摘要:
The present invention provides a PDP especially having a high definition or super high definition cell structure and realizing excellent image display performance by obtaining light-emitting efficiency as favorable as or more favorable than conventional PDPs while suppressing discharge voltage rise.Therefore, strip-shaped display electrodes 4 and 5 of a PDP 1 are respectively composed of a combination of a transparent electrode 41 and a bus electrode 42 and a combination of a transparent electrode 51 and a bus electrode 52. An electrode gap d between electrodes 41 and 51 falls in a range of 5 μm to 60 μm. A ratio of a total surface area of the electrodes 41 and 51 to a total surface area of discharge cells falls in a range of 0.6 to 0.92. Thus, a discharge start length is larger than the electrode gap d. A product of a total pressure P of a discharge gas and the electrode gap d falls in a range of 13.33 Pa·cm to 133.3 Pa·cm. The discharge gas consists of xenon of 100%. The total pressure P of the discharge gas falls in a range of 2.0 kPa to 53.3 kPa. Thus, a start point of discharge is longer than electrode gap d.
摘要:
There are provided a PDP having a higher luminous efficiency and a process for producing the same. In a plasma display panel filled with a discharge gas between a front plate and a rear plate opposed to each other, the front plate 100 comprises a glass substrate 1, electrodes 2 (transparent electrodes 2a and bus electrodes 2b) on the glass substrate 1, the first dielectric layer 4 covering the electrodes 2 and the glass substrate 1 and containing a fluorine atom, the second dielectric layer 5 covering the first dielectric layer 4 and containing a fluorine atom at a less amount than that in the first dielectric layer 4, and a protective layer 6 covering the second dielectric layer 5.
摘要:
There are provided a PDP having a higher luminous efficiency and a process for producing the same. In a plasma display panel filled with a discharge gas between a front plate and a rear plate opposed to each other, the front plate 100 comprises a glass substrate 1, electrodes 2 (transparent electrodes 2a and bus electrodes 2b) on the glass substrate 1, the first dielectric layer 4 covering the electrodes 2 and the glass substrate 1 and containing a fluorine atom, the second dielectric layer 5 covering the first dielectric layer 4 and containing a fluorine atom at a less amount than that in the first dielectric layer 4, and a protective layer 6 covering the second dielectric layer 5.
摘要:
A recording medium stores data supplied from an external device. A memory stores an erase program for executing erasing of the data stored in the recording medium. An erasing unit erases the data stored in the recording medium in accordance with the erase program stored in the memory, in accordance with a start instruction for instructing a start of erasing the data supplied from the external device.
摘要:
In a method for producing a multilayer printed wiring board, first and second copper foils for surface layer are disposed on both sides of an inner wiring substrate so that each of first and second prepreg sheets provided with through-holes is sandwiched between each of the copper foils for surface layer and each face of the substrate, the through-holes being formed therethrough at desired positions corresponding to positions where the connecting pads on each face of the substrate are formed, and the resulting structure is integrally bonded by applying heat and pressure thereto. During the heat- and pressure-processing step, the through-holes within the prepreg sheets are filled with a resin fused from the prepreg sheets. After selectively removing the copper foil for surface layer within an area which matches each of the connecting pads, the resin is selectively removed by the irradiation of laser beams to form via holes and allow the connecting pads to be exposed. Next, a conductive paste is embedded in the via holes. According to the above-mentioned method, it is possible to suppress occurrence of defective in boring of the via hole for electrically connecting circuit patterns of the surface layer to circuit patterns of the inner layer and also to shorten the production term and reduce the production cost.
摘要:
An optical fiber branch cable is provided that comprises a branch portion disposed stably with respect to a multi-core optical fiber cable of a trunk line from which branching is performed, that is excellent in handleability as a cable, and that exhibits high workability.In the optical fiber branch cable of the invention, in a middle of a multi-core optical fiber cable 2 of a trunk line, a branch portion 11 is disposed. The branch portion 11 has: a base member 16 which is attached so as to cover a tensile-strength wire 9 in a portion where a cable jacket 10 of the multi-core optical fiber cable 2 is removed away; a multi-core optical connector 30 which is connected to the tip end of a tape unit 4 drawn out from the multi-core optical fiber cable 2; an extra-length housing portion 18 which houses an extra length of the tape unit 4 to which the multi-core optical connector 30 is connected; and a connector attaching portion 19 to which the multi-core optical connector 30 is attachable in a plural number.
摘要:
An optical connector has a simple structure and a method of attaching an optical fiber cord to the connector is easy. The connector 1 includes: a plug part 2 which has a capillary 5 provided at the front and containing a built-in optical fiber 6 and which includes a mechanical splicing portion 7 capable of allowing an optical fiber 51 to be inserted from the rear so as to be fixed therein; a calking stand 35 capable of holding a sheath by radially contracting in a state in which the optical fiber cord 50 is inserted therein; a calking ring 45 provided outside the cylindrical portion 36 of the stand 35 so as to hold the tension member 52 between the ring 45 and the stand 35; and a coupling body 20 provided behind the plug part 2 and accommodating the stand 35 and the ring 45.
摘要:
An engine-driven power generating system having a bridge circuit section in which low-frequency switching elements are driven alternately by low-frequency drive signals, and high-frequency switching elements driven by high-frequency drive signals during the ON period of the low-frequency switching elements are connected in a bridge network, and an inverter circuit section having a drive signal supply circuit for supplying low-frequency and high-frequency drive signals are each supplied to the low-frequency and high-frequency switching elements that form a pair; the a-c voltage generated by an engine-driven a-c generator is converted into d-c voltage that is in turn converted into a predetermined level of low-frequency a-c voltage; characterized in that an overcurrent detecting circuit for detecting an overcurrent flowing in the bridge circuit section at a level higher than a predetermined level, a drive-signal control circuit that outputs to a drive-signal supply circuit, when the overcurrent detecting circuit detects an overcurrent during a half-cycle of the low-frequency signal in which the low-frequency switching element is turned on, a signal which turns off at least any one of the low-frequency and high-frequency switching elements to be turned on during the half-cycle after the detection of the overcurrent, and a low-pass filter for obtaining a sine-wave waveform on an output end are provided.
摘要:
Disclosed is a process for preparing a multi-layer printed wiring board including the step of forming a through hole and an external layer circuit on a laminated board of double-sided or multi-layer construction. Then the laminated board is coated over the whole front and back surfaces with a paste-like heat-resistant resin, simultaneously filling the through hole with a resin. A copper foil is disposed on the whole front and back surfaces of the laminated board. Next, the arrangement is heated and pressure-molded in a vacuum. The copper foil is then removed to form an intermediate laminated board. Then, multilayer molding of at least two sets of intermediate laminated boards with a prepreg interposed therebetween is preformed via a step of heat and pressure-molding. In using the penetrated through hole as the divided via hole, there is no longer a restriction of the thickness of the respective divided via holes on the same lattice point. Thus, it has become possible to use the via holes in a higher multilayer board, dramatically improving wiring capacity over the prior art divided via holes.
摘要:
A semiconductor integrated circuit which is comprised of the following; a plurality of comparators which respectively compare analog values inputted for multiplication with individual reference voltages respectively, multiplication means which controls values outputted from those plural comparators by applying signals corresponding to digital values inputted for multiplication and outputs the product of the values outputted from those plural comparators and the digital values, and a complement operation circuit which converts the value outputted from multiplication means into complement when the digital value is negative.