first transistor including; an first island-shaped semiconductor layer; a first gate insulating film; a gate electrode; a first first-conductive-type high-concentration semiconductor layer arranged above the first island-shaped semiconductor layer; and a second first-conductive-type high-concentration semiconductor layer arranged below the first island-shaped semiconductor layer, and a second transistor including; a second gate insulating film surrounding a part of the periphery of the gate electrode; a second semiconductor layer in contact with a part of the periphery of the second gate insulating film; a first second-conductive-type high-concentration semiconductor layer arranged above the second semiconductor layer; and a second second-conductive-type high-concentration semiconductor layer arranged below the second semiconductor layer.