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公开(公告)号：US5395037A
公开(公告)日：1995-03-07
申请号：US169625
申请日：1993-12-20
CPC分类号： B23K1/0008 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L24/97 , H01R43/02 , H05K13/06 , B23K2201/32 , B23K2201/36 , H01L2224/45124 , H01L2224/45144 , H01L2224/4556 , H01L2224/45565 , H01L2224/45599 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48471 , H01L2224/48599 , H01L2224/48699 , H01L2224/49171 , H01L2224/78301 , H01L2224/7865 , H01L2224/85075 , H01L2224/85186 , H01L2224/85205 , H01L2224/8592 , H01L2224/97 , H01L24/45 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01018 , H01L2924/01023 , H01L2924/01033 , H01L2924/01067 , H01L2924/01068 , H01L2924/01073 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/19041
摘要： A method for bonding a solder wire is provided wherein a lower ball end of a material solder wire is first bonded to a first bonding portion of a workpiece. Then, the material solder wire is thermally cut to provide a solder wire segment held bonded to the first bonding portion and having an upper ball end. Finally, the upper ball end is bonded to a second bonding portion of the workpiece. All of the wire bonding process steps are performed in an oxygen-free atmosphere to prevent oxidation of the solder wire.
摘要翻译： 提供一种用于焊接焊接的方法，其中首先将材料焊丝的下球端接合到工件的第一接合部分。 然后，材料焊丝被热切割以提供保持接合到第一接合部分并具有上球端的焊丝段。 最后，将上球端接合到工件的第二接合部分。 所有的引线接合工艺步骤在无氧气氛中进行以防止焊丝的氧化。
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公开(公告)号：US5295619A
公开(公告)日：1994-03-22
申请号：US63667
申请日：1993-05-20
IPC分类号： B23K1/00 , H01L23/49 , H01R43/02 , H05K13/06 , H01L21/603
CPC分类号： B23K1/0008 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L24/97 , H01R43/02 , H05K13/06 , B23K2201/32 , B23K2201/36 , H01L2224/45124 , H01L2224/45144 , H01L2224/4556 , H01L2224/45565 , H01L2224/45599 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48471 , H01L2224/48599 , H01L2224/48699 , H01L2224/49171 , H01L2224/78301 , H01L2224/7865 , H01L2224/85075 , H01L2224/85186 , H01L2224/85205 , H01L2224/8592 , H01L2224/97 , H01L24/45 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01018 , H01L2924/01023 , H01L2924/01033 , H01L2924/01067 , H01L2924/01068 , H01L2924/01073 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/19041
摘要： A method for bonding a solder wire is provided wherein a lower ball end of a material solder wire is first bonded to a first bonding portion of a workpiece. Then, the material solder wire is thermally cut to provide a solder wire segment held bonded to the first bonding portion and having an upper ball end. Finally, the upper ball end is bonded to a second bonding portion of the workpiece. All of the wire bonding process steps are performed in an oxygen-free atmosphere to prevent oxidation of the solder wire.
摘要翻译： 提供一种用于焊接焊接的方法，其中首先将材料焊丝的下球端接合到工件的第一接合部分。 然后，材料焊丝被热切割以提供保持接合到第一接合部分并具有上球端的焊丝段。 最后，将上球端接合到工件的第二接合部分。 所有的引线接合工艺步骤在无氧气氛中进行以防止焊丝的氧化。
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公开(公告)号：US09115589B2
公开(公告)日：2015-08-25
申请号：US13700928
申请日：2011-06-06
申请人： Motohisa Ishiguro , Tomoyasu Hirano
发明人： Motohisa Ishiguro , Tomoyasu Hirano
IPC分类号： F04D29/30 , F01D5/14 , F04D29/28 , B29C67/00 , B29C53/02 , F04D29/22 , F04D29/24 , B29L31/00 , B29L31/08
CPC分类号： F01D5/141 , B29C53/02 , B29C67/0048 , B29L2031/08 , B29L2031/7498 , F04D13/06 , F04D29/2222 , F04D29/242 , F04D29/281 , F04D29/282 , F04D29/284 , F04D29/30
摘要： An impeller integrally includes a substrate and multiple impeller blades provided upright along a curved shape and circumferentially spaced apart on one face of the substrate. The impeller blades expand in diameter and each include an inner circumferential-side blade portion on the inner circumferential side of the substrate and extending in the rotary shaft core direction and have a tip side that is bent, and an outer circumferential-side blade portion on the outer circumferential side of the substrate and extending in the rotary shaft core direction. In the direction along the rotary shaft core, the length of the inner circumferential-side blade portion from the substrate side to the tip side is longer than the length of the outer circumferential-side blade portion from the substrate side to the tip side, and the blade thickness of the inner circumferential-side blade portion gradually decreases from the substrate side toward the tip side.
摘要翻译： 叶轮一体地包括基板和沿着弯曲形状竖立设置并且在基板的一个表面周向间隔开的多个叶轮叶片。 叶轮叶片的直径膨胀，并且各自包括在基板的内周侧上的内周侧叶片部分，并且在旋转轴芯方向上延伸并且具有弯曲的前端侧和外周侧叶片部分 基板的外周侧，并且以旋转轴芯方向延伸。 沿着旋转轴芯的方向，内周侧叶片部从基板侧到前端侧的长度比从外侧侧的叶片部的从基板侧到顶端侧的长度长， 内周侧叶片部的叶片厚度从基板侧朝向前端侧逐渐减小。
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公开(公告)号：US20130071247A1
公开(公告)日：2013-03-21
申请号：US13700928
申请日：2011-06-06
申请人： Motohisa Ishiguro , Tomoyasu Hirano
发明人： Motohisa Ishiguro , Tomoyasu Hirano
CPC分类号： F01D5/141 , B29C53/02 , B29C67/0048 , B29L2031/08 , B29L2031/7498 , F04D13/06 , F04D29/2222 , F04D29/242 , F04D29/281 , F04D29/282 , F04D29/284 , F04D29/30
摘要： An impeller integrally includes a substrate and multiple impeller blades provided upright along a curved shape and circumferentially spaced apart on one face of the substrate. The impeller blades expand in diameter and each include an inner circumferential-side blade portion on the inner circumferential side of the substrate and extending in the rotary shaft core direction and have a tip side that is bent, and an outer circumferential-side blade portion on the outer circumferential side of the substrate and extending in the rotary shaft core direction. In the direction along the rotary shaft core, the length of the inner circumferential-side blade portion from the substrate side to the tip side is longer than the length of the outer circumferential-side blade portion from the substrate side to the tip side, and the blade thickness of the inner circumferential-side blade portion gradually decreases from the substrate side toward the tip side.
摘要翻译： 叶轮一体地包括基板和沿着弯曲形状竖立设置并且在基板的一个表面周向间隔开的多个叶轮叶片。 叶轮叶片的直径膨胀，并且各自包括在基板的内周侧上的内周侧叶片部分，并且在旋转轴芯方向上延伸并且具有弯曲的前端侧和外周侧叶片部分 基板的外周侧，并且以旋转轴芯方向延伸。 沿着旋转轴芯的方向，内周侧叶片部从基板侧到前端侧的长度比从外侧侧的叶片部的从基板侧到顶端侧的长度长， 内周侧叶片部的叶片厚度从基板侧朝向前端侧逐渐减小。
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