公开(公告)号：US06875631B2

公开(公告)日：2005-04-05

申请号：US10360712

申请日：2003-02-10

申请人： Hirotaka Nishizawa ,  Hideki Tanaka ,  Yuichiro Yamada ,  Tomoaki Kudaishi ,  Akira Katsumata

发明人： Hirotaka Nishizawa ,  Hideki Tanaka ,  Yuichiro Yamada ,  Tomoaki Kudaishi ,  Akira Katsumata

IPC分类号： H05K5/02 ,  H01L23/12 ,  B23Q3/00 ,  H01L21/00 ,  H01L21/44 ,  H01L23/495 ,  H05K1/14 ,  H05K3/30

CPC分类号： H05K5/026 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49897 ,  Y10T29/53178

摘要： A CF card (1) comprises: a casing constituted by two panel plates (2, 2) and a frame (3); and a printed wiring board (4) accommodated in the casing. A plurality of claw-like engaging parts (5) are provided to the peripheries of the panel plates (2). When the CF card (1) is assembled, the engaging parts (5) of the first panel plate (2) are inserted into through holes of a long groove (8) provided in the frame (3) and then the printed wiring board (4) is mounted on the panel plate (2) located at the inside of the frame (3). Thereafter, the engaging parts (5) of the second panel plate (2) are inserted into the through holes of the long groove (8) from the surface located in the opposite side of the frame (3). There are two types of engaging parts (5): one having lances and the other having holes. Inside the through holes, the lances of the engaging parts (5) of one panel plate (2) are inserted into the holes of the engaging parts (5) of the other panel plate (2).

摘要翻译： CF卡（1）包括：由两个面板（2）和框架（3）构成的壳体; 和容纳在壳体中的印刷电路板（4）。 在面板（2）的周边设有多个爪状卡合部（5）。 当CF卡（1）组装时，第一面板（2）的接合部分（5）插入到设置在框架（3）中的长槽（8）的通孔中，然后插入到印刷线路板 4）安装在位于框架（3）内侧的面板（2）上。 此后，第二面板（2）的接合部（5）从位于框架（3）的相对侧的表面插入到长槽（8）的通孔中。 有两种类型的接合部分（5）：一种具有喷枪，另一种具有孔。 在通孔内，一块面板（2）的接合部分（5）的喷枪插入到另一个面板（2）的接合部分（5）的孔中。

公开(公告)号：US06759754B1

公开(公告)日：2004-07-06

申请号：US10240111

申请日：2002-09-27

申请人： Hirotaka Nishizawa ,  Hideki Tanaka ,  Yuichiro Yamada ,  Tomoaki Kudaishi ,  Akira Katsumata

发明人： Hirotaka Nishizawa ,  Hideki Tanaka ,  Yuichiro Yamada ,  Tomoaki Kudaishi ,  Akira Katsumata

IPC分类号： H01L23544

CPC分类号： H05K5/026

摘要： A CF card (1) comprises: a casing constituted by two panel plates (2, 2) and a frame (3); and a printed wiring board (4) accommodated in the casing. A plurality of claw-like engaging parts (5) are provided to the peripheries of the panel plates (2). When the CF card (1) is assembled, the engaging parts (5) of the first panel plate (2) are inserted into through holes of a long groove (8) provided in the frame (3) and then the printed wiring board (4) is mounted on the panel plate (2) located at the inside of the frame (3). Thereafter, the engaging parts (5) of the second panel plate (2) are inserted into the through holes of the long groove (8) from the surface located in the opposite side of the frame (3). There are two types of engaging parts (5): one having lances and the other having holes. Inside the through holes, the lances of the engaging parts (5) of one panel plate (2) are inserted into the holes of the engaging parts (5) of the other panel plate (2).

摘要翻译： CF卡（1）包括：由两个面板（2）和框架（3）构成的壳体; 和容纳在壳体中的印刷电路板（4）。 在面板（2）的周边设有多个爪状卡合部（5）。 当CF卡（1）组装时，第一面板（2）的接合部分（5）插入到设置在框架（3）中的长槽（8）的通孔中，然后插入到印刷线路板 4）安装在位于框架（3）内侧的面板（2）上。 此后，第二面板（2）的接合部（5）从位于框架（3）的相对侧的表面插入到长槽（8）的通孔中。 有两种类型的接合部分（5）：一种具有喷枪，另一种具有孔。 在通孔内，一块面板（2）的接合部分（5）的喷枪插入到另一个面板（2）的接合部分（5）的孔中。

公开(公告)号：US20060261494A1

公开(公告)日：2006-11-23

申请号：US11492165

申请日：2006-07-25

申请人： Chuichi Miyazaki ,  Yukiharu Akiyama ,  Masanori Shibamoto ,  Tomoaki Kudaishi ,  Ichiro Anjoh ,  Kunihiko Nishi ,  Asao Nishimura ,  Hideki Tanaka ,  Ryosuke Kimoto ,  Kunihiro Tsubosaki ,  Akio Hasebe

发明人： Chuichi Miyazaki ,  Yukiharu Akiyama ,  Masanori Shibamoto ,  Tomoaki Kudaishi ,  Ichiro Anjoh ,  Kunihiko Nishi ,  Asao Nishimura ,  Hideki Tanaka ,  Ryosuke Kimoto ,  Kunihiro Tsubosaki ,  Akio Hasebe

IPC分类号： H01L23/48

CPC分类号： H01L24/50 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49572 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06136 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/50 ,  H01L2224/85951 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A semiconductor device includes a semiconductor chip formed with connection terminals, an elastic structure interposed between a main surface of the chip and a wiring substrate formed with wirings connected at first ends thereof to the connection terminals, and bump electrodes connected to the other ends of the wirings. The connection terminals may be at a center part or in peripheral part(s) of the chip main surface and both the elastic structure and wiring substrate are not provided at locations of connection terminals. A resin body seals at least the connection terminals and the exposed first ends of wirings (leads). In a scheme in which the connection terminals are located in a peripheral part of the chip main surface, the wiring substrate protrudes beyond the chip boundary where the connection terminals are arranged, and the resin body shape is restricted by the protruding part of the wiring substrate.

摘要翻译： 半导体器件包括形成有连接端子的半导体芯片，插入在芯片的主表面之间的弹性结构和形成有连接到连接端子的布线的布线基板，以及连接到连接端子的另一端的凸起电极 布线。 连接端子可以在芯片主表面的中心部分或周边部分，并且弹性结构和布线基板都不设置在连接端子的位置处。 树脂体至少密封连接端子和暴露的布线的第一端（引线）。 在连接端子位于芯片主表面的周边部分的方案中，布线基板突出超过布置有连接端子的芯片边界，并且树脂体形状被布线基板的突出部分限制 。

公开(公告)号：US06670215B2

公开(公告)日：2003-12-30

申请号：US10058319

申请日：2002-01-30

申请人： Chuichi Miyazaki ,  Yukiharu Akiyama ,  Masanori Shibamoto ,  Tomoaki Kudaishi ,  Ichiro Anjoh ,  Kunihiko Nishi ,  Asao Nishimura ,  Hideki Tanaka ,  Ryosuke Kimoto ,  Kunihiro Tsubosaki ,  Akio Hasebe

发明人： Chuichi Miyazaki ,  Yukiharu Akiyama ,  Masanori Shibamoto ,  Tomoaki Kudaishi ,  Ichiro Anjoh ,  Kunihiko Nishi ,  Asao Nishimura ,  Hideki Tanaka ,  Ryosuke Kimoto ,  Kunihiro Tsubosaki ,  Akio Hasebe

IPC分类号： H01L2144

CPC分类号： H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06136 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/50 ,  H01L2224/73215 ,  H01L2224/85951 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  Y10T29/4913 ,  Y10T29/49169 ,  H01L2924/20753 ,  H01L2224/05599

摘要： A ball grid array type semiconductor package includes a semiconductor chip formed with bonding pads, an elastomer bonded to the semiconductor chip, a flexible wiring substrate bonded to the elastomer and formed with wirings connected at one end of the bonding pads of the semiconductor chip, a solder resist formed on the main surface of the flexible wiring substrate and solder bump electrodes connected to the other ends of the wirings. The elastomer is bonded to the flexible wiring substrate on the side of the tape, the solder resist is formed on the side of the wirings, and the solder bump electrodes are connected with the wirings by way of through holes formed in the solder resist.

公开(公告)号：US06472727B2

公开(公告)日：2002-10-29

申请号：US09771648

申请日：2001-01-30

申请人： Chuichi Miyazaki ,  Yukiharu Akiyama ,  Masanori Shibamoto ,  Tomoaki Kudaishi ,  Ichiro Anjoh ,  Kunihiko Nishi ,  Asao Nishimura ,  Hideki Tanaka ,  Ryosuke Kimoto ,  Kunihiro Tsubosaki ,  Akio Hasebe

发明人： Chuichi Miyazaki ,  Yukiharu Akiyama ,  Masanori Shibamoto ,  Tomoaki Kudaishi ,  Ichiro Anjoh ,  Kunihiko Nishi ,  Asao Nishimura ,  Hideki Tanaka ,  Ryosuke Kimoto ,  Kunihiro Tsubosaki ,  Akio Hasebe

IPC分类号： H01L23495

CPC分类号： H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06136 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/50 ,  H01L2224/73215 ,  H01L2224/85951 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  Y10T29/4913 ,  Y10T29/49169 ,  H01L2924/20753 ,  H01L2224/05599

摘要： A ball grid array type semiconductor package includes a semiconductor chip formed with bonding pads, an elastomer bonded to the semiconductor chip, a flexible wiring substrate bonded to the elastomer and formed with wirings connected at one end of the bonding pads of the semiconductor chip, a solder resist formed on the main surface of the flexible wiring substrate and solder bump electrodes connected to the other ends of the wirings. The elastomer is bonded to the flexible wiring substrate on the side of the tape, the solder resist is formed on the side of the wirings, and the solder bump electrodes are connected with the wirings by way of through holes formed in the solder resist.

公开(公告)号：US06353255B2

公开(公告)日：2002-03-05

申请号：US09764378

申请日：2001-01-19

申请人： Chuichi Miyazaki ,  Yukiharu Akiyama ,  Masanori Shibamoto ,  Tomoaki Kudaishi ,  Ichiro Anjoh ,  Kunihiko Nishi ,  Asao Nishimura ,  Hideki Tanaka ,  Ryosuke Kimoto ,  Kunihiro Tsubosaki ,  Akio Hasebe

发明人： Chuichi Miyazaki ,  Yukiharu Akiyama ,  Masanori Shibamoto ,  Tomoaki Kudaishi ,  Ichiro Anjoh ,  Kunihiko Nishi ,  Asao Nishimura ,  Hideki Tanaka ,  Ryosuke Kimoto ,  Kunihiro Tsubosaki ,  Akio Hasebe

IPC分类号： H01L23435

CPC分类号： H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06136 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/50 ,  H01L2224/73215 ,  H01L2224/85951 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  Y10T29/4913 ,  Y10T29/49169 ,  H01L2924/20753 ,  H01L2224/05599

摘要： A ball grid array type semiconductor package includes a semiconductor chip formed with bonding pads, an elastomer bonded to the semiconductor chip, a flexible wiring substrate bonded to the elastomer and formed with wirings connected at one end of the bonding pads of the semiconductor chip, a solder resist formed on the main surface of the flexible wiring substrate and solder bump electrodes connected to the other ends of the wirings. The elastomer is bonded to the flexible wiring substrate on the side of the tape, the solder resist is formed on the side of the wirings, and the solder bump electrodes are connected with the wirings by way of through holes formed in the solder resist.

公开(公告)号：US06342726B2

公开(公告)日：2002-01-29

申请号：US09449834

申请日：1999-11-26

申请人： Chuichi Miyazaki ,  Yukiharu Akiyama ,  Masanori Shibamoto ,  Tomoaki Kudaishi ,  Ichiro Anjoh ,  Kunihiko Nishi ,  Asao Nishimura ,  Hideki Tanaka ,  Ryosuke Kimoto ,  Kunihiro Tsubosaki ,  Akio Hasebe

发明人： Chuichi Miyazaki ,  Yukiharu Akiyama ,  Masanori Shibamoto ,  Tomoaki Kudaishi ,  Ichiro Anjoh ,  Kunihiko Nishi ,  Asao Nishimura ,  Hideki Tanaka ,  Ryosuke Kimoto ,  Kunihiro Tsubosaki ,  Akio Hasebe

IPC分类号： H01L23495

CPC分类号： H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06136 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/50 ,  H01L2224/73215 ,  H01L2224/85951 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  Y10T29/4913 ,  Y10T29/49169 ,  H01L2924/20753 ,  H01L2224/05599

摘要： A ball grid array type semiconductor package includes a semiconductor chip formed with bonding pads, an elastomer bonded to the semiconductor chip, a flexible wiring substrate bonded to the elastomer and formed with wirings connected at one end of the bonding pads of the semiconductor chip, a solder resist formed on the main surface of the flexible wiring substrate and solder bump electrodes connected to the other ends of the wirings. The elastomer is bonded to the flexible wiring substrate on the side of the tape, the solder resist is formed on the side of the wirings, and the solder bump electrodes are connected with the wirings by way of through holes formed in the solder resist.

公开(公告)号：US07091620B2

公开(公告)日：2006-08-15

申请号：US11116209

申请日：2005-04-28

申请人： Chuichi Miyazaki ,  Yukiharu Akiyama ,  Masnori Shibamoto ,  Tomoaki Kudaishi ,  Ichiro Anjoh ,  Kunihiko Nishi ,  Asao Nishimura ,  Hideki Tanaka ,  Ryosuke Kimoto ,  Kunihiro Tsubosaki ,  Akio Hasebe ,  Takehiro Ohnishi ,  Noriou Shimada ,  Shuji Eguchi ,  Hiroshi Koyama ,  Akira Nagai ,  Masahiko Ogino

发明人： Chuichi Miyazaki ,  Yukiharu Akiyama ,  Masnori Shibamoto ,  Tomoaki Kudaishi ,  Ichiro Anjoh ,  Kunihiko Nishi ,  Asao Nishimura ,  Hideki Tanaka ,  Ryosuke Kimoto ,  Kunihiro Tsubosaki ,  Akio Hasebe ,  Takehiro Ohnishi ,  Noriou Shimada ,  Shuji Eguchi ,  Hiroshi Koyama ,  Akira Nagai ,  Masahiko Ogino

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/50 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49572 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06136 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/50 ,  H01L2224/85951 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A semiconductor device includes a semiconductor chip formed with connection terminals, an elastic structure interposed between a main surface of the chip and a wiring substrate formed with wirings connected at first ends thereof to the connection terminals, and bump electrodes connected to the other ends of the wirings. The connection terminals may be at a center part or in peripheral part(s) of the chip main surface and both the elastic structure and wiring substrate are not provided at locations of connection terminals. A resin body seals at least the connection terminals and the exposed first ends of wirings (leads). In a scheme in which the connection terminals are located in a peripheral part of the chip main surface, the wiring substrate protrudes beyond the chip boundary where the connection terminals are arranged, and the resin body shape is restricted by the protruding part of the wiring substrate.

公开(公告)号：US20050200019A1

公开(公告)日：2005-09-15

申请号：US11116209

申请日：2005-04-28

申请人： Chuichi Miyazaki ,  Yukiharu Akiyama ,  Masnori Shibamoto ,  Tomoaki Kudaishi ,  Ichiro Anjoh ,  Kunihiko Nishi ,  Asao Nishimura ,  Hideki Tanaka ,  Ryosuke Kimoto ,  Kunihiro Tsubosaki ,  Akio Hasebe ,  Takehiro Ohnishi ,  Noriou Shimada ,  Shuji Eguchi ,  Hiroshi Koyama ,  Akira Nagai ,  Masahiko Ogino

发明人： Chuichi Miyazaki ,  Yukiharu Akiyama ,  Masnori Shibamoto ,  Tomoaki Kudaishi ,  Ichiro Anjoh ,  Kunihiko Nishi ,  Asao Nishimura ,  Hideki Tanaka ,  Ryosuke Kimoto ,  Kunihiro Tsubosaki ,  Akio Hasebe ,  Takehiro Ohnishi ,  Noriou Shimada ,  Shuji Eguchi ,  Hiroshi Koyama ,  Akira Nagai ,  Masahiko Ogino

IPC分类号： H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L23/48 ,  H01L21/44

CPC分类号： H01L24/50 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49572 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06136 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/50 ,  H01L2224/85951 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A semiconductor device includes a semiconductor chip formed with connection terminals, an elastic structure interposed between a main surface of the chip and a wiring substrate formed with wirings connected at first ends thereof to the connection terminals, and bump electrodes connected to the other ends of the wirings. The connection terminals may be at a center part or in peripheral part(s) of the chip main surface and both the elastic structure and wiring substrate are not provided at locations of connection terminals. A resin body seals at least the connection terminals and the exposed first ends of wirings (leads). In a scheme in which the connection terminals are located in a peripheral part of the chip main surface, the wiring substrate protrudes beyond the chip boundary where the connection terminals are arranged, and the resin body shape is restricted by the protruding part of the wiring substrate.

摘要翻译： 半导体器件包括形成有连接端子的半导体芯片，插入在芯片的主表面之间的弹性结构和形成有连接到连接端子的布线的布线基板，以及连接到连接端子的另一端的凸起电极 布线。 连接端子可以在芯片主表面的中心部分或周边部分，并且弹性结构和布线基板都不设置在连接端子的位置处。 树脂体至少密封连接端子和暴露的布线的第一端（引线）。 在连接端子位于芯片主表面的周边部分的方案中，布线基板突出超过布置有连接端子的芯片边界，并且树脂体形状被布线基板的突出部分限制 。

公开(公告)号：US06521981B2

公开(公告)日：2003-02-18

申请号：US09765376

申请日：2001-01-22

申请人： Chuichi Miyazaki ,  Yukiharu Akiyama ,  Masanori Shibamoto ,  Tomoaki Kudaishi ,  Ichiro Anjoh ,  Kunihiko Nishi ,  Asao Nishimura ,  Hideki Tanaka ,  Ryosuke Kimoto ,  Kunihiro Tsubosaki ,  Akio Hasebe

发明人： Chuichi Miyazaki ,  Yukiharu Akiyama ,  Masanori Shibamoto ,  Tomoaki Kudaishi ,  Ichiro Anjoh ,  Kunihiko Nishi ,  Asao Nishimura ,  Hideki Tanaka ,  Ryosuke Kimoto ,  Kunihiro Tsubosaki ,  Akio Hasebe

IPC分类号： H01L23498

CPC分类号： H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06136 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/50 ,  H01L2224/73215 ,  H01L2224/85951 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  Y10T29/4913 ,  Y10T29/49169 ,  H01L2924/20753 ,  H01L2224/05599

摘要： A ball grid array type semiconductor package includes a semiconductor chip formed with bonding pads, an elastomer bonded to the semiconductor chip, a flexible wiring substrate bonded to the elastomer and formed with wirings connected at one end of the bonding pads of the semiconductor chip, a solder resist formed on the main surface of the flexible wiring substrate and solder bump electrodes connected to the other ends of the wirings. The elastomer is bonded to the flexible wiring substrate on the side of the tape, the solder resist is formed on the side of the wirings, and the solder bump electrodes are connected with the wirings by way of through holes formed in the solder resist.