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    SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
    1.
    发明申请
    SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    半导体存储器件及其制造方法

    公开(公告)号：US20080149913A1

    公开(公告)日：2008-06-26

    申请号：US11962862

    申请日：2007-12-21

    申请人： Hiroyasu TANAKA ,  Ryota Katsumata ,  Hideaki Aochi ,  Masaru Kito ,  Masaru Kidoh ,  Mitsuru Sato

    发明人： Hiroyasu TANAKA ,  Ryota Katsumata ,  Hideaki Aochi ,  Masaru Kito ,  Masaru Kidoh ,  Mitsuru Sato

    IPC分类号： H01L27/105 ,  H01L21/8239 ,  H01L45/00

    CPC分类号： H01L27/2454 ,  G11C2213/71 ,  G11C2213/75 ,  H01L27/2481 ,  H01L45/04 ,  H01L45/06 ,  H01L45/1233 ,  H01L45/141 ,  H01L45/144 ,  H01L45/146

    摘要： A semiconductor memory device is disclosed, which includes a first memory cell array formed on a semiconductor substrate and composed of a plurality of memory cells stacked in layers each having a characteristic change element and a vertical type memory cell transistor connected in parallel to each other, a plurality of second memory cell arrays formed on the semiconductor substrate and having the same structure as the first memory cell array, and arranged in an X direction with respect to the first memory cell array, and a plurality of third memory cell arrays formed on the semiconductor substrate and having the same structure as the first memory cell array, and arranged in a Y direction with respect to the first memory cell array, wherein a gate voltage is applied to gates of the vertical type memory cell transistors of the first to third memory cell arrays in a same layer.

    摘要翻译： 公开了一种半导体存储器件，其包括形成在半导体衬底上的第一存储器单元阵列，并且由堆叠成各自具有彼此并联连接的特征变化元件和垂直型存储单元晶体管的多个存储单元组成， 多个第二存储单元阵列，形成在所述半导体衬底上并具有与所述第一存储单元阵列相同的结构，并且相对于所述第一存储单元阵列沿X方向布置;以及多个第三存储单元阵列， 半导体衬底并且具有与第一存储单元阵列相同的结构，并且相对于第一存储单元阵列在Y方向上布置，其中栅极电压被施加到第一至第三存储器的垂直型存储单元晶体管的栅极 单元阵列在同一层。

    NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
    2.
    发明申请
    NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF 有权
    非易失性半导体存储器件及其制造方法

    公开(公告)号：US20110284947A1

    公开(公告)日：2011-11-24

    申请号：US13198359

    申请日：2011-08-04

    申请人： Masaru KITO ,  Hideaki Aochi ,  Ryota Katsumata ,  Akihiro Nitayama ,  Masaru Kidoh ,  Hiroyasu Tanaka ,  Yoshiaki Fukuzumi ,  Yasuyuki Matsuoka ,  Mitsuru Sato

    发明人： Masaru KITO ,  Hideaki Aochi ,  Ryota Katsumata ,  Akihiro Nitayama ,  Masaru Kidoh ,  Hiroyasu Tanaka ,  Yoshiaki Fukuzumi ,  Yasuyuki Matsuoka ,  Mitsuru Sato

    IPC分类号： H01L29/792

    CPC分类号： H01L27/11582 ,  G11C16/0483 ,  H01L21/8221 ,  H01L27/0688 ,  H01L27/105 ,  H01L27/115 ,  H01L27/11556 ,  H01L27/11573 ,  H01L27/11578

    摘要： A nonvolatile semiconductor memory device that have a new structure are provided, in which memory cells are laminated in a three dimensional state so that the chip area may be reduced. The nonvolatile semiconductor memory device of the present invention is a nonvolatile semiconductor memory device that has a plurality of the memory strings, in which a plurality of electrically programmable memory cells is connected in series. The memory strings comprise a pillar shaped semiconductor; a first insulation film formed around the pillar shaped semiconductor; a charge storage layer formed around the first insulation film; the second insulation film formed around the charge storage layer; and first or nth electrodes formed around the second insulation film (n is natural number more than 1). The first or nth electrodes of the memory strings and the other first or nth electrodes of the memory strings are respectively the first or nth conductor layers that are spread in a two dimensional state.

    摘要翻译： 提供了具有新结构的非易失性半导体存储器件，其中以三维状态层叠存储单元，从而可以减小芯片面积。 本发明的非易失性半导体存储装置是具有串联连接有多个电可编程存储单元的多个存储串的非易失性半导体存储装置。 存储器串包括柱形半导体; 形成在柱状半导体周围的第一绝缘膜; 形成在所述第一绝缘膜周围的电荷存储层; 形成在电荷存储层周围的第二绝缘膜; 并且形成在第二绝缘膜周围的第一或第n电极（n是大于1的自然数）。 存储器串的第一或第n电极和存储器串的其它第一或第n电极分别是以二维状态扩展的第一或第n导体层。

    Nonvolatile semiconductor memory device and manufacturing method thereof
    5.
    发明申请
    Nonvolatile semiconductor memory device and manufacturing method thereof 有权
    非易失性半导体存储器件及其制造方法

    公开(公告)号：US20070252201A1

    公开(公告)日：2007-11-01

    申请号：US11654551

    申请日：2007-01-18

    申请人： Masaru Kito ,  Hideaki Aochi ,  Ryota Katsumata ,  Akihiro Nitayama ,  Masaru Kidoh ,  Hiroyasu Tanaka ,  Yoshiaki Fukuzumi ,  Yasuyuki Matsuoka ,  Mitsuru Sato

    发明人： Masaru Kito ,  Hideaki Aochi ,  Ryota Katsumata ,  Akihiro Nitayama ,  Masaru Kidoh ,  Hiroyasu Tanaka ,  Yoshiaki Fukuzumi ,  Yasuyuki Matsuoka ,  Mitsuru Sato

    IPC分类号： H01L29/76

    CPC分类号： H01L27/11582 ,  G11C16/0483 ,  H01L21/8221 ,  H01L27/0688 ,  H01L27/105 ,  H01L27/115 ,  H01L27/11556 ,  H01L27/11573 ,  H01L27/11578

    摘要： A nonvolatile semiconductor memory device that have a new structure are provided, in which memory cells are laminated in a three dimensional state so that the chip area may be reduced. The nonvolatile semiconductor memory device of the present invention is a nonvolatile semiconductor memory device that has a plurality of the memory strings, in which a plurality of electrically programmable memory cells is connected in series. The memory strings comprise a pillar shaped semiconductor; a first insulation film formed around the pillar shaped semiconductor; a charge storage layer formed around the first insulation film; the second insulation film formed around the charge storage layer; and first or nth electrodes formed around the second insulation film (n is natural number more than 1). The first or nth electrodes of the memory strings and the other first or nth electrodes of the memory strings are respectively the first or nth conductor layers that are spread in a two dimensional state.

    摘要翻译： 提供了具有新结构的非易失性半导体存储器件，其中以三维状态层叠存储单元，从而可以减小芯片面积。 本发明的非易失性半导体存储装置是具有串联连接有多个电可编程存储单元的多个存储串的非易失性半导体存储装置。 存储器串包括柱形半导体; 形成在柱状半导体周围的第一绝缘膜; 形成在所述第一绝缘膜周围的电荷存储层; 形成在电荷存储层周围的第二绝缘膜; 并且形成在第二绝缘膜周围的第一或第n电极（n是大于1的自然数）。 存储器串的第一或第n电极和存储器串的其它第一或第n电极分别是以二维状态扩展的第一或第n导体层。

    Non-volatile semiconductor memory device and method of making the same
    6.
    发明授权
    Non-volatile semiconductor memory device and method of making the same 失效
    非易失性半导体存储器件及其制造方法

    公开(公告)号：US08363481B2

    公开(公告)日：2013-01-29

    申请号：US12521997

    申请日：2008-01-31

    申请人： Masaru Kidoh ,  Hiroyasu Tanaka ,  Masaru Kito ,  Ryota Katsumata ,  Hideaki Aochi ,  Mitsuru Sato

    发明人： Masaru Kidoh ,  Hiroyasu Tanaka ,  Masaru Kito ,  Ryota Katsumata ,  Hideaki Aochi ,  Mitsuru Sato

    IPC分类号： G11C16/06

    CPC分类号： H01L27/11578 ,  G11C16/0483 ,  H01L21/8221 ,  H01L27/0688 ,  H01L27/105 ,  H01L27/11568 ,  H01L27/11575 ,  H01L27/11582

    摘要： A non-volatile semiconductor memory device according to the present invention includes a substrate; a first word-line provided above the substrate surface, the first word-line having a plate shape in an area where a memory cell is formed; a second word-line provided above the first word-line surface, the second word-line having a plate shape; a plurality of metal wirings connecting the first and second word-lines with a driver circuit; and a plurality of contacts connecting the first and second word-lines with the metal wirings. The contact of the first word-line is formed in a first word-line contact area. The contact of the second word-line is formed in a second word-line contact area. The first word-line contact area is provided on a surface of the first word-line that is drawn to the second word-line contact area.

    摘要翻译： 根据本发明的非易失性半导体存储器件包括：衬底; 设置在所述衬底表面上方的第一字线，所述第一字线在形成存储器单元的区域中具有板形; 设置在所述第一字线表面上方的第二字线，所述第二字线具有板形; 将第一和第二字线与驱动电路连接的多个金属布线; 以及将第一和第二字线与金属布线连接的多个触点。 第一字线的接触形成在第一字线接触区域中。 第二字线的接触形成在第二字线接触区域中。 第一字线接触区域被提供在第一字线的被拉到第二字线接触区域的表面上。

    NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MAKING THE SAME
    8.
    发明申请
    NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MAKING THE SAME 失效
    非挥发性半导体存储器件及其制造方法

    公开(公告)号：US20100039865A1

    公开(公告)日：2010-02-18

    申请号：US12521997

    申请日：2008-01-31

    申请人： Masaru Kidoh ,  Hiroyasu Tanaka ,  Masaru Kito ,  Ryota Katsumata ,  Hideaki Aochi ,  Mitsuru Sato

    发明人： Masaru Kidoh ,  Hiroyasu Tanaka ,  Masaru Kito ,  Ryota Katsumata ,  Hideaki Aochi ,  Mitsuru Sato

    IPC分类号： G11C16/06 ,  H01L29/792 ,  H01L21/4763

    CPC分类号： H01L27/11578 ,  G11C16/0483 ,  H01L21/8221 ,  H01L27/0688 ,  H01L27/105 ,  H01L27/11568 ,  H01L27/11575 ,  H01L27/11582

    摘要： A non-volatile semiconductor memory device according to the present invention includes a substrate; a first word-line provided above the substrate surface, the first word-line having a plate shape in an area where a memory cell is formed; a second word-line provided above the first word-line surface, the second word-line having a plate shape; a plurality of metal wirings connecting the first and second word-lines with a driver circuit; and a plurality of contacts connecting the first and second word-lines with the metal wirings. The contact of the first word-line is formed in a first word-line contact area. The contact of the second word-line is formed in a second word-line contact area. The first word-line contact area is provided on a surface of the first word-line that is drawn to the second word-line contact area.

    摘要翻译： 根据本发明的非易失性半导体存储器件包括：衬底; 设置在所述衬底表面上方的第一字线，所述第一字线在形成存储器单元的区域中具有板形; 设置在所述第一字线表面上方的第二字线，所述第二字线具有板形; 将第一和第二字线与驱动电路连接的多个金属布线; 以及将第一和第二字线与金属布线连接的多个触点。 第一字线的接触形成在第一字线接触区域中。 第二字线的接触形成在第二字线接触区域中。 第一字线接触区域被提供在第一字线的被拉到第二字线接触区域的表面上。