公开(公告)号：USD301036S

公开(公告)日：1989-05-09

申请号：US99511

申请日：1987-09-22

申请人： Hiroyuki Yamazaki ,  Yutaka Yoshino ,  Makoto Gotoh

设计人： Hiroyuki Yamazaki ,  Yutaka Yoshino ,  Makoto Gotoh

公开(公告)号：US4837814A

公开(公告)日：1989-06-06

申请号：US100283

申请日：1987-09-23

申请人： Yutaka Yoshino ,  Makoto Gotoh ,  Osamu Fujimoto ,  Masahiro Shizawa

发明人： Yutaka Yoshino ,  Makoto Gotoh ,  Osamu Fujimoto ,  Masahiro Shizawa

IPC分类号： H04M1/02 ,  H04M1/675

CPC分类号： H04M1/02 ,  H04M1/675

摘要： In a telephone set which can be used by inserting a card, a slit-like card insertion port is formed at a portion behind a handset hung up on a hanger of a surface of a housing and a card reader is arranged behind the card insertion port. A projecting hanger assembly is formed on the housing. A hanger portion for receiving the handset is formed at an upper portion of the hanger assembly, and hollow projections are formed at a lower portion thereof. Slits of the card insertion port are formed in the distal end faces of the projections, and the card reader is partially housed in the projections.

摘要翻译： 在通过插入卡可以使用的电话机中，在挂在机壳表面的挂钩上的手机后面的部分形成有狭缝状的卡片插入口，并且读卡器被布置在卡插入口后面 。 突出的衣架组件形成在壳体上。 在衣架组件的上部形成有用于接收听筒的衣架部分，在其下部形成有中空的突起。 卡插入口的狭缝形成在突起的远端面上，读卡器部分地容纳在突起中。

公开(公告)号：US07445964B2

公开(公告)日：2008-11-04

申请号：US11610327

申请日：2006-12-13

申请人： Ichiro Mihara ,  Takeshi Wakabayashi ,  Toshihiro Kido ,  Hiroyasu Jobetto ,  Yutaka Yoshino ,  Nobuyuki Kageyama ,  Daita Kohno ,  Jun Yoshizawa

发明人： Ichiro Mihara ,  Takeshi Wakabayashi ,  Toshihiro Kido ,  Hiroyasu Jobetto ,  Yutaka Yoshino ,  Nobuyuki Kageyama ,  Daita Kohno ,  Jun Yoshizawa

IPC分类号： H01L21/00

CPC分类号： H01L23/3128 ,  H01L21/56 ,  H01L23/16 ,  H01L23/3114 ,  H01L24/19 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

摘要： A semiconductor device includes at least one semiconductor structure which has a plurality of external connection electrodes formed on a semiconductor substrate. An insulating sheet member is arranged on the side of the semiconductor structure. Upper interconnections have connection pad portions that are arranged on the insulating sheet member in correspondence with the upper interconnections and connected to the external connection electrodes of the semiconductor structure.

摘要翻译： 半导体器件包括至少一个半导体结构，其具有形成在半导体衬底上的多个外部连接电极。 在半导体结构的一侧设置有绝缘片部件。 上部互连具有连接焊盘部分，其布置在与上部互连件对应并且连接到半导体结构的外部连接电极的绝缘片部件上。

公开(公告)号：US07894200B2

公开(公告)日：2011-02-22

申请号：US11913559

申请日：2006-11-28

申请人： Yutaka Yoshino ,  Takahiro Shirai ,  Shinji Kadono ,  Mineo Kawamoto ,  Minoru Enomoto ,  Masakatsu Goto ,  Makoto Araki ,  Naoki Toda

发明人： Yutaka Yoshino ,  Takahiro Shirai ,  Shinji Kadono ,  Mineo Kawamoto ,  Minoru Enomoto ,  Masakatsu Goto ,  Makoto Araki ,  Naoki Toda

IPC分类号： H05K1/18

CPC分类号： H01L23/5389 ,  H01L25/105 ,  H01L2224/16237 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/82039 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/3011 ,  H05K1/023 ,  H05K1/186 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/10674 ,  Y10T29/49146 ,  H01L2924/00014

摘要： The present invention provides a printed wiring board with a built-in semiconductor element in which an insufficient or excessive amount of filled sealing material does not affect excellent adhesion of the printed wiring board to an overlying wiring board. The printed wiring board with a built-in semiconductor element comprises a built-in semiconductor element, in which at least the lower surface, the upper surface, or the side surface of the semiconductor element is covered with an insulating film, and an insulating layer is provided in the side and upper portions of the semiconductor element. There is also provided a process for producing a printed wiring board with a built-in semiconductor element, comprising the steps of mounting a semiconductor element on a base substrate and covering at least the lower surface, the upper surface, or the side surface of the semiconductor element with an insulating film, disposing and stacking a semicured insulating sheet in the side portion of the semiconductor element, and disposing and stacking a semicured insulating sheet in the upper portion of the semiconductor element.

摘要翻译： 本发明提供一种具有内置半导体元件的印刷电路板，其中填充的密封材料的量不足或过量不会影响印刷电路板对上覆布线板的优异的粘附性。 具有内置半导体元件的印刷线路板包括内置半导体元件，其中至少半导体元件的下表面，上表面或侧表面被绝缘膜覆盖，绝缘层 设置在半导体元件的侧部和上部。 还提供了一种用于制造具有内置半导体元件的印刷线路板的方法，包括以下步骤：将半导体元件安装在基底基板上，并且至少覆盖基底基板的下表面，上表面或侧表面 具有绝缘膜的半导体元件，在半导体元件的侧部设置和层叠半固化绝缘片，并且在半导体元件的上部设置和层叠半固化绝缘片。

公开(公告)号：US5508501A

公开(公告)日：1996-04-16

申请号：US310661

申请日：1994-09-22

申请人： Osamu Fujimoto ,  Yutaka Yoshino

发明人： Osamu Fujimoto ,  Yutaka Yoshino

IPC分类号： G06K13/06 ,  G06K13/08 ,  G06K17/00 ,  G06K7/06

CPC分类号： G06K7/0073 ,  G06K13/08 ,  G06K13/0893

摘要： In order to certainly receive a proper IC card having a regular length to a terminal contact position without causing a forcible force to act on an integrated circuit incorporated in the IC card to discharge a wrong card having a length smaller than the regular length, an IC card inserted from a card insertion port is advanced toward a card storage unit of a frame having an opening formed in the lower surface thereof while the IC card is slightly pressed downward, and the leading end of the IC card is brought into contact with a card receiver of a slide member. The slide member is biased by a spring toward the card insertion port and is slid backward when the IC card is pressed deeper with a force stronger than the biasing force of the spring. A pivoting member in contact with a cam portion of the slide member is pivoted toward the card storage unit, and the IC card is pressed from a lower direction thereof to the contact terminal direction, thereby bringing the external terminals of the IC card into contact with the contact terminals, respectively. For this reason, the wrong card having a length smaller than the regular is discharged from the largely opened lower surface of the card storage unit.

摘要翻译： 为了确定地将具有规则长度的正确的IC卡接收到终端接触位置，而不会引起强制力作用在集成在IC卡中的集成电路上，以排出长度小于常规长度的错误卡，IC 从卡片插入口插入的卡片朝着具有形成在其下表面中的开口的框架的卡存储单元前进，同时IC卡被稍微按下，并且IC卡的前端与卡片接触 滑动构件的接收器。 滑动构件被弹簧朝向卡插入口偏置，并且当IC卡被比弹簧的偏置力更强的力压紧时，滑动构件向后滑动。 与滑动构件的凸轮部接触的枢转构件朝向卡存放单元枢转，并且IC卡从其下方向被按压到接触端子方向，从而使IC卡的外部端子与 接触端子。 因此，长度小于常规的错误卡从卡存放单元的大部分敞开的下表面排出。

公开(公告)号：US20070099409A1

公开(公告)日：2007-05-03

申请号：US11610327

申请日：2006-12-13

申请人： Ichiro Mihara ,  Takeshi Wakabayashi ,  Toshihiro Kido ,  Hiroyasu Jobetto ,  Yutaka Yoshino ,  Nobuyuki Kageyama ,  Daita Kohno ,  Jun Yoshizawa

发明人： Ichiro Mihara ,  Takeshi Wakabayashi ,  Toshihiro Kido ,  Hiroyasu Jobetto ,  Yutaka Yoshino ,  Nobuyuki Kageyama ,  Daita Kohno ,  Jun Yoshizawa

IPC分类号： H01L21/44

CPC分类号： H01L23/3128 ,  H01L21/56 ,  H01L23/16 ,  H01L23/3114 ,  H01L24/19 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

摘要： A semiconductor device includes at least one semiconductor structure which has a plurality of external connection electrodes formed on a semiconductor substrate. An insulating sheet member is arranged on the side of the semiconductor structure. Upper interconnections have connection pad portions that are arranged on the insulating sheet member in correspondence with the upper interconnections and connected to the external connection electrodes of the semiconductor structure.

摘要翻译： 半导体器件包括至少一个半导体结构，其具有形成在半导体衬底上的多个外部连接电极。 在半导体结构的一侧设置有绝缘片部件。 上部互连具有连接焊盘部分，其布置在与上部互连件对应并且连接到半导体结构的外部连接电极的绝缘片部件上。

公开(公告)号：US08035979B2

公开(公告)日：2011-10-11

申请号：US12966251

申请日：2010-12-13

申请人： Yutaka Yoshino ,  Takahiro Shirai ,  Shinji Kadono ,  Mineo Kawamoto ,  Minoru Enomoto ,  Masakatsu Goto ,  Makoto Araki ,  Naoki Toda

发明人： Yutaka Yoshino ,  Takahiro Shirai ,  Shinji Kadono ,  Mineo Kawamoto ,  Minoru Enomoto ,  Masakatsu Goto ,  Makoto Araki ,  Naoki Toda

IPC分类号： H05K1/18

CPC分类号： H01L23/5389 ,  H01L25/105 ,  H01L2224/16237 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/82039 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/3011 ,  H05K1/023 ,  H05K1/186 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/10674 ,  Y10T29/49146 ,  H01L2924/00014

摘要： A printed wiring board includes a built-in semiconductor element. A protective film is formed on a semiconductor element-mounted surface of a base substrate to which the built-in semiconductor element is connected to protect the semiconductor element-mounted surface excepting a mounting pad. Upper and side surfaces of the built-in semiconductor element are covered with a first insulating film formed by filling a sealing material. The first insulating film is covered with a second insulating film formed of an insulating resin melted from an insulating layer that is provided in side and upper portions of the built-in semiconductor element.

摘要翻译： 印刷电路板包括内置的半导体元件。 在与内置半导体元件连接的基底基板的半导体元件安装面上形成保护膜，以保护除了安装焊盘之外的半导体元件安装表面。 通过填充密封材料形成的第一绝缘膜覆盖内置半导体元件的上表面和侧表面。 第一绝缘膜被由设置在内置半导体元件的侧部和上部的绝缘层熔化的绝缘树脂形成的第二绝缘膜覆盖。

公开(公告)号：US07183639B2

公开(公告)日：2007-02-27

申请号：US10916917

申请日：2004-08-12

申请人： Ichiro Mihara ,  Takeshi Wakabayashi ,  Toshihiro Kido ,  Hiroyasu Jobetto ,  Yutaka Yoshino ,  Nobuyuki Kageyama ,  Daita Kohno ,  Jun Yoshizawa

发明人： Ichiro Mihara ,  Takeshi Wakabayashi ,  Toshihiro Kido ,  Hiroyasu Jobetto ,  Yutaka Yoshino ,  Nobuyuki Kageyama ,  Daita Kohno ,  Jun Yoshizawa

IPC分类号： H01L23/48

CPC分类号： H01L23/3128 ,  H01L21/56 ,  H01L23/16 ,  H01L23/3114 ,  H01L24/19 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

摘要： A semiconductor device includes at least one semiconductor structure which has a plurality of external connection electrodes formed on a semiconductor substrate. An insulating sheet member is arranged on the side of the semiconductor structure. Upper interconnections have connection pad portions that are arranged on the insulating sheet member in correspondence with the upper interconnections and connected to the external connection electrodes of the semiconductor structure.

摘要翻译： 半导体器件包括至少一个半导体结构，其具有形成在半导体衬底上的多个外部连接电极。 在半导体结构的一侧设置有绝缘片部件。 上部互连具有连接焊盘部分，其布置在与上部互连件对应并且连接到半导体结构的外部连接电极的绝缘片部件上。

公开(公告)号：US20050051886A1

公开(公告)日：2005-03-10

申请号：US10916917

申请日：2004-08-12

申请人： Ichiro Mihara ,  Takeshi Wakabayashi ,  Toshihiro Kido ,  Hiroyasu Jobetto ,  Yutaka Yoshino ,  Nobuyuki Kageyama ,  Daita Kohno ,  Jun Yoshizawa

发明人： Ichiro Mihara ,  Takeshi Wakabayashi ,  Toshihiro Kido ,  Hiroyasu Jobetto ,  Yutaka Yoshino ,  Nobuyuki Kageyama ,  Daita Kohno ,  Jun Yoshizawa

IPC分类号： H01L21/56 ,  H01L23/16 ,  H01L23/31 ,  H01L23/48

CPC分类号： H01L23/3128 ,  H01L21/56 ,  H01L23/16 ,  H01L23/3114 ,  H01L24/19 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

摘要： A semiconductor device includes at least one semiconductor structure which has a plurality of external connection electrodes formed on a semiconductor substrate. An insulating sheet member is arranged on the side of the semiconductor structure. Upper interconnections have connection pad portions that are arranged on the insulating sheet member in correspondence with the upper interconnections and connected to the external connection electrodes of the semiconductor structure.

摘要翻译： 半导体器件包括至少一个半导体结构，其具有形成在半导体衬底上的多个外部连接电极。 在半导体结构的一侧设置有绝缘片部件。 上部互连具有连接焊盘部分，其布置在与上部互连件对应并且连接到半导体结构的外部连接电极的绝缘片部件上。

公开(公告)号：US5563397A

公开(公告)日：1996-10-08

申请号：US529540

申请日：1995-09-18

申请人： Osamu Fujimoto ,  Yutaka Yoshino

发明人： Osamu Fujimoto ,  Yutaka Yoshino

IPC分类号： G06K13/08 ,  G06K7/06

CPC分类号： G06K13/0875 ,  G06K13/08 ,  G06K13/0893 ,  G06K7/0073

摘要： A card C having a predetermined thickness is guided by guide grooves formed in corresponding projecting portions of a card slot to enter. When the leading end of the card C is brought into contact with the lower edges of contact portions of a shutter member, the shutter member is pivoted about the front end sides of arm portions. A shutter plate arranged on the rear end side of the shutter member is moved upward to allow the card C having the predetermined thickness to pass deep. If a card C' having a thickness smaller than the predetermined thickness enters, a regulation portion projecting from the lower portion of the shutter plate of the shutter member is located lower than the bottom surface of a card passage. The leading end of the card C' having the smaller thickness is brought into contact with the regulation portion to prevent the card C' from entering deep. Even if the thin card C' is forcibly inserted, downward movement of the leading end of the card C' is regulated by the regulation portion, thereby preventing passage of the card C' and a card jam.

摘要翻译： 具有预定厚度的卡C由形成在卡槽的相应突出部分中的引导槽引导进入。 当卡C的前端与挡板部件的接触部分的下边缘接触时，挡板部件围绕臂部的前端侧枢转。 布置在活门构件的后端侧的挡板向上移动以允许具有预定厚度的卡C深度通过。 如果具有小于预定厚度的厚度的卡C'进入，则从活门构件的活门板的下部突出的调节部分位于卡通道的底表面的下方。 具有较小厚度的卡C'的前端与调节部分接触以防止卡C'进入深部。 即使强制插入薄卡C'，卡C'的前端的向下移动由调节部分调节，从而防止卡C'通过并卡卡。